Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2006
01/10/2006US6983551 Interconnecting substrates for electrical coupling of microelectronic components
01/10/2006US6983539 Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps
01/10/2006US6983538 Method of mounting component on a circuit board
01/10/2006US6983537 Method of making a plastic package with an air cavity
01/10/2006US6983536 Method and apparatus for manufacturing known good semiconductor die
01/10/2006US6983535 Insertion of electrical component within a via of a printed circuit board
01/10/2006US6983532 In-line program system for assembly printed circuit board
01/05/2006WO2006001611A1 Hearing aid using printed circuit board
01/05/2006WO2006001594A1 Method for manufacturing black surface- treated copper foil for emi shield and copper foil the same and the composite material using it
01/05/2006WO2006001402A1 Method of soldering electronic component having solder bumps to substrate
01/05/2006WO2006000821A1 Method of manufacture of electronic or functional devices
01/05/2006WO2006000694A1 Flex-rigid printed circuit by bonding
01/05/2006WO2006000364A1 Electrolytically recoverable etching solution
01/05/2006WO2006000291A1 Process for producing a ceramic printed-circuit board
01/05/2006WO2005076680A3 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate
01/05/2006WO2005057652A3 Connector for making electrical contact at semiconductor scales and method for forming same
01/05/2006WO2005048678A3 A method for generating a jetting program
01/05/2006US20060005215 Disc drive and flexible cable assembly therein
01/05/2006US20060003648 Land grid array fabrication using elastomer core and conducting metal shell or mesh
01/05/2006US20060003637 Plug for connection strips and method for the production thereof
01/05/2006US20060003608 Attachment plate for directly mating circuit boards
01/05/2006US20060003481 Method for fabricating semiconductor components using conductive layer and grooves
01/05/2006US20060003267 Nano-structure and method of fabricating nano-structures
01/05/2006US20060003264 Higher pattern accuracy with a small number of processes; improved forward tapered edge shape and surface flatness; shrinkage ratio before and after baking of second precursor layer is larger than that of first precursor layer; plasma display
01/05/2006US20060003157 Electrical interconnect using locally conductive adhesive
01/05/2006US20060003090 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
01/05/2006US20060002783 Bolt assembly, method and device for release, and computer system
01/05/2006US20060001726 Printable conductive features and processes for making same
01/05/2006US20060001361 Light-emitting diode
01/05/2006US20060001181 Terminal structure of multi-layer substrate and method for forming the same
01/05/2006US20060001155 Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages
01/05/2006US20060001150 Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices
01/05/2006US20060001132 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
01/05/2006US20060000877 Method for fabricating electrical connection structure of circuit board
01/05/2006US20060000642 Interposer with compliant pins
01/05/2006US20060000640 Multilayer printed wiring board and a process of producing same
01/05/2006US20060000637 Printed circuit board and method for manufacturing printed circuit board
01/05/2006US20060000636 Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same
01/05/2006US20060000325 Linear via punch
01/05/2006US20060000086 Electronic component mounting apparatus and electronic component mounting method
01/05/2006US20060000082 Method and apparatus for mounting semiconductor chips
01/05/2006DE102005024900A1 Halbleiterbauelement Semiconductor device
01/05/2006DE102004028814A1 Printed circuit board, has light conductor unit arranged between printed circuit board layers, where one layer has passage opening lined with material whose refractive index is similar to that of light conductor unit
01/05/2006DE10036934B4 Hauptplatine Motherboard
01/05/2006CA2571544A1 Method of manufacture of electronic or functional devices
01/04/2006EP1613136A1 Method for applying material onto a substrate using a droplet printing technique
01/04/2006EP1613135A1 Printed circuit board and method for manufacturing printed circuit board
01/04/2006EP1612898A1 Spark gap apparatus and method for electrostatic discharge protection
01/04/2006EP1612897A1 Spark gap apparatus and method for electrostatic discharge protection
01/04/2006EP1612891A1 Anisotropic electrically conductive film and method of producing the same
01/04/2006EP1612252A2 Anisotropically electroconductive film
01/04/2006EP1612047A1 Flat connector, ink jet head and method of manufacturing them
01/04/2006EP1611780A1 Method of determining at least one marking element on a substrate
01/04/2006EP1611642A1 Durable electronic assembly with conductive adhesive
01/04/2006EP1611611A2 Methods for fabricating three-dimensional all organic interconnect structures
01/04/2006EP1491077B1 Control device
01/04/2006EP1474261B1 Flux collection method and system
01/04/2006EP1196014B1 Printed wiring board unit, hierarchical mounting auxiliary substrate and electronic apparatus
01/04/2006CN2750621Y Metal based circuit board
01/04/2006CN1717968A Electromagnetic wave noise suppressor, structural body with electromagnetic wave noise suppressing function, and process for producing them
01/04/2006CN1717965A Method for mounting electronic component
01/04/2006CN1717964A Electronic part and manufacturing method thereof
01/04/2006CN1717963A Method for producing conductive patterns on a substrate
01/04/2006CN1717962A Multilayer ceramic substrate and its manufacturing method
01/04/2006CN1717801A Surface mountable clip suitable for use in a mobile communication device
01/04/2006CN1717627A Photosensitive resin composition comprising a halogen-free colorant
01/04/2006CN1717440A Silver-based powder, method of preparation thereof, and curable silicone composition
01/04/2006CN1717428A Photocurable and thermosetting resin composition and printed circuit boards made by using the same
01/04/2006CN1717322A Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby
01/04/2006CN1717292A Method for soldering miniaturised components to a base plate
01/04/2006CN1717161A Printed circuit board and method for manufacturing printed circuit board
01/04/2006CN1717160A Method for making layers and wiring board made thereby
01/04/2006CN1717159A Method forp roducing multilayer printed circuit board
01/04/2006CN1717158A Method for improving high quality ratio of circuit board process
01/04/2006CN1717157A Printed circuit board fixing structure of electronic product
01/04/2006CN1717156A Electronic component packaging method, semiconductor module, and semiconductor device
01/04/2006CN1717155A Printed circuit assembly system and method
01/04/2006CN1717154A Shield wire
01/04/2006CN1717153A Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
01/04/2006CN1717152A Method for producing circuit base board
01/04/2006CN1717151A Flexible circuit board film press
01/04/2006CN1717150A Correcting system of vision punching machine of printed circuit board machine
01/04/2006CN1717149A Circuitized substrate
01/04/2006CN1717148A Circuit board of protective circuit for storage battery, protective circuit for storage battery, and storage battery pack
01/04/2006CN1717147A Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus
01/04/2006CN1716693A Method for producing superhigh frequency electronic label antenna and electronic label and antenna
01/04/2006CN1716649A Welding-free fixing method and device for light emitting diode pin
01/04/2006CN1716644A Flip chip welding bottom plate
01/04/2006CN1716581A Device mounting board
01/04/2006CN1716580A 电路装置及其制造方法 Circuit device and manufacturing method thereof
01/04/2006CN1716558A Through electrode and method for forming the same
01/04/2006CN1716480A Thick film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
01/04/2006CN1716388A Disk drive and arm coil support assembly
01/04/2006CN1716147A Hierarchical module
01/04/2006CN1716135A Circuit base board, method for producing circuit base board and electronic clock
01/04/2006CN1716101A Image drawing apparatus and image drawing method
01/04/2006CN1716092A Manufacturing method of thick film member pattern
01/04/2006CN1716073A Process for forming a patterned thin film conductive structure on a substrate
01/04/2006CN1715894A Inspection method and system for and method of producing component mounting substrate
01/04/2006CN1715830A Amplifying camera equipment and metering checkout equipment