Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2006
07/20/2006WO2004090942A9 Thermally conductive adhesive composition and process for device attachment
07/20/2006US20060161874 Printed circuit wiring board designing support device, printed circuit board designing method, and its program
07/20/2006US20060161016 Bis(3-amino-4-hydroxyphenyl)adamantane derivatives and process for production thereof
07/20/2006US20060160394 Electrical connector assembly having board hold down
07/20/2006US20060160379 Compliant interconnect assembly
07/20/2006US20060160274 Methods relating to forming interconnects
07/20/2006US20060159885 Multilayer printed wiring board with filled viahole structure
07/20/2006US20060158824 Composite electronic component
07/20/2006US20060157852 Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same
07/20/2006US20060157838 Multimedia card and transfer molding method
07/20/2006US20060157831 Low profile ball-grid array package for high power
07/20/2006US20060157272 Microvia structure and fabrication
07/20/2006US20060156543 Method for reinforcing the connection of flat cable member and method for manufacturing image display unit
07/20/2006US20060156542 Method of fabricating rigid flexible printed circuit board
07/20/2006US20060156540 Method for aligning a component on a printed circuit board
07/20/2006DE202006003441U1 Contact less access card/chip card, for e.g. banking transaction, has radio frequency identification unit and coil inserted in recess, where coil receives and sends data and card is made of metal, precious metal or wood
07/20/2006DE19724059B4 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards
07/20/2006DE10340297B4 Verbindugsanordnung zur Verbindung von aktiven und passiven elektrischen und elektronischen Bauelementen Verbindugsanordnung for connection of active and passive electrical and electronic components
07/20/2006DE102005002149A1 Tastatur und Verfahren zur Herstellung einer Tastatur Keyboard and method for producing a keyboard
07/20/2006DE102004062441B3 Mehrschichtaufbau mit Temperierfluidkanal und Herstellungsverfahren Multilayered structure Temperierfluidkanal and manufacturing processes
07/20/2006DE102004055616A1 Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder Method for connecting a bridge module comprising a substrate and multilayered transponder
07/19/2006EP1681373A1 Composition for increasing the adhesion of polymeric materials to metal surfaces
07/19/2006EP1681321A1 Inkjet ink composition
07/19/2006EP1681131A1 Semiconductor device
07/19/2006EP1680949A1 Solder stop barrier
07/19/2006EP1680534A1 Support layer for thin copper foil
07/19/2006EP1423209B1 Dimensionally stable composite article and method of making the same
07/19/2006EP1405446A4 System and method for integrating optical layers in a pcb for inter-board communications
07/19/2006EP1294443A4 Microcurrent therapy device
07/19/2006EP1197131A4 A via connector and method of making same
07/19/2006EP0962580B1 Screen-like plated article comprising mesh-like fabric using sheath-core composite filaments and cylinder for rotary screen
07/19/2006EP0956161B1 Ipc (chip) termination machine
07/19/2006CN2798512Y Net board
07/19/2006CN2798511Y Apparatus for assembling integrated system
07/19/2006CN2798510Y Apparatus for printing soldering paste
07/19/2006CN2798509Y Welding structure for chip group of electronic component
07/19/2006CN2798508Y Structure for basal plate film pressing machine
07/19/2006CN2798507Y Adjustable split type circuitboard clamp
07/19/2006CN2798506Y 印刷电路板 A printed circuit board
07/19/2006CN2798334Y Coupler of integrated branch wire for printed circuit board
07/19/2006CN1806476A Production method for electronic component and electronic component
07/19/2006CN1806475A Printed circuit board with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna
07/19/2006CN1806474A Rigid-flex wiring board and method for producing same
07/19/2006CN1806356A Method of producing membrane electrode assemblies
07/19/2006CN1806329A Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion.
07/19/2006CN1806327A Land grid array package
07/19/2006CN1806301A High-frequency heating device
07/19/2006CN1806210A Ground connection of a printed circuit board placed in a wristwatch type electronic device
07/19/2006CN1806168A System and method for attenuating the effect of ambient light on an optical sensor
07/19/2006CN1805901A Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material
07/19/2006CN1805801A Structure for mounting multi-featured vibration actuator on circuit board
07/19/2006CN1805679A Method and apparatus for fixing components
07/19/2006CN1805666A Local fusing apparatus for multi-layer circuit board
07/19/2006CN1805665A Manufacturing method of strip type macromolecular ESD protective device
07/19/2006CN1805664A Off-width pitch for improved circuit card routing
07/19/2006CN1805663A Wiring pattern drawing formation method and circuit board manufactured by using the same
07/19/2006CN1805662A Method for producing printed wiring board
07/19/2006CN1805661A Method of forming raised weld bulges on circuit board
07/19/2006CN1805660A Optimal plug-in method
07/19/2006CN1805659A Milling and deburring method for PCB board
07/19/2006CN1805658A Thick copper foil fine-wire circuit manufacturing method
07/19/2006CN1805657A Wired circuit board
07/19/2006CN1805656A Circuit board module and its forming method
07/19/2006CN1805653A Printed circuit board and manufacturing method thereof
07/19/2006CN1805652A Soft printing circuit board, multi-layer soft printing circuit board and portable telephone terminal
07/19/2006CN1805651A Compound wired circuit board
07/19/2006CN1805125A Circuitized substrates, method of making same, and electrical assemblies and information handling systems
07/19/2006CN1803923A 树脂组合物 Resin composition
07/19/2006CN1265691C Multi-layer printed wiring board and method for manufacturing the same
07/19/2006CN1265690C Printed circuit board and its mfg. method
07/19/2006CN1265689C Copper-cladding method in circuit board design
07/19/2006CN1265688C Carrier-attached copper foil and printed board using copper foil
07/19/2006CN1265687C Preimpregnation material block and circuit substrate and their manufacture method
07/19/2006CN1265686C Flexible printed circuit board
07/19/2006CN1265561C Passive device and module of transceiver
07/19/2006CN1265515C Welding equipment
07/19/2006CN1265455C Semiconductor device and its making method
07/19/2006CN1265450C Thin film bearing belt for assembling electronic parts
07/19/2006CN1265447C Electrically-connecting pad electroplated metal layer making method of semiconductor package base plate
07/19/2006CN1265398C Method for forming pattern of transparent conductive membrane
07/19/2006CN1265023C Surface treatment for copper foil
07/19/2006CN1264673C Method for pressing heat lamination of dry photoresist film onto printed circuit board
07/19/2006CN1264615C Solvent sweeped chemical transporting box
07/18/2006US7080343 Apparatus and method for selecting a printed circuit board
07/18/2006US7080186 Electromagnetically-coupled bus system
07/18/2006US7079400 High-frequency circuit
07/18/2006US7079399 Printed circuit boards having improved solder pads
07/18/2006US7079398 Sash for land grid arrays
07/18/2006US7079373 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit
07/18/2006US7079370 Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
07/18/2006US7079086 Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials
07/18/2006US7078822 Microelectronic device interconnects
07/18/2006US7078821 Ball film for integrated circuit fabrication and testing
07/18/2006US7078819 Microelectronic packages with elongated solder interconnections
07/18/2006US7078816 Circuitized substrate
07/18/2006US7078807 Electrical connection materials and electrical connection methods
07/18/2006US7078797 Hybrid integrated circuit device
07/18/2006US7078795 High voltage module and method for producing same
07/18/2006US7078789 Method of forming a metal film, semiconductor device and wiring board
07/18/2006US7078788 Microelectronic substrates with integrated devices