| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/26/2006 | US20060016615 Modular rotary anvil |
| 01/26/2006 | US20060016072 Method for manufacturing double-sided printed circuit board |
| 01/26/2006 | US20060016070 Vertically separated acoustic filters and resonators |
| 01/26/2006 | DE102005029136A1 Verfahren und Einrichtung für die Montage von Halbleiterchips Method and device for the assembly of semiconductor chips |
| 01/26/2006 | DE102005025474A1 Verfahren zum Bestimmen der Position eines Bezugspunktes A method for determining the position of a reference point |
| 01/26/2006 | DE102004030800A1 Verfahren zur Herstellung einer keramischen Leiterplatte A process for producing a ceramic circuit board |
| 01/26/2006 | DE102004030388A1 Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung Articles with a coating of electrically conductive polymer, and processes for their preparation |
| 01/26/2006 | DE10154878B4 Halteelement zur Fixierung eines elektronischen Leistungsbauteils an einem Kühlkörper Holding member for fixing an electronic power component to a heat sink |
| 01/26/2006 | CA2574211A1 Improved multi-layer integrated rf/if circuit board |
| 01/26/2006 | CA2574208A1 Improved multi-layer integrated rf/if circuit board |
| 01/25/2006 | EP1619719A2 Method of manufacturing a wiring board including electroplating |
| 01/25/2006 | EP1618770A2 Electronic control module for a removable connector and methods of assembling same |
| 01/25/2006 | EP1618769A1 Article comprising conductive conduit channels |
| 01/25/2006 | EP1618768A2 Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna |
| 01/25/2006 | EP1618629A2 Interposed electrical connector which is intended to connect two stacked electronic circuits and to the method of mounting same |
| 01/25/2006 | EP1618605A1 Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly |
| 01/25/2006 | EP1618571A1 Terminated conductive patterned sheet utilizing conductive conduits |
| 01/25/2006 | EP1497851B1 Program-controlled dicing of a substrate using a pulsed laser |
| 01/25/2006 | EP1442344B1 Method and device for treating objects by means of a liquid |
| 01/25/2006 | EP1209211B1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/25/2006 | EP1168373B1 Anisotropically conductive film |
| 01/25/2006 | CN2754311Y Liquid crystal display device and flexible printed circuit board hot-pressing connection structure |
| 01/25/2006 | CN1726746A Printed wiring boards having low inductance embedded capacitors and methods of making same |
| 01/25/2006 | CN1726615A Edge plated transmission line |
| 01/25/2006 | CN1726564A Electric conductors |
| 01/25/2006 | CN1726259A Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same |
| 01/25/2006 | CN1726249A Impregnated glass fiber strands and products including the same |
| 01/25/2006 | CN1726136A Method for producing a partially metallised film-type element |
| 01/25/2006 | CN1726129A High temperature resistant films and adhesive articles made therefrom |
| 01/25/2006 | CN1725934A Printed circuit board having weak magnetic field sensor and method of manufacturing the same |
| 01/25/2006 | CN1725933A Wired circuit forming board, wired circuit board, and thin metal layer forming method |
| 01/25/2006 | CN1725932A Conductive base material with resistance layer and circuit board material with resistance layer |
| 01/25/2006 | CN1725931A Flexible printing substrate |
| 01/25/2006 | CN1725930A Printed circuit board |
| 01/25/2006 | CN1725486A Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same |
| 01/25/2006 | CN1725485A Lead frame with built-in passive element and its manufacturing method |
| 01/25/2006 | CN1725463A Clamping device for processing electronic devices |
| 01/25/2006 | CN1725459A Semiconductor substrate structure and process method thereof |
| 01/25/2006 | CN1724252A Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same |
| 01/25/2006 | CN1724200A Special milling cutter of different material for printed circuit board and connecting method for it and clamp |
| 01/25/2006 | CN1239063C Installing device and method for electronic component |
| 01/25/2006 | CN1239060C Element mounting base plate and its producing method |
| 01/25/2006 | CN1239059C Process and device for manufacturing interconnection assebly |
| 01/25/2006 | CN1239058C Printing circuit board and device |
| 01/25/2006 | CN1239057C Multi-chip integrated circuit carrier |
| 01/25/2006 | CN1239056C Flip chip package, circuit thereof and packaging method thereof |
| 01/25/2006 | CN1238941C An integrated circuit carrier |
| 01/25/2006 | CN1238861C Conductive paste, article with the conductive paste coating and method for production thereof |
| 01/25/2006 | CN1238771C Resist removing agent |
| 01/25/2006 | CN1238757C Electronic assembly and display device |
| 01/25/2006 | CN1238725C Device and method for inspection of circuit substrate |
| 01/25/2006 | CN1238570C Coating method |
| 01/25/2006 | CN1238442C Resin material for decoration and swellant for deterging and eliminating the resin material |
| 01/25/2006 | CN1238395C Aqueous polyurethane resin composition |
| 01/25/2006 | CN1238187C Corrosion prevention for CAC component |
| 01/24/2006 | US6989995 Capacitor mounting structure |
| 01/24/2006 | US6989994 Circuit board sub-assemblies, methods for manufacturing same, electronic signal filters including same, and methods, for manufacturing electronic signal filters including same |
| 01/24/2006 | US6989991 Thermal management system and method for electronic equipment mounted on coldplates |
| 01/24/2006 | US6989969 Integrated lead suspension and method of construction |
| 01/24/2006 | US6989606 BGA substrate via structure |
| 01/24/2006 | US6989591 Method for making an integrated circuit of the surface-mount type and resulting circuit |
| 01/24/2006 | US6989587 Semiconductor device and manufacturing the same |
| 01/24/2006 | US6989586 Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems |
| 01/24/2006 | US6989559 Discrete circuit component having fabrication stage clogged through-holes and process of making the same |
| 01/24/2006 | US6989508 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 01/24/2006 | US6989493 Electrical feedthrough assembly for a sealed housing |
| 01/24/2006 | US6989329 Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections |
| 01/24/2006 | US6989325 Self-assembled nanometer conductive bumps and method for fabricating |
| 01/24/2006 | US6989297 Variable thickness pads on a substrate surface |
| 01/24/2006 | US6989294 Leadless plastic chip carrier with etch back pad singulation |
| 01/24/2006 | US6989293 Thermally enhanced packaging structure and fabrication method thereof |
| 01/24/2006 | US6989291 Method for manufacturing circuit devices |
| 01/24/2006 | US6989199 Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board |
| 01/24/2006 | US6989121 Method for encasing plastic array packages |
| 01/24/2006 | US6988925 Electrode or circuit pattern; overcoating carbon, impregnating with binder; curing |
| 01/24/2006 | US6988898 Signal repeating device |
| 01/24/2006 | US6988819 Lamp housing containing an integrated LED support structure |
| 01/24/2006 | US6988666 Security tag and process for making same |
| 01/24/2006 | US6988652 Solder printing using a stencil having a reverse-tapered aperture |
| 01/24/2006 | US6988612 Device for transferring/holding sheetlike member and its method |
| 01/24/2006 | US6988312 Method for producing multilayer circuit board for semiconductor device |
| 01/24/2006 | US6988301 Method for manufacturing a matrix type actuator |
| 01/24/2006 | CA2248576C Method of forming articles and patterning surfaces via capillary micromolding |
| 01/21/2006 | CA2475410A1 Floating pin lamination plate system for multilayer circuit boards |
| 01/19/2006 | WO2006007281A1 Solder bumps formation using paste retaining its shape after uv irradiation |
| 01/19/2006 | WO2006007166A2 Device and method of manufacture of an interconnection structure for printed circuit boards |
| 01/19/2006 | WO2006007141A2 Lead solder indicator and method |
| 01/19/2006 | WO2006005281A1 Method for the production of a metal-ceramic substrate |
| 01/19/2006 | WO2005101932B1 Method for reflow soldering |
| 01/19/2006 | WO2005101458A3 Method and use of a device for applying coatings onto band-shaped structures during the production of semiconductor components |
| 01/19/2006 | US20060014860 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 01/19/2006 | US20060014661 Stabilized with C3-C12 alkylene oxide, e.g., butylene oxide, aliphatic and cycloaliphatic alcohols having 2-8 carbon atoms, e.g., isopropanol, C1-C5 alkoxyphenol, e.g., 4-methoxyphenol, free radical stabilizer having 2,2,6,6-tetra(lower alkyl)-)-1-piperidinyloxy-yl group; vapor degreasing of metal parts |
| 01/19/2006 | US20060014419 Modules for fixing flexible printed circuit boards and flat display devices utilizing the same |
| 01/19/2006 | US20060014086 Method for manufacturing pattern formed structure |
| 01/19/2006 | US20060013471 Method for storing layers' information of a layers-made object |
| 01/19/2006 | US20060012967 Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method |
| 01/19/2006 | US20060012460 Metal or alloy having a melting point of 230 degrees C. or higher, alloy having a melting point lower than 230 degrees C.; epoxy-based, phenolic-based or acrylic-based thermosetting or thermoset resin or polyethylene type, polyester type, polypropylene type or acrylic type thermoplastic resin |
| 01/19/2006 | US20060012271 Fluid ejection device with micro-electromechanical fluid ejection actuators |
| 01/19/2006 | US20060012054 High wireability microvia substrate |
| 01/19/2006 | US20060012044 Plating method |