| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/12/2006 | WO2005071750A3 Conductive material compositions, apparatus, systems, and methods |
| 01/12/2006 | WO2005059206A3 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 01/12/2006 | US20060009108 Circuit array substrate for display device and method of manufacturing the same |
| 01/12/2006 | US20060009053 Electrical switch having an electrical connection element |
| 01/12/2006 | US20060009051 Flexible cable interconnect assembly |
| 01/12/2006 | US20060009050 Interposer with electrical contact button and method |
| 01/12/2006 | US20060008945 Integrated circuit stacking system and method |
| 01/12/2006 | US20060008759 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device |
| 01/12/2006 | US20060008628 Multilayer circuit board and method for manufacturing the same |
| 01/12/2006 | US20060008626 Multilayer; release layer, dielectric adhesive matrix, electroconductivity particles; uniform distribution pattern |
| 01/12/2006 | US20060007641 Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards |
| 01/12/2006 | US20060007636 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods |
| 01/12/2006 | US20060007381 Organic electroluminescent display device |
| 01/12/2006 | US20060006535 Selective plating of package terminals |
| 01/12/2006 | US20060006513 Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers |
| 01/12/2006 | US20060006503 Insulative coatings for apertures of semiconductor device components and semiconductor device components including insulative coatings |
| 01/12/2006 | US20060006487 Chip package substrate having soft circuit board and method for fabricating the same |
| 01/12/2006 | US20060006422 Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same |
| 01/12/2006 | US20060006378 Electrical circuit, thin film transistor, method for manufacturing electric circuit and method for manufactturing thin film transistor |
| 01/12/2006 | US20060006210 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the same |
| 01/12/2006 | US20060006141 Biomedical electrochemical sensor array and method of fabrication |
| 01/12/2006 | US20060005995 Circuit board and method of manufacture thereof |
| 01/12/2006 | US20060005986 Method of reforming reformable members of an electronic package and the resultant electronic package |
| 01/12/2006 | US20060005721 Printing screens, frames therefor and printing screen units |
| 01/12/2006 | US20060005383 Method of forming printed circuit card |
| 01/12/2006 | US20060005382 Modular method for manufacturing circuit board |
| 01/12/2006 | US20060005381 Tapelike material containing carbon nanotube and production method for cabon nanotube and electric field emission type electrode containing the tapelike material and production method therefor |
| 01/12/2006 | DE19912771B4 Elastische Vorrichtung zur akustischen Entkopplung eines elektroakustischen Systems, elektronisches Gerät und elektroakustisches System Elastic device for acoustic decoupling of an electro-acoustic system, electronic equipment and electro-acoustic system |
| 01/12/2006 | DE19649893B4 Elektrisch leitender Klebstoff und dessen Verwendung Electrically conductive adhesive and its use |
| 01/12/2006 | DE102004055817B3 Manufacture procedure for heavy-duty semiconductor modules involves mass of solder to produce solder connection and particles of copper are sprayed into place on solder |
| 01/12/2006 | DE102004029584A1 Anordnung zur Erhöhung der Zuverlässigkeit von substratbasierten BGA-Packages Arrangement for increasing the reliability of substrate-based BGA Packages |
| 01/12/2006 | DE102004029200A1 Verfahren zur Herstellung eines Gehäuses für eine elektronische Schaltung sowie ein Substrat für ein Gehäuse Method for producing a housing for an electronic circuit and a substrate for a housing |
| 01/12/2006 | DE10013189B4 Substrat für ein Leistungsmodul Substrate for a power module |
| 01/11/2006 | EP1615488A2 Electronic assembly with heat transfer, especially for a control module for a discharge head lamp of a vehicle |
| 01/11/2006 | EP1615485A1 Multilayer printed wiring board |
| 01/11/2006 | EP1615484A1 Article with a coating of an electrically conductive polymer and process for making it |
| 01/11/2006 | EP1615267A1 Metal-base circuit board and its manufacturing method |
| 01/11/2006 | EP1615264A2 Method of manufacturing an electronic parts packaging structure |
| 01/11/2006 | EP1615263A1 Method for interconnecting terminals and method for mounting semiconductor device |
| 01/11/2006 | EP1615151A1 Method and device for electromagnetic field analysis of circuit board, and circuit board and its design method |
| 01/11/2006 | EP1614771A1 Tin-coated printed circuit boards with a low tendency to the whisker formation |
| 01/11/2006 | EP1614734A1 Heat-activatable adhesive tape for bonding electronic components and printed circuit boards |
| 01/11/2006 | EP1614500A1 Solder paste and printed board |
| 01/11/2006 | EP1614329A1 Discharging solution, method for producing patterns and method for producing an electronic device using the discharging solution, and electronic device |
| 01/11/2006 | EP1614125A2 Method for producing soldering globules on an electrical component |
| 01/11/2006 | EP1613481A1 Organic silver compound and it's preparation method, organic silver ink and it's direct wiring method |
| 01/11/2006 | EP1613440A2 Improved coating for silver plated circuits |
| 01/11/2006 | EP1195083B1 Underfilling material for semiconductor package |
| 01/11/2006 | EP0942060B1 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| 01/11/2006 | EP0941545B1 Method of manufacturing a plurality of electronic components |
| 01/11/2006 | EP0839321B1 Contact tip structures for microelectronic interconnection elements and methods of making same |
| 01/11/2006 | CN2751509Y Substrate for flip-chip (FC) packaging technology |
| 01/11/2006 | CN1720766A Method for manufacturing flexible wiring circuit board |
| 01/11/2006 | CN1720617A Metal core substrate packaging |
| 01/11/2006 | CN1720541A Chipcard and method for production of a chipcard |
| 01/11/2006 | CN1720350A Peel strength enhancement of copper laminates |
| 01/11/2006 | CN1720205A Ceramic composition being fired at low temperature and having high strength and method for preparing the same, and laminated electronic parts using the same |
| 01/11/2006 | CN1720136A Laminate, printed wiring board and method for manufacturing them |
| 01/11/2006 | CN1719966A Wiring board, method of manufacturing wiring board, and electronic device |
| 01/11/2006 | CN1719591A Welding disk vision identifying and positioning system for flexible laser ball implanting machine |
| 01/11/2006 | CN1719585A Method of forming wiring pattern |
| 01/11/2006 | CN1719274A Printed circuit board with weak magnetic field sensor and method of fabricating the same |
| 01/11/2006 | CN1236663C Method for assembling base plate and element together |
| 01/11/2006 | CN1236661C Method for fixation between electronic parts |
| 01/11/2006 | CN1236660C Device mfg. method and apparatus |
| 01/11/2006 | CN1236659C Printed circuit board with built-in passive device, its mfg. method and used substrate |
| 01/11/2006 | CN1236658C Monolithic ceramic electronic element and its producing method and electronic device |
| 01/11/2006 | CN1236641C High frequency module |
| 01/11/2006 | CN1236109C Electrochemical method for forming inorganic covering layer on surface of copper material |
| 01/11/2006 | CN1235971C Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 01/11/2006 | CN1235711C Tube-like solder iron with detachable handle |
| 01/10/2006 | US6985764 Flex circuit shielded optical sensor |
| 01/10/2006 | US6985659 Optical transmission module |
| 01/10/2006 | US6985364 Voltage converter module |
| 01/10/2006 | US6985363 Card type recording medium and production method therefor |
| 01/10/2006 | US6985362 Printed circuit board and electronic package using same |
| 01/10/2006 | US6985361 Electronic devices with small functional elements supported on a carrier |
| 01/10/2006 | US6985349 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods |
| 01/10/2006 | US6985335 Integrated lead suspension and method of construction |
| 01/10/2006 | US6985111 Printed circuit board and wireless communication apparatus |
| 01/10/2006 | US6985068 Fuel tank resistor card having improved corrosion resistance |
| 01/10/2006 | US6985067 Fuel tank resistor card having improved corrosion resistance |
| 01/10/2006 | US6984915 Electrical slip ring platter multilayer printed circuit board and method for making same |
| 01/10/2006 | US6984883 Semiconductor power module |
| 01/10/2006 | US6984881 Portable, high density electronics including printed circuits having stacks of chips connected using solders; miniaturization |
| 01/10/2006 | US6984792 Dielectric interposer for chip to substrate soldering |
| 01/10/2006 | US6984583 Stereolithographic method for forming insulative coatings for via holes in semiconductor devices |
| 01/10/2006 | US6984576 Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip |
| 01/10/2006 | US6984542 Method of forming wiring |
| 01/10/2006 | US6984516 Multilayered microfluidic DNA analysis system and method |
| 01/10/2006 | US6984456 Flexible printed wiring board for chip-on flexibles |
| 01/10/2006 | US6984453 Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil |
| 01/10/2006 | US6984446 Process for producing a metal layer on a substrate body, and substrate body having a metal layer |
| 01/10/2006 | US6984441 Composite laminate and method for manufacturing the same |
| 01/10/2006 | US6984341 Mixtures comprising thiophene/anion dispersions and certain additives for producing coatings exhibiting improved conductivity, and methods related thereto |
| 01/10/2006 | US6984254 Tin, silver, bismuth alloy |
| 01/10/2006 | US6984156 Connector for surface mounting subassemblies vertically on a mother board and assemblies comprising the same |
| 01/10/2006 | US6984133 Electrical connector housing having a bridging piece between circuit boards connected to a receiving unit |
| 01/10/2006 | US6984125 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device |
| 01/10/2006 | US6983756 Substrate treatment process and apparatus |