| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/14/2006 | US20060201279 Methods of refining lead-containing materials |
| 09/14/2006 | US20060201201 Manufacturing method of double-sided wiring glass substrate |
| 09/14/2006 | US20060200985 Underfill method |
| 09/14/2006 | US20060200984 Air socket for testing integrated circuits |
| 09/14/2006 | US20060200983 Shielding base member and method of manufacturing the same |
| 09/14/2006 | US20060200982 Method of making a biosensor |
| 09/14/2006 | US20060200981 Method of making a biosensor |
| 09/14/2006 | US20060200980 System for producing flexible circuits |
| 09/14/2006 | US20060200979 Component mounting method |
| 09/14/2006 | US20060200978 System and method for information handling system motherboard assembly |
| 09/14/2006 | US20060200974 Component mounting method |
| 09/14/2006 | US20060200958 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 09/14/2006 | DE202006008439U1 Electric contact for a circuit board acting as an earth terminal and also to hold the circuit board in the housing |
| 09/14/2006 | DE19681758B4 Einseitiges Schaltkreissubstrat für mehrlagige Schaltkreisplatine, mehrlagige Schaltkreisplatine und Verfahren zur Herstellung selbiger Single-sided circuit substrate for multilayer circuit board, multilayer printed circuit board and method for producing Selbiger |
| 09/14/2006 | DE102006009500A1 Printed circuit plate has laminate including electrically conducting layer overlying on insulating layer and made up of heat conducting material, which contains metal and crystalline carbon, where metal has high heat conducting coefficient |
| 09/14/2006 | DE102005011252A1 Verfahren und Vorrichtung zur Herstellung einer elektrischen Leiterzugstruktur, sowie eine damit hergestellte Leiterzugstruktur Method and device for producing an electrical conduction path, and a conduction path thus produced |
| 09/14/2006 | DE102005010342A1 Induktives Bauelement Inductive component |
| 09/14/2006 | CA2599183A1 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit |
| 09/13/2006 | EP1701601A2 Multilayer printed wiring board |
| 09/13/2006 | EP1701600A1 Method for contacting conductive tracks of a printed circuit board |
| 09/13/2006 | EP1701381A2 Ceramic circuit board |
| 09/13/2006 | EP1700516A1 Arrangement with a contact element |
| 09/13/2006 | EP1700108A1 Surface acoustic wave sensor assemblies |
| 09/13/2006 | EP1699967A1 Electric interface for water-bearing household devices |
| 09/13/2006 | EP1699852A1 Low temperature sintering nanoparticle compositions |
| 09/13/2006 | EP1699637A1 Method and device for further printing with electrical conductivity |
| 09/13/2006 | EP1305988B1 Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner |
| 09/13/2006 | EP1220588B1 Method of manufacturing printed-circuit board |
| 09/13/2006 | EP1103168B1 High density printed circuit substrate and method of fabrication |
| 09/13/2006 | CN2817305Y Cartridge clip type wire fixing device |
| 09/13/2006 | CN2817293Y Printed circuit-board tray |
| 09/13/2006 | CN2815576Y Electromgnetic propulsion wave soldering tin furnace |
| 09/13/2006 | CN1833476A A socket for a microelectronic component having reduced electrical resistance and inductance |
| 09/13/2006 | CN1833474A Transparent conducting structures and methods of production thereof |
| 09/13/2006 | CN1833165A Generation of test patterns for subsequent inspection |
| 09/13/2006 | CN1832855A Device for step-wise lamination of steps |
| 09/13/2006 | CN1832666A Method for contacting conductive tracks of a printed circuit board |
| 09/13/2006 | CN1832665A Manufacturing method for electronic controller |
| 09/13/2006 | CN1832664A Method of fabricating printed circuit board having embedded multi-layer passive devices |
| 09/13/2006 | CN1832663A Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| 09/13/2006 | CN1832662A Pattern distribution note marking method and its circuit board and electronic device |
| 09/13/2006 | CN1832660A Substrate with channel guide |
| 09/13/2006 | CN1832659A Circuit device and method of manufacturing thereof |
| 09/13/2006 | CN1832658A Flexible printed circuit board of double-layer metal and manufacturing method thereof |
| 09/13/2006 | CN1831599A Regeneration apparatus of thin film type wire assembly substrate |
| 09/13/2006 | CN1831418A Method of producing plants, plant cultivating device, and light-emitting panel |
| 09/13/2006 | CN1831193A Plating method |
| 09/13/2006 | CN1831074A Gooey composition of flexible printing wiring plate and adhibit thin film using thereof |
| 09/13/2006 | CN1830667A Screen painting method and apparatus using thereof |
| 09/13/2006 | CN1275355C High density connector system |
| 09/13/2006 | CN1275312C Semiconductor device and its producing method, laminated semiconductor device and circuit base board |
| 09/13/2006 | CN1275307C Wiring basilar plate with position information |
| 09/13/2006 | CN1275306C Electronic parts bonding method and electronic parts bonding apparatus |
| 09/13/2006 | CN1275305C Extension of fatigue life for C4 solder ball in chip to substrate connection |
| 09/13/2006 | CN1275076C Electronic building block and its mfg. method |
| 09/13/2006 | CN1274880C Stripping liquid nickel or nickel alloy |
| 09/13/2006 | CN1274744C Flame retardant molding compositions |
| 09/13/2006 | CN1274491C Stripping film |
| 09/13/2006 | CN1274453C Method of laser milling |
| 09/13/2006 | CN1274450C Laser working equipment and laser working method |
| 09/13/2006 | CN1274449C Welding flux setting up method |
| 09/13/2006 | CN1274425C Waveform generating apparatus for microdeposition control system |
| 09/12/2006 | US7107212 Bitstream data reduction coding by applying prediction |
| 09/12/2006 | US7107183 Recyclable electric junction box applicable to automotive vehicles |
| 09/12/2006 | US7107034 High frequency and low noise interconnect system |
| 09/12/2006 | US7106598 Passive component assembly for multi-layer modular electrical circuit |
| 09/12/2006 | US7106574 Systems and methods for detecting tissue contact and needle penetration depth |
| 09/12/2006 | US7106408 Display device |
| 09/12/2006 | US7106317 Tape carrier package |
| 09/12/2006 | US7106296 Electronic book with multiple page displays |
| 09/12/2006 | US7105923 Device and method for including passive components in a chip scale package |
| 09/12/2006 | US7105911 Multilayer electronic substrate, and the method of manufacturing multilayer electronic substrate |
| 09/12/2006 | US7105909 Configuration and method for manufacturing filters comprising LC circuit |
| 09/12/2006 | US7105625 Such as (3-aminopropyl)tribisphenol A silane; bonding organic adhesives to inorganic substrates; void free semiconductor package sealing |
| 09/12/2006 | US7105432 Method of locating conductive spheres utilizing screen and hopper of solder balls |
| 09/12/2006 | US7105383 Packaged semiconductor with coated leads and method therefore |
| 09/12/2006 | US7105281 Forming a resin mold, interposing a photosensitive polymer forming layers, exposing the layered structure with an electron beam, ultraviolet radiation or visible radiaton, removing an exposed photosensitive polymer, and filling the vacant portion with a metal |
| 09/12/2006 | US7105277 patterning and filling through holes in a two-sided, multilayered or the like printed board with a paste; filled by squeegeeing |
| 09/12/2006 | US7105264 Method for forming patterned conductive film, electrooptical device, and electronic appliance |
| 09/12/2006 | US7105223 Comprising a metal compound which on irradiation with radiation liberates a metal in elemental form within the polymer, a modulus of elasticity in one film direction (longitudinal (MD) and/or transverse (TD)) of greater than 500 N/mm2; printed circuit boards, ribbon cables, smart cards, RFID labels |
| 09/12/2006 | US7105221 Circuit board, laminated member for circuit board, and method for making laminated member for circuit board |
| 09/12/2006 | US7105200 Method of producing thick-film sheet member |
| 09/12/2006 | US7105070 Method for producing ceramic substrate, and ceramic substrate |
| 09/12/2006 | US7104804 Method and apparatus for memory module circuit interconnection |
| 09/12/2006 | US7104434 Screen printing squeegee for applying solder paste |
| 09/12/2006 | US7103971 Process for manufacturing a circuit board |
| 09/12/2006 | US7103970 Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 09/12/2006 | US7103969 Methods and systems for forming a die package |
| 09/12/2006 | US7103966 Device for coupling PCB sheet |
| 09/12/2006 | CA2433462C Printed circuit board, method for producing same and semiconductor device |
| 09/12/2006 | CA2398613C Substrate and production method therefor |
| 09/08/2006 | WO2006094040A2 A method for pattern metalization of substrates |
| 09/08/2006 | WO2006093293A1 Ceramic multilayer board and method for manufacturing same |
| 09/08/2006 | WO2006093272A1 Wiring substrate, manufacturing method thereof, and resin body surface treatment method |
| 09/08/2006 | WO2006093193A1 Metal pattern, organic electronic device and process for producing the same |
| 09/08/2006 | WO2006093129A1 Functional element mounting module and mounting method of functional element mounting module |
| 09/08/2006 | WO2006093016A1 Printed board and method for manufacturing same |
| 09/08/2006 | WO2006092994A1 Substrate cleaning apparatus and cleaning method thereof |
| 09/08/2006 | WO2006091990A1 Multi-layered printed circuit board comprising conductive test surfaces, and method for determining a misalignment of an inner layer |
| 09/08/2006 | WO2005109974A3 Fusion bonded assembly with attached leads |