H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2006
11/02/2006	EP1716949A1 Immersion method
11/02/2006	EP1716732A2 Tin-based coating of electronic component
11/02/2006	EP1716731A1 Screen printing apparatus and screen printing method
11/02/2006	EP1716730A1 Method for the partial removal of a conductive layer
11/02/2006	EP1716578A2 Nanoscale metal paste for interconnect and method of use
11/02/2006	EP1716521A1 Application of rfid labels
11/02/2006	EP1716264A2 Lead-free solder composition for substrates
11/02/2006	EP1716212A1 Overcoat lacquer
11/02/2006	EP1715996A1 Hot pressing ceramic distortion control
11/02/2006	EP1613440A4 Improved coating for silver plated circuits
11/02/2006	EP1472089B1 Machine for continuously producing plastic laminates in a cold press
11/02/2006	EP1451831A4 Thin flexible conductors
11/02/2006	EP1449413A4 Method and apparatus for securing a circuit board to a rigid surface
11/02/2006	EP1439025B1 Flux composition for solder, solder paste and method of soldering
11/02/2006	EP1325505A4 A lead-less surface mount reed relay
11/02/2006	EP1194022B1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
11/02/2006	EP1104349B2 Method for making safety labels
11/02/2006	DE202006013062U1 Adapter for positioning and connecting e.g. chip, has pressing unit arranged in receiving area for pressing electronic component and including inner side that is pushed at upper surface of component if unit is blocked with hub body
11/02/2006	DE102006009702A1 Verfahren und Vorrichtung zum Perforieren von Leiterplatinen Method and apparatus for perforating printed-circuit boards
11/02/2006	DE102005019922A1 Multilayer printed board for controller of electrical window lifter in motor vehicle has electrical resistance for measuring input power of electrical or electronic component
11/02/2006	DE102005019309A1 Anisotropic adhere connection, for use between pressed screen and PCB contact positions in main power supply control device of motor vehicle, made of isotropic, conducting adhesive applied between positions, where adhesive has acrylate
11/02/2006	DE102005018539A1 Work tool for heat treatment process esp., soldering or welding, has processing zone of work tool mounted flush on work piece
11/02/2006	DE102005014665A1 Substrat zur Herstellung einer Lötverbindung mit einem zweiten Substrat The substrate for forming a solder connection with a second substrate
11/01/2006	CN2834106Y Wire positioner
11/01/2006	CN1857043A Ceramic circuit board, method for making the same, and power module
11/01/2006	CN1857042A Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace
11/01/2006	CN1857041A Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device
11/01/2006	CN1856866A Protective layer during scribing
11/01/2006	CN1856846A 超薄挠性电感器 Thin flexible inductor
11/01/2006	CN1856737A Liquid photo solder resist composition and photo solder resist film thereof
11/01/2006	CN1856558A Adhesive aid composition
11/01/2006	CN1856521A Latent hardener
11/01/2006	CN1856245A Main board assembling method and equipment therefor
11/01/2006	CN1856223A Method of manufacturing laminated substrate
11/01/2006	CN1856222A Method and apparatus for processing dielectric materials
11/01/2006	CN1856221A Apparatus and method for making circuitized substrates in a continous manner
11/01/2006	CN1856220A Method for mounting carrier belt and programmable read-only memory
11/01/2006	CN1856219A Electronic circuit device and method for manufacturing same
11/01/2006	CN1856218A Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
11/01/2006	CN1856216A Multilayer ceramic substrate and production method thereof
11/01/2006	CN1856215A Electric circuit substrate
11/01/2006	CN1855751A Wireless communication assembly
11/01/2006	CN1855400A Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
11/01/2006	CN1854680A Digital optical imaging measuring device and method
11/01/2006	CN1854606A Quartz glass single hole nozzle for feeding fluid and quartz glass multihole burner head for feeding fluid
11/01/2006	CN1854342A Method for controlling concentration of peroxide and copper in microetching liquid and its circulative usage
11/01/2006	CN1854210A Microencapsulated particulate metal material, method for producing the same, and aqueous dispersion and ink jet ink using the same
11/01/2006	CN1853943A Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board
11/01/2006	CN1853884A Raw porcelain plate opening die
11/01/2006	CN1283134C Power miniature assembly and its mfg. method
11/01/2006	CN1283133C Method for generating conductive structure on non-plane surface and use thereof
11/01/2006	CN1283004C Semiconductor device and its manufacturing method, circuit base plate and electronic machine
11/01/2006	CN1282893C Signal transmission unit for liquid crystal display
11/01/2006	CN1282519C Solder composition
11/01/2006	CN1282505C Process for improving adhesion of polymeric materials to metal surfaces
10/2006
10/31/2006	US7131084 Method, apparatus and computer program product for implementing automated detection excess aggressor shape capacitance coupling in printed circuit board layouts
10/31/2006	US7130715 Machining method and machining apparatus
10/31/2006	US7130198 Resin-packaged protection circuit module for rechargeable batteries and method of making the same
10/31/2006	US7129721 Method and apparatus for processing semiconductor devices in a singulated form
10/31/2006	US7129720 Method and device for testing the operativeness of printed circuit boards
10/31/2006	US7129718 Method and structure for measuring a bonding resistance
10/31/2006	US7129590 Stencil and method for depositing material onto a substrate
10/31/2006	US7129584 Elimination of RDL using tape base flip chip on flex for die stacking
10/31/2006	US7129578 Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body
10/31/2006	US7129446 Reflow device
10/31/2006	US7129418 Suspension board with circuit and producing method thereof
10/31/2006	US7129417 Method and structures for implementing customizable dielectric printed circuit card traces
10/31/2006	US7129166 Method of forming an electronic device
10/31/2006	US7129158 Printed wiring board and production method for printed wiring board
10/31/2006	US7129146 Flip chip package and process of forming the same
10/31/2006	US7128979 Circuit board, method of producing same, and power module
10/31/2006	US7128946 Engraving pattern ; forming dielectric films
10/31/2006	US7128847 Liquid crystalline polymeric compositions
10/31/2006	US7128844 Metal/ceramic circuit board and method for producing same
10/31/2006	US7128820 Process for preparing a non-conductive substrate for electroplating
10/31/2006	US7128269 Compact display assembly
10/31/2006	US7128256 Z-interconnections with liquid crystal polymer dielectric films
10/31/2006	US7127812 Process for producing a multi-layer printed wiring board
10/31/2006	US7127811 Methods of fabricating and using shaped springs
10/31/2006	US7127810 Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask
10/31/2006	US7127809 Method of forming one or more base structures on an LTCC cofired module
10/31/2006	US7127807 Process of manufacturing multilayer modules
10/31/2006	US7127799 Head gimbal assembly method
10/26/2006	WO2006112791A1 Pins for transferring material
10/26/2006	WO2006112695A2 Method for electroforming a stencil, and a stencil of this type
10/26/2006	WO2006112543A1 Inspection device and conductive pattern inspection method
10/26/2006	WO2006112474A2 Fiber-resin composite material, multilayer body, printed wiring board, amd method for manufacturing printed wiring board
10/26/2006	WO2006112411A1 Circuit wiring interference analysis device, interference analysis program, database used in interference analysis device, and asymmetrically connected line model
10/26/2006	WO2006112298A1 Wiring board and process for producing the same
10/26/2006	WO2006112242A1 Substrate inspecting apparatus
10/26/2006	WO2006112216A1 Wave soldering bath
10/26/2006	WO2006112101A1 Conductive pattern forming apparatus
10/26/2006	WO2006111698A1 Method of forming flexible electronic circuits
10/26/2006	WO2006111697A1 A method of forming flexible electronic circuits
10/26/2006	WO2006111451A1 Process for contact printing of pattern of electroless deposition catalyst.
10/26/2006	WO2006012113A3 Dielectric film with low coefficient of thermal expansion (cte) using liquid crystalline resin
10/26/2006	WO2006010639A3 Method of manufacturing an electronic circuit device through a direct write technique
10/26/2006	WO2005125298A3 Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer
10/26/2006	US20060242615 Printed wiring board design method, program thereof, recording medium storing the program recorded therein, printed wiring board design device using them and cad system
10/26/2006	US20060240684 Soldering method & its applied circuit board

1 ... 431 432 433 434 435 436 437 438 439 440 441 442 443 444 445 446 447 448 449 450 451 ... 1185