| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/09/2006 | CN1816250A Electronic components packaging substrate |
| 08/09/2006 | CN1816249A Circuit board |
| 08/09/2006 | CN1816247A Connection terminal structure of wiring board |
| 08/09/2006 | CN1816246A Printed circuit board and formation method |
| 08/09/2006 | CN1816245A Substrate before insulation, method of manufacturing substrate |
| 08/09/2006 | CN1815730A Devices comprising a power core and methods of making thereof |
| 08/09/2006 | CN1815726A Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor |
| 08/09/2006 | CN1815672A Plasma display device and method producing same |
| 08/09/2006 | CN1814357A Method and device for board processing |
| 08/09/2006 | CN1269391C Electronic circuit installation wiring substrate manufacturing method based on lead-free soldering tin |
| 08/09/2006 | CN1269390C Semiconductor device and producing method thereof |
| 08/09/2006 | CN1269389C Method and apparatus for providing substrate with viscous medium and use of jetting means for correction of application errors |
| 08/09/2006 | CN1269388C Flexible distributing board |
| 08/09/2006 | CN1269262C Installation socket connector of printing circuit board |
| 08/09/2006 | CN1269199C Flip chip type semiconductor device and making method thereof |
| 08/09/2006 | CN1269089C Mark for visual detection and electronic instrument |
| 08/09/2006 | CN1268957C Photoelectric assembling line module, production and assemblies thereof |
| 08/09/2006 | CN1268664C Resin composition, composition for solder resist, and cured article obtained therefrom |
| 08/08/2006 | USRE39224 agitating a low viscosity liquid, pressurizing through an orifice as a steady laminar stream into an enclosed, temperaturecontrolled solidification chamber containing a heat transfer medium, charging and deflecting the spheres through an electrical field |
| 08/08/2006 | US7089160 Model for modifying drill data to predict hole locations in a panel structure |
| 08/08/2006 | US7089032 Radio transmitting/receiving device |
| 08/08/2006 | US7088592 ESD protection structure and device utilizing the same |
| 08/08/2006 | US7088591 Printed circuit board and method for installing printed circuit board onto electro-conductive housing |
| 08/08/2006 | US7088590 Soldermask opening to prevent delamination |
| 08/08/2006 | US7088568 Method for manufacture of multilayer ceramic substrate and multilayer ceramic substrate |
| 08/08/2006 | US7088199 Method and stiffener-embedded waveguide structure for implementing enhanced data transfer |
| 08/08/2006 | US7088119 Mechanism for testing printed circuit board |
| 08/08/2006 | US7088008 Electronic package with optimized circuitization pattern |
| 08/08/2006 | US7088003 Structures and methods for integration of ultralow-k dielectrics with improved reliability |
| 08/08/2006 | US7088002 Interconnect |
| 08/08/2006 | US7087987 Tape circuit substrate and semiconductor chip package using the same |
| 08/08/2006 | US7087846 Pinned electronic package with strengthened conductive pad |
| 08/08/2006 | US7087845 Metal core multilayer printed wiring board |
| 08/08/2006 | US7087844 Wiring circuit board |
| 08/08/2006 | US7087664 Resin film and multilayer printed wiring board using thereof |
| 08/08/2006 | US7087523 Method for producing a structure using nanoparticles |
| 08/08/2006 | US7087510 Method of making bondable leads using positive photoresist and structures made therefrom |
| 08/08/2006 | US7087467 Lead frame and production process thereof and production process of thermally conductive substrate |
| 08/08/2006 | US7087460 Methods for assembly and packaging of flip chip configured dice with interposer |
| 08/08/2006 | US7087357 Photoreactive resin composition, method for making circuit substrate using same, and method for making ceramic multilayer substrate using same |
| 08/08/2006 | US7087315 Method for forming plating film |
| 08/08/2006 | US7087293 Thick film dielectric compositions for use on aluminum nitride substrates |
| 08/08/2006 | US7087183 Method of using an etchant solution for removing a thin metallic layer |
| 08/08/2006 | US7087181 Method for fabricating micro-structures with various surface properties in multi-layer body by plasma etching |
| 08/08/2006 | US7087126 Mounting apparatus and mounting method |
| 08/08/2006 | US7086873 Connector comprising an insulator and a contact retained by the insulator and connected to conductive portion of a board, and method of producing the same |
| 08/08/2006 | US7086868 Board-to-board connector |
| 08/08/2006 | US7086788 Optical sub-assembly for opto-electronic modules |
| 08/08/2006 | US7086786 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
| 08/08/2006 | US7086720 Micro-electromechanical fluid ejection device that incorporates a shape memory alloy based actuator |
| 08/08/2006 | US7086149 Method of making a contact structure with a distinctly formed tip structure |
| 08/08/2006 | US7086148 Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
| 08/08/2006 | US7086147 Method of accommodating in volume expansion during solder reflow |
| 08/08/2006 | US7086146 Method of manufacturing a shielding base member |
| 08/08/2006 | US7086138 Method of forming a feature having a high aspect ratio |
| 08/08/2006 | CA2337812C Method for making safety labels |
| 08/08/2006 | CA2220246C Composite materials |
| 08/03/2006 | WO2006080489A1 Workpiece boring/cutting operation aiding plate material and molding making use of the same |
| 08/03/2006 | WO2006080474A1 Exposure system and device |
| 08/03/2006 | WO2006080178A1 Material for metallic-pattern formation, crosslinking monomer, and method of forming metallic pattern |
| 08/03/2006 | WO2006080073A1 Multi-layer circuit substrate manufacturing method and multi-layer circuit substrate |
| 08/03/2006 | WO2006079913A1 Apparatus and method for making an antenna for a radiofrequency identifying device |
| 08/03/2006 | WO2006079193A1 System and method for guidance of assembly of electronic components |
| 08/03/2006 | WO2006050398A3 Assessing micro-via formation in a pcb substrate manufacturing process |
| 08/03/2006 | WO2006017998A3 Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same |
| 08/03/2006 | WO2005101493A3 Improved bonding arrangement and method for ltcc circuitry |
| 08/03/2006 | WO2004112096A3 Method and system for high volume transfer of dies to substrates |
| 08/03/2006 | US20060174257 Antenna designs for radio frequency identification tags |
| 08/03/2006 | US20060172588 Flexible flat cable assembly and electronic device utilizing the same |
| 08/03/2006 | US20060172573 Electronic component pin connectors |
| 08/03/2006 | US20060172460 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 08/03/2006 | US20060170740 Method of filling liquid into function liquid droplet ejection head, and ejection apparatus; method of manufacturing lcd device, organic el device, electron emission device, pdp device, electrophoretic display device, color filter, and organic el; and method of forming spacer, metallic wiring, lens, resist, and light diffusion member |
| 08/03/2006 | US20060170668 Monitor circuit board |
| 08/03/2006 | US20060169743 Apparatus and method for filling a ball grid array template |
| 08/03/2006 | US20060169591 Method of making printed wiring board and method of forming plating film |
| 08/03/2006 | US20060169485 Rigid-flex wiring board |
| 08/03/2006 | US20060169484 Printed wiring board |
| 08/03/2006 | US20060168804 Method for providing an electrical connection |
| 08/03/2006 | US20060168803 Layered board and manufacturing method of the same, electronic apparatus having the layered board |
| 08/03/2006 | DE50102188C5 Metallschablonen Metal stencils |
| 08/03/2006 | DE112004001671T5 Rühr-/Entlüftungsvorrichtung Agitation / |
| 08/03/2006 | DE102005003448A1 System component for e.g. drive control unit, of motor vehicle, has low temperature co-fired ceramic cover arranged above low temperature co-fired ceramic and bond wires such that ceramic is enclosed by base, cover and printed circuit board |
| 08/03/2006 | DE10103084B4 Halbleitermodul und Verfahren zu seiner Herstellung Semiconductor module and method for its preparation |
| 08/02/2006 | EP1686679A1 Overcurrent protection for solid state switching system |
| 08/02/2006 | EP1686655A1 Anisotropic conductive sheet, manufacturing method thereof, and product using the same |
| 08/02/2006 | EP1685751A1 Method of soldering electronic component having solder bumps to substrate |
| 08/02/2006 | EP1685586A2 Anti-tombstoning lead free alloys for surface mount reflow soldering |
| 08/02/2006 | EP1685411A1 Non-rigid conductor link measurement sensor and method for the production thereof |
| 08/02/2006 | EP1685178A1 Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof |
| 08/02/2006 | EP1684976A2 A frame unit for tensioning a printing screen and a jig for fitting a printing screen to or removing a printing screen from a frame unit |
| 08/02/2006 | EP1597945B1 Method for electrically contacting a component to a flat cable |
| 08/02/2006 | EP1206325A4 Vapor phase connection techniques |
| 08/02/2006 | EP1181325B1 Compositions for making ene-thiol elastomers |
| 08/02/2006 | EP1053580B1 An improved connector scheme for a power pod power delivery system |
| 08/02/2006 | EP0807368B1 Upgradeable voltage regulator modules |
| 08/02/2006 | CN2802904Y Assembling positioning structure of interface card extended slot base |
| 08/02/2006 | CN2802903Y Carrier of printed circuit board |
| 08/02/2006 | CN2802731Y Improved piezoelectric chip connection structure |
| 08/02/2006 | CN1813503A Method of forming an integrated circuit substrate |
| 08/02/2006 | CN1813502A Integrated electromechanical arrangement and method of production |