| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/02/2006 | US20060023439 Stacked chip electronic package having laminate carrier and method of making same |
| 02/02/2006 | US20060023385 Multi-functional energy conditioner |
| 02/02/2006 | US20060022982 Drawing apparatus and drawing method |
| 02/02/2006 | US20060022336 Microelectronic packages including solder bumps and AC-coupled interconnect elements |
| 02/02/2006 | US20060022020 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate |
| 02/02/2006 | US20060021794 Process of fabricating conductive column and circuit board with conductive column |
| 02/02/2006 | US20060021699 Heat-resistant flexible laminated board manufacturing method |
| 02/02/2006 | US20060021466 Mixed alloy lead-free solder paste |
| 02/02/2006 | DE202005016382U1 Wire-winding system for manufacture of antenna, e.g. for transponder, has integrated guides for laying antenna wire on surface of substrate and includes heater and sonotrode for embedding wire |
| 02/02/2006 | DE112004000505T5 Drucksteuerungssystem zum Drucken eines zähflüssigen Materials The pressure control system for printing a viscous material |
| 02/02/2006 | DE102004032706A1 Verfahren zur Herstellung eines elektrischen Bauelements und das Bauelement Process for the preparation of an electrical component and the component |
| 02/02/2006 | DE102004029298A1 Planar high frequency circuit comprises flat strips located on dielectric substrate made of etchable material |
| 02/01/2006 | EP1622437A1 Verfahren zum Verkleben oder Zusammenstellen mehrerer Elemente |
| 02/01/2006 | EP1622436A2 Surface mount axial leaded component for an electronic module |
| 02/01/2006 | EP1622435A1 Method of manufacturing an electronic circuit assembly using direct write techniques |
| 02/01/2006 | EP1622431A1 Circuit board with identifiable information and method for fabricating the same |
| 02/01/2006 | EP1621058A1 Gluing method and device |
| 02/01/2006 | EP1621054A1 A method for processing a thin film substrate |
| 02/01/2006 | EP1621053A1 Electrical element comprising lines made of carbonated plastic, and method and device for the production thereof |
| 02/01/2006 | EP1620892A2 Composite material, electrical circuit or electric module |
| 02/01/2006 | EP1620890A2 Electronic component as well as system support and panel for the production thereof |
| 02/01/2006 | EP1620863A1 Circuit protection device |
| 02/01/2006 | EP1620786A2 Substrate with multiple conductive layers and methods for making and using same |
| 02/01/2006 | EP1620754A1 Conductive patterned sheet utilizing multilayered conductive channels |
| 02/01/2006 | EP1620714A2 System and method for attenuating the effect of ambient light on an optical sensor |
| 02/01/2006 | EP1620442A1 Dicopper (i) oxalate complexes as precursor for metallic copper deposition |
| 02/01/2006 | EP1620209A2 Kinetic spray application of coatings onto covered materials |
| 02/01/2006 | EP1378152A4 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 02/01/2006 | EP1346615A4 A multi-chip integrated circuit carrier |
| 02/01/2006 | EP0939876B1 Method for production of conducting element and conducting element |
| 02/01/2006 | CN2755906Y Signal transmitting structure |
| 02/01/2006 | CN1729732A Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards |
| 02/01/2006 | CN1729731A Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board |
| 02/01/2006 | CN1729730A PCB method and apparatus for producing landless interconnects |
| 02/01/2006 | CN1729566A Electronic part manufacturing method and electronic part |
| 02/01/2006 | CN1729395A Semiconductor sensor having a front-side contact zone |
| 02/01/2006 | CN1729312A Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| 02/01/2006 | CN1729225A Capsule type hardener and composition |
| 02/01/2006 | CN1728926A Method for preparing case seat of ceramic package for SMD parts and components |
| 02/01/2006 | CN1728923A Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof |
| 02/01/2006 | CN1728922A Mechanical maintenance tool in use for positioning BGA type electronic parts and components |
| 02/01/2006 | CN1728921A Wiring board and magnetic disk apparatus |
| 02/01/2006 | CN1728920A Wire connection structure and program |
| 02/01/2006 | CN1728919A Wiring board and method of manufacturing wiring board |
| 02/01/2006 | CN1728918A Circuitized substrate |
| 02/01/2006 | CN1728917A Wiring board and magnetic disk apparatus |
| 02/01/2006 | CN1728342A Substrate dividing method |
| 02/01/2006 | CN1727179A Film with multilayered metal and process for producing the same |
| 02/01/2006 | CN1240261C Method for producing multilayer wiring circuit board |
| 02/01/2006 | CN1240260C Method for making laminated plate covered with metal for printed circuit board |
| 02/01/2006 | CN1240259C Method for forming holes, using flexible connection board formed thereof and its producing method |
| 02/01/2006 | CN1240258C Electronic circuit unit |
| 02/01/2006 | CN1240255C Power supply module and mfg. method thereof |
| 02/01/2006 | CN1239747C Surface treatment agent for copper and copper alloy |
| 02/01/2006 | CN1239658C Conductive binding agent, multiplayer printed circuit board and process for making the latter |
| 02/01/2006 | CN1239654C A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 02/01/2006 | CN1239609C Resin composition and its use and production process thereof |
| 02/01/2006 | CN1239559C Varnish for laminate or preprey, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 02/01/2006 | CN1239319C Capacitor layer forming both side copper clad laminated sheet and production method therefor |
| 02/01/2006 | CN1239318C Film with multilayered metal and process for producing the same |
| 01/31/2006 | US6992899 Power delivery apparatus, systems, and methods |
| 01/31/2006 | US6992898 Smart-card module with an anisotropically conductive substrate film |
| 01/31/2006 | US6992896 Stacked chip electronic package having laminate carrier and method of making same |
| 01/31/2006 | US6992864 Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperature |
| 01/31/2006 | US6992636 Dielectric substrate with selectively controlled effective permittivity and loss tangent |
| 01/31/2006 | US6992629 Embedded RF vertical interconnect for flexible conformal antenna |
| 01/31/2006 | US6992398 produced via stereolithography/purging; semiconductors |
| 01/31/2006 | US6992397 comprises ball grid array composed of doped eutectic lead/tin solder composition; mixing phosphorus residue prevents degradation of the solder/under bump metallization bond' printed circuits |
| 01/31/2006 | US6992379 Electronic package having a thermal stretching layer |
| 01/31/2006 | US6992372 Film carrier tape for mounting electronic devices thereon |
| 01/31/2006 | US6992000 Method of plating nonconductor product |
| 01/31/2006 | US6991960 Method of semiconductor device package alignment and method of testing |
| 01/31/2006 | US6991856 Methods of making and using freestanding reactive multilayer foils |
| 01/31/2006 | US6991855 Reactive multilayer foil with conductive and nonconductive final products |
| 01/31/2006 | US6991515 Ultra fine particle film forming method and apparatus |
| 01/31/2006 | US6991470 Circuit carrier and production thereof |
| 01/31/2006 | US6991386 Image forming apparatus and image forming method |
| 01/31/2006 | US6991151 Method of fabricating an electronic module comprising an active component on a base |
| 01/31/2006 | US6991148 Process for manufacturing multilayer flexible wiring boards |
| 01/31/2006 | US6990734 Methods for shielding one or more circuit of a printed circuit board |
| 01/31/2006 | CA2344775C Electronic controller unit and method of manufacturing same |
| 01/31/2006 | CA2179904C Method and device for electrolytically depositing metals from electrolytes containing organic additives |
| 01/26/2006 | WO2006009850A2 Semiconductor assembly having substrate with electroplated contact pads |
| 01/26/2006 | WO2006009274A1 Composite via structures and filters in multilayer printed circuit boards |
| 01/26/2006 | WO2006008519A1 Electrode manufacture |
| 01/26/2006 | WO2006008454A1 Method of forming uniform lines on a substrate |
| 01/26/2006 | WO2006008167A1 Method to manufacture an electrical bridge for an rfid antenna |
| 01/26/2006 | WO2005119848B1 Flexible ring interconnection system |
| 01/26/2006 | WO2005115669A3 Selective soldering apparatus with jet wave solder jet and nitrogen preheat |
| 01/26/2006 | WO2005066252A3 Inorganic powder, resin composition filled with the powder and use thereof |
| 01/26/2006 | WO2005038994A3 Laser-based system for memory link processing with picosecond lasers |
| 01/26/2006 | US20060019510 Fastener for assembly and disassembly |
| 01/26/2006 | US20060019090 Article with a coating of electrically conductive polymer and process for production thereof |
| 01/26/2006 | US20060019077 Process |
| 01/26/2006 | US20060019027 Method for forming microelectronic spring structures on a substrate |
| 01/26/2006 | US20060017451 Substrates including alignment fences |
| 01/26/2006 | US20060017175 Collars, support structures, and forms for protuding conductive structures |
| 01/26/2006 | US20060017157 High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus |
| 01/26/2006 | US20060016692 Reduction of surface oxidation during electroplating |
| 01/26/2006 | US20060016620 Multilayer printed wiring board and production method therefor |