| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/04/2006 | CN1715457A Surface coarsening method and surface coarsening liquid for copper foil |
| 01/04/2006 | CN1715444A Method for metallizing plastic surfaces |
| 01/04/2006 | CN1715353A Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 01/04/2006 | CN1714943A Apparatus and method for applying adhesive to a substrate |
| 01/04/2006 | CN1235457C Circuit substrate and its making method and display apparatus |
| 01/04/2006 | CN1235456C Method for manufacturing ceramic multilayer circuit board |
| 01/04/2006 | CN1235455C Method for Producing antenna devices of portable radio communication device |
| 01/04/2006 | CN1235454C Copper foil with insulation layer and its manufactuing method and printed wiring board using the copper foil with insulation layer |
| 01/04/2006 | CN1235453C Integrated circuit carrier with recesses |
| 01/04/2006 | CN1235452C Method of manufacturing an integrated circuit carrier |
| 01/04/2006 | CN1235451C Method for mfg. printed-circuit board |
| 01/04/2006 | CN1235450C Circuit board |
| 01/04/2006 | CN1235337C Electronic device and its producing method |
| 01/04/2006 | CN1235336C Multi-layer LC composite element and mfg. method thereof |
| 01/04/2006 | CN1235284C Insulation substrate for semi-conductor and power modular |
| 01/04/2006 | CN1235276C Method for manufacturing circuit device |
| 01/04/2006 | CN1235274C Mfg. appts. of electronic device and mfg. method of electronic device |
| 01/04/2006 | CN1235237C Surface installed positive coefficient heat sensitive resistor and its making method |
| 01/04/2006 | CN1235233C Mountable electrical conductors |
| 01/04/2006 | CN1235081C Light-emitting assembly |
| 01/04/2006 | CN1235076C Optical connector and optical element |
| 01/04/2006 | CN1235057C Testing device and method for printed boards |
| 01/04/2006 | CN1235056C Method and apparatus for circuit board continuity test, tool for continuity test |
| 01/04/2006 | CN1234916C Method and device for electrolytic treatment of electrically insulating film materials and use of said method |
| 01/04/2006 | CN1234915C Copper foil coated with stable layer, coating method and laminate piece including insulation substrate and copper foil |
| 01/04/2006 | CN1234890C Copper alloy foil for laminated board |
| 01/04/2006 | CN1234832C 洗涤溶剂 Cleaning solvent |
| 01/04/2006 | CN1234794C Adhesive material |
| 01/04/2006 | CN1234530C Ink jet device |
| 01/03/2006 | US6982876 Printed circuit board assembly |
| 01/03/2006 | US6982387 Method and apparatus to establish circuit layers interconnections |
| 01/03/2006 | US6982386 Interconnecting substrates for electrical coupling of microelectronic components |
| 01/03/2006 | US6982211 Water jet processing method |
| 01/03/2006 | US6982191 Methods relating to forming interconnects and resulting assemblies |
| 01/03/2006 | US6982174 Directed assembly of nanometer-scale molecular devices |
| 01/03/2006 | US6982030 Reduction of surface oxidation during electroplating |
| 01/03/2006 | US6981859 Method for manufacturing electronic component and apparatus for manufacturing the same |
| 01/03/2006 | US6981320 Circuit board and fabricating process thereof |
| 01/03/2006 | US6981319 Method of manufacturing devices to protect election components |
| 01/03/2006 | US6981318 Printed circuit board manufacturing method |
| 01/03/2006 | US6981317 Method and device for mounting electronic component on circuit board |
| 01/03/2006 | US6981316 Method of manufacturing vehicle electric power distribution system |
| 01/03/2006 | US6981315 Method of manufacturing a flexure blank |
| 01/03/2006 | CA2191339C Method and device for continuous uniform electrolytic metallising or etching |
| 01/03/2006 | CA2175909C Ammonia-free deposition of copper by disproportionation |
| 12/29/2005 | WO2005125298A2 Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer |
| 12/29/2005 | WO2005125292A1 Method for the selective deposition of a galvanic coating on a miniaturised electric circuit created by etching |
| 12/29/2005 | WO2005125291A1 Elimination of copper for producing strip conductors |
| 12/29/2005 | WO2005125290A1 A method for processing an electrically conductive pattern |
| 12/29/2005 | WO2005124855A1 Capping of metal interconnects in integrated circuit electronic devices |
| 12/29/2005 | WO2005124794A1 Electronic component with conductive ball connected with terminal and process for manufacturing the same |
| 12/29/2005 | WO2005124462A1 Photosensitive composition, method for forming pattern, and permanent pattern |
| 12/29/2005 | WO2005124445A2 Rearview mirror element having a circuit mounted to the rear surface of the element |
| 12/29/2005 | WO2005123990A1 Device and method for electrolytically treating flat work pieces |
| 12/29/2005 | WO2005123987A1 Tin-based plating film and method for forming the same |
| 12/29/2005 | WO2005123817A1 A method of recycling mixed streams of ewaste (weee) |
| 12/29/2005 | WO2005123410A1 Printing of organometallic compounds to form conductive traces |
| 12/29/2005 | WO2005123409A1 Formulation for printing organometallic compounds to form conductive traces |
| 12/29/2005 | WO2005123308A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
| 12/29/2005 | WO2005122731A2 Method to form a conductive structure |
| 12/29/2005 | WO2005122695A2 A system for mapping defective printed circuits |
| 12/29/2005 | WO2005029928A3 Closed loop backdrilling system |
| 12/29/2005 | US20050288427 prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, a short circuit between adjacent electrodes can be prevented when connecting circuits |
| 12/29/2005 | US20050288392 Modular board device and high frequency module and method for producing them |
| 12/29/2005 | US20050287879 Connector having improved contacts with fusible members |
| 12/29/2005 | US20050287871 Device, method, and program for computer aided design of flexible substrates |
| 12/29/2005 | US20050287845 Connector having improved contacts with fusible members |
| 12/29/2005 | US20050287844 Connector having improved contacts with fusible members |
| 12/29/2005 | US20050287843 Fixing structure for electron device |
| 12/29/2005 | US20050287836 Method of connecting a contact with a solder and an electronic device using the method |
| 12/29/2005 | US20050287835 Flat connector, ink jet head and method of manufacturing them |
| 12/29/2005 | US20050287832 Connector having improved contacts with fusible members |
| 12/29/2005 | US20050287831 Connector having improved contacts with fusible members |
| 12/29/2005 | US20050287830 Connector having improved contacts with fusible members |
| 12/29/2005 | US20050287829 Patch substrate for external connection |
| 12/29/2005 | US20050287789 Substrate with patterned conductive layer |
| 12/29/2005 | US20050287783 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 12/29/2005 | US20050287708 Semiconductor chip package manufacturing method including screen printing process |
| 12/29/2005 | US20050287704 Carrier for substrate film |
| 12/29/2005 | US20050287702 Methods for designing carrier substrates with raised terminals |
| 12/29/2005 | US20050287423 Battery holder |
| 12/29/2005 | US20050287377 Method for making layers and wiring board made thereby |
| 12/29/2005 | US20050287363 Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 12/29/2005 | US20050287355 Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin |
| 12/29/2005 | US20050287328 Method of producing laminates, and laminates |
| 12/29/2005 | US20050286259 Mounting device for a light-emitting diode |
| 12/29/2005 | US20050286240 Circuit board electrode connection structure |
| 12/29/2005 | US20050286238 Device and method of manufacture of an interconnection structure for printed circuit boards |
| 12/29/2005 | US20050286210 Solid-state electrolytic capacitor and mounting method therefor |
| 12/29/2005 | US20050285713 Fixed network resistor |
| 12/29/2005 | US20050285534 Surface mounting discharge tube |
| 12/29/2005 | US20050285307 Alternate vent hole sealing method |
| 12/29/2005 | US20050285277 Circuit film with bump, film package using the same, and related fabrication methods |
| 12/29/2005 | US20050285274 Lead solder indicator and method |
| 12/29/2005 | US20050285266 Arrangement for increasing the reliability of substrate-based BGA packages |
| 12/29/2005 | US20050285253 Forming buried via hole substrates |
| 12/29/2005 | US20050285230 Semiconductor package including a semiconductor device, and method of manufacturing the same |
| 12/29/2005 | US20050285172 Methods of forming vias in multilayer substrates |
| 12/29/2005 | US20050285147 Circuit apparatus and method of manufacturing the same |
| 12/29/2005 | US20050284921 Method of soldering electronic component having solder bumps to substrate |