| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/05/2006 | CN1798472A Pin connection structure, and method for modifying definition of pin position |
| 07/05/2006 | CN1798471A Printed circuit board including embedded capacitor and method of fabricating same |
| 07/05/2006 | CN1798470A T type topological wiring architecture for transmission line |
| 07/05/2006 | CN1797761A Power core devices and methods of making thereof |
| 07/05/2006 | CN1796109A Screen printing machine and printing method thereof |
| 07/05/2006 | CN1796038A Laser beam machining appts |
| 07/05/2006 | CN1263357C Scanning method |
| 07/05/2006 | CN1263356C Manufacture method of circuit substrate and circuit substrate and its power switching module |
| 07/05/2006 | CN1263355C Compound laminated piece of flat conductor elements and its usage |
| 07/05/2006 | CN1263354C Built-in module and its making method |
| 07/05/2006 | CN1263124C Large power semiconductor assembly capable of relieving mechanical stress |
| 07/05/2006 | CN1263109C Chromium adhesion layer for copper through-hole in low-K technology |
| 07/05/2006 | CN1262998C Magnetic head suspension device of magnetic disk drive and manufacturing mode |
| 07/05/2006 | CN1262866C Method for improving error of PCB |
| 07/05/2006 | CN1262690C Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and method for electrolytically treating workpieces |
| 07/05/2006 | CN1262576C Resin composition |
| 07/05/2006 | CN1262389C Soldering flux additive |
| 07/05/2006 | CN1262354C Binder coating device |
| 07/04/2006 | US7072503 Systems and methods for detecting defects in printed solder paste |
| 07/04/2006 | US7072168 Capacitor device and method of manufacturing the same |
| 07/04/2006 | US7072167 Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards |
| 07/04/2006 | US7071720 Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit |
| 07/04/2006 | US7071716 Apparatus for scan testing printed circuit boards |
| 07/04/2006 | US7071570 Chip scale package and method of fabricating the same |
| 07/04/2006 | US7071569 Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection |
| 07/04/2006 | US7071491 TO-CAN type optical module |
| 07/04/2006 | US7071424 Multilayer printed wiring board having filled-via structure |
| 07/04/2006 | US7071423 Circuitized substrate assembly and method of making same |
| 07/04/2006 | US7071422 Electronic circuit comprising conductive bridges and method for making such bridges |
| 07/04/2006 | US7071420 Methods and apparatus for a flexible circuit interposer |
| 07/04/2006 | US7071078 Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials |
| 07/04/2006 | US7071028 Semiconductor device and its manufacturing method |
| 07/04/2006 | US7071027 Ball grid array package having improved reliability and method of manufacturing the same |
| 07/04/2006 | US7071026 Production method for making film carrier tape for mounting electronic devices thereon |
| 07/04/2006 | US7070909 UV absorbing glass cloth and use thereof |
| 07/04/2006 | US7070908 Feature formation in thick-film inks |
| 07/04/2006 | US7070736 Sn-Zn lead-free solder alloy and soldered bond |
| 07/04/2006 | US7070654 Screen printing apparatus |
| 07/04/2006 | US7070428 Electrical connector assembly with pick up cap |
| 07/04/2006 | US7070427 Electrical connector assembly with pick up cap |
| 07/04/2006 | US7070422 Flexible circuit board |
| 07/04/2006 | US7070419 Land grid array connector including heterogeneous contact elements |
| 07/04/2006 | US7070207 Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication |
| 07/04/2006 | US7070088 Method of semiconductor device assembly including fatigue-resistant ternary solder alloy |
| 07/04/2006 | US7070087 Method and apparatus for transferring solder bumps |
| 07/04/2006 | US7070085 Water soluble protective paste for manufacturing printed circuit boards |
| 07/04/2006 | US7070084 Electrical circuit apparatus and methods for assembling same |
| 07/04/2006 | US7069651 Abrasion resistant electrode and device |
| 07/04/2006 | US7069650 Method for reducing the number of layers in a multilayer signal routing device |
| 07/04/2006 | US7069649 Capacitor device and fabricating method thereof |
| 07/04/2006 | US7069648 Component mounting method |
| 07/04/2006 | US7069647 Method for populating a substrate with electronic components |
| 07/04/2006 | US7069646 Techniques for reducing the number of layers in a multilayer signal routing device |
| 07/04/2006 | US7069645 Method for producing a circuit board |
| 07/04/2006 | US7069641 Forming a strong adhesion by laminating a conductive polymeric composite material on the composite electroplating layer; electroconductive crystallized polyethylene filled with carbon black; simplified method by using a printed circuits |
| 07/04/2006 | CA2531598A1 Systems and methods for protecting and electrical component from impact or repeated mechanical stress |
| 07/04/2006 | CA2211542C Electrical feedthroughs for ceramic circuit board support substrates |
| 06/29/2006 | WO2006068903A1 Flexible circuits and method of making same |
| 06/29/2006 | WO2006068228A1 Solder processing method and connector subjected to such processing |
| 06/29/2006 | WO2006068048A1 Material for pattern formation, apparatus for pattern formation, and method for pattern formation |
| 06/29/2006 | WO2006067827A1 Solder precoating method and work for electronic device |
| 06/29/2006 | WO2006067280A1 Conductive pattern, circuit board and their production method |
| 06/29/2006 | WO2006021423A3 Method and device for coating circuit boards |
| 06/29/2006 | US20060142424 High molecular weight solid thermoplastic polymer or thermosetting resin and a catalyst; expandable filler(s); solvent; for use in encapsulating electronic components to substrates with a solder; encapsulant expands at a temperature at or above the reflow temperature of the solder |
| 06/29/2006 | US20060142173 Solvent compositions containing chlorofluoroolefins or fluoroolefins |
| 06/29/2006 | US20060141832 Electrical contact |
| 06/29/2006 | US20060141820 Electric junction box and its assembling process |
| 06/29/2006 | US20060141817 Flexible circuit board |
| 06/29/2006 | US20060141815 Interconnection device and system |
| 06/29/2006 | US20060141814 Electrical contact and connector and method of manufacture |
| 06/29/2006 | US20060141674 Windowed package having embedded frame |
| 06/29/2006 | US20060141381 Photosensitive resin composition, and photosensitive element, method for forming resist pattern and printed wiring board using the composition |
| 06/29/2006 | US20060141259 Printed circuits on shrink film |
| 06/29/2006 | US20060141226 Printed circuit board and camera module |
| 06/29/2006 | US20060141159 Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| 06/29/2006 | US20060140459 Contact image sensing module with movement detecting function |
| 06/29/2006 | US20060139892 Heat dissipating arrangement for an electronic appliance |
| 06/29/2006 | US20060139889 Apparatus of optical display module for fixing circuit board |
| 06/29/2006 | US20060139831 Electrical subassembly and use thereof |
| 06/29/2006 | US20060138701 Method and device for structuring organic layers |
| 06/29/2006 | US20060138677 Layered microelectronic contact and method for fabricating same |
| 06/29/2006 | US20060138675 Solder structures for out of plane connections |
| 06/29/2006 | US20060138638 Substrate for semiconductor devices and semiconductor device |
| 06/29/2006 | US20060138619 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 06/29/2006 | US20060138399 resist-removing solution for low-k film and a cleaning solution for via holes or capacitors; solutions comprising hydrogen fluoride (HF) and at least one member selected from organic acids and organic solvents (e.g. acetic acid, hexanol, lauryl alcohol, propylene glcol, glycerin, diethylene glycol) |
| 06/29/2006 | US20060138098 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| 06/29/2006 | US20060138097 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| 06/29/2006 | US20060138076 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component |
| 06/29/2006 | US20060137905 Multilayer printed wiring board |
| 06/29/2006 | US20060137901 Electronic device including a substrate structure and a process for forming the same |
| 06/29/2006 | US20060137815 Vibrator support structure and manufacturing method for the support structure |
| 06/29/2006 | DE69635227T2 Kontakträger zum bestücken von substraten mit federkontakten Contact carrier of fitting substrates with spring contacts |
| 06/29/2006 | DE10357224B4 Spannvorrichtung zum Einpressen von Anschlüssen und Einpressvorrichtung Clamping device for pressing connections and press-in |
| 06/29/2006 | DE102004060416A1 Coaxial cables fastening method for printed circuit board, involves producing depressions in upper side of circuit board such that one depression lies lower than other depression and inserting end area of coaxial cables into one depression |
| 06/29/2006 | DE102004032903B4 Leitfähiges Pulver und Verfahren zur Herstellung desselben Conductive powder and process for producing same |
| 06/28/2006 | EP1675449A1 Devices comprising a power core and methods of making thereof |
| 06/28/2006 | EP1675448A1 Devices comprising a power core and methods of making thereof |
| 06/28/2006 | EP1675447A1 Devices comprising a power core and methods of making thereof |
| 06/28/2006 | EP1675446A1 Multi-layer ceramic substrate, method for manufacturng the same and electronic device using the same |
| 06/28/2006 | EP1675445A1 Method for producing semiconductor substrate |