| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/19/2006 | US20060012042 Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same |
| 01/19/2006 | US20060012028 Device mounting board |
| 01/19/2006 | US20060012015 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| 01/19/2006 | US20060012005 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies |
| 01/19/2006 | US20060012002 Device for mounting a semiconductor package on a support plate via a base |
| 01/19/2006 | US20060011928 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof |
| 01/19/2006 | US20060011709 Soldering method and solder alloy for additional supply |
| 01/19/2006 | US20060011702 Solder and packaging therefrom |
| 01/19/2006 | US20060011483 Process for electroplating metals into microscopic recessed features |
| 01/19/2006 | US20060011382 Wiring board and process for producing the same |
| 01/19/2006 | US20060011374 Flexible flat cable and method of manufacturing the same |
| 01/19/2006 | US20060011267 Solder paste and process |
| 01/19/2006 | DE202005017639U1 Support unit for use in wave soldering machine, has base plate made of light metal that is provided with non-adhesive coating on polytetrafluoroethylene base, where coating is applied by using power coating process |
| 01/19/2006 | DE202005012071U1 Lacquer coat applying device for printed circuit board, has holding fixture with holding unit designed, such that boards`s surfaces are tilted downwards by angle of more than forty five degrees from horizontal, during coating |
| 01/19/2006 | DE19922299B4 Leiterplatte einer zur Abschaltung des Antriebs einer Jalousie oder dergleichen vorgesehenen Endschaltervorrichtung PCB to a disconnection of the drive of a blind or the like provided Limit switch |
| 01/19/2006 | DE112004000260T5 Elektronikbauteilleiterplatte und Verfahren zu deren Herstellung An electronic component circuit board and process for their preparation |
| 01/19/2006 | DE102005026404A1 Gedruckte Schaltung für geschützte Keramik-Komponente Printed circuit protected ceramic component |
| 01/19/2006 | DE102004031189A1 Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated and curable adhesive tape for bonding electronic components and conductor tracks |
| 01/19/2006 | DE102004031188A1 Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape for bonding electronic components and conductor tracks |
| 01/19/2006 | DE102004030924A1 Elektrolytisch regenerierbare Ätzlösung Electrolytically reclaimable etching solution |
| 01/19/2006 | DE102004030140B3 Flexible Kontaktierungsvorrichtung Flexible contacting |
| 01/19/2006 | DE102004020497B3 Method of producing electrical contacts through a composite sheet of semiconductor chips and plastic having conductive particles applies high voltage across sheet |
| 01/19/2006 | DE102004016480B4 Vollintegrierte hybride optisch-elektrische Leiterplatte Fully integrated hybrid optical-electrical circuit board |
| 01/18/2006 | EP1617519A2 High density connector |
| 01/18/2006 | EP1617441A2 Flexible flat cable and method of manufacturing the same |
| 01/18/2006 | EP1616689A1 Stretched film and method for production thereof |
| 01/18/2006 | EP1616353A2 Layered microelectronic contact and method for fabricating same |
| 01/18/2006 | EP1616352A1 Helical microelectronic contact and method for fabricating same |
| 01/18/2006 | EP1615734A1 Compositions and methods for cleaning contaminated articles |
| 01/18/2006 | EP1474960B1 Device and method for transporting flat workpieces in conveyorized processing lines |
| 01/18/2006 | EP1328899B1 Method for producing a transponder coil |
| 01/18/2006 | EP1269807B1 Method for fabricating electrical connecting element, and electrical connecting element |
| 01/18/2006 | EP1218765B1 Wafer-level burn-in and test cartridge |
| 01/18/2006 | EP1153460B1 Device for electrically and mechanically connecting two printed circuit boards |
| 01/18/2006 | EP0953611B1 Repellent-containing material for electronic components, electronic components made by using the same, and process for the production of the components |
| 01/18/2006 | EP0646048B1 Electrically conductive compositions and methods for the preparation and use thereof |
| 01/18/2006 | CN2753105Y Laminated mould for multi-layer circuit board |
| 01/18/2006 | CN2753104Y Refluxing welder |
| 01/18/2006 | CN1723747A Board pieces and composite wiring boards using the board pieces |
| 01/18/2006 | CN1723746A Method of manufacturing circuit board |
| 01/18/2006 | CN1723745A Copper foil with extremely thin adhesive layer and method for producing the copper foil with extremely thin adhesive layer |
| 01/18/2006 | CN1723591A Connector having a built-in electronic part |
| 01/18/2006 | CN1723590A Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 01/18/2006 | CN1723566A Wiring substrate and radiation detector using same |
| 01/18/2006 | CN1723551A Semiconductor device and process for producing the same |
| 01/18/2006 | CN1723387A Image recognition apparatus and image recognition method |
| 01/18/2006 | CN1723099A Method and apparatus for high volume assembly of radio frequency identification tags |
| 01/18/2006 | CN1722941A Method for providing a layer, wiring substrate, elector-optical device, and electronic equipment |
| 01/18/2006 | CN1722940A Method for manufacturing multi-layer printed circuit board and multi-layer printed circuit board |
| 01/18/2006 | CN1722939A Manufacturing method of modular circuit board |
| 01/18/2006 | CN1722938A Circuit board, circuit board mounting method, and electronic device using the circuit board |
| 01/18/2006 | CN1722937A Surface mounting method for electronic element and printed circuit board applying same mounting method |
| 01/18/2006 | CN1722936A Mounting structure for electronic parts and mounting method |
| 01/18/2006 | CN1722935A Method of fabricating PCB including embedded passive chip |
| 01/18/2006 | CN1722934A Wiring method |
| 01/18/2006 | CN1722933A Backboard wiring method |
| 01/18/2006 | CN1722932A Short-proof printed circuit board structure |
| 01/18/2006 | CN1722930A Flexible circuit substrate |
| 01/18/2006 | CN1722539A Strain-resistant electrical connection device |
| 01/18/2006 | CN1722535A Stud bump socket |
| 01/18/2006 | CN1722513A Antenna coupling structure for a mobile terminal |
| 01/18/2006 | CN1722395A Circuit connection method |
| 01/18/2006 | CN1722315A Circuit protection device |
| 01/18/2006 | CN1722314A Flexible flat cable and method of manufacturing the same |
| 01/18/2006 | CN1722233A Method for providing electrical crossover in laminated structure |
| 01/18/2006 | CN1721931A Bonding method of flexible film and display bonded thereby |
| 01/18/2006 | CN1721476A Resin composition, and use and method for preparing the same |
| 01/18/2006 | CN1237857C Method for producing metal foil laminated product and method for producing circuit board |
| 01/18/2006 | CN1237856C Method of producing multi-layer circuit |
| 01/18/2006 | CN1237855C Method for making base plate conducting hole and wiring of circuit using printing mode |
| 01/18/2006 | CN1237854C Method of making microwave, multifunction modules using fluoropolymer substrates |
| 01/18/2006 | CN1237853C 基板检测装置 Substrate detection apparatus |
| 01/18/2006 | CN1237852C Multilayer printed circuit board and its producing method, resin composition for filling through hole |
| 01/18/2006 | CN1237614C Metal electrical interconnection structure |
| 01/18/2006 | CN1237610C Method for producing plate shape body and semiconductor device |
| 01/18/2006 | CN1237595C Formation of welding flux with resin parts as strengthening element |
| 01/18/2006 | CN1237401C Photosensitive resin composition and printing circuit board |
| 01/18/2006 | CN1237116C Poly ester synthetic (phenyl ether), polyester film, laminates sheet, printed wiring board, and multilayer printed wiring board |
| 01/17/2006 | US6988162 High-speed router with single backplane distributing both power and signaling |
| 01/17/2006 | US6987786 Controlling laser polarization |
| 01/17/2006 | US6987397 Method and probe structure for implementing a single probe location for multiple signals |
| 01/17/2006 | US6987315 Ceramic multilayer substrate |
| 01/17/2006 | US6987162 Method and apparatus of producing high-density polyimide (HPI) film |
| 01/17/2006 | US6986950 Partition or method for producing a partition for a multilayer pressed packet |
| 01/17/2006 | US6986937 Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer |
| 01/17/2006 | US6986917 Forming an insulating film by thermally curing the solder photoresist thermosetting resin, forming a small hole with a laser beam, electric plating a lead |
| 01/17/2006 | US6986668 Structure for controlled shock and vibration of electrical interconnects |
| 01/17/2006 | US6986454 Electronic package having controlled height stand-off solder joint |
| 01/17/2006 | US6986200 Method for mounting parts |
| 01/17/2006 | US6986199 Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials |
| 01/17/2006 | US6986198 Technique provided to form an isolation border in the power plane without the panel falling apart; having a metal layer sandwiched between a pair of photoimageable dielectric layers; photoforming metal filled vias plated-through holes; stability |
| 01/17/2006 | US6986192 Method for reclamation of precious metals from circuit board scrap |
| 01/12/2006 | WO2006004779A1 Substrate with patterned conductive layer |
| 01/12/2006 | WO2006004406A1 Method for applying a material onto a substrate using a droplet printing technique |
| 01/12/2006 | WO2006004299A1 Method for manufacturing black surface-treated copper foil for emi shield |
| 01/12/2006 | WO2006004298A1 Method for manufacturing black surface-treated copper foil for emi shield |
| 01/12/2006 | WO2006004171A1 Photosensitive film, process for producing the same, process for forming permanent pattern |
| 01/12/2006 | WO2005110657A3 Soldering process |
| 01/12/2006 | WO2005101496A3 Method for structured application of a laminatable film to a substrate for a semiconductor module |
| 01/12/2006 | WO2005086233A3 Component with encapsulation suitable for wlp and production method |