Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2006
09/08/2006CA2600257A1 Multi-layered printed circuit board comprising conductive test surfaces, and method for determining a misalignment of an inner layer
09/07/2006US20060199920 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
09/07/2006US20060199406 Particle Distribution Interposer and Method of Manufacture Thereof
09/07/2006US20060199394 Cupric chloride solution and triazole compound; capable of forming an etching-inhibiting coating; nonuniform irregularities formed on the side wall of the circuit pattern by the etching improves the adhesion between the circuit pattern and an insulating resin layer covering the circuit pattern
09/07/2006US20060199363 Microelectronic devices and methods for forming interconnects in microelectronic devices
09/07/2006US20060199303 Carrier for substrate film
09/07/2006US20060199096 Process for thick film circuit patterning
09/07/2006US20060198802 Cataplasm base and cataplasm using the same
09/07/2006US20060197198 Semiconductor package with passive device integration
09/07/2006US20060197194 Laser-based technique for the fabrication of embedded electrochemical cells and electronic components
09/07/2006US20060196912 Method and apparatus for mounting and removing an electronic component
09/07/2006US20060196691 Printed circuit board with embedded capacitors therein and manufacturing process thereof
09/07/2006US20060196047 Methods and apparatus for a flexible circuit interposer
09/07/2006US20060196046 Head assembly for a component mounter
09/07/2006US20060196045 Non-contact interface for pick-and-place machines
09/07/2006DE19830820B4 Oberflächenmontierbares elektronisches Keramikbauteil Surface mount ceramic electronic part
09/07/2006DE112004001787T5 Schutzschicht während des Einritzens Protective layer during the Einritzens
09/07/2006DE10347622B4 Substrat mit Lötpad zur Herstellung einer Lötverbindung Substrate with solder pad for making a solder connection
09/07/2006DE102005009358A1 Lötfähiger Kontakt und ein Verfahren zur Herstellung Solderable contact, and a process for preparing
09/07/2006DE102005007768A1 System for laser marking of objects, especially circuit boards, comprises a laser marking device and a detector for optically detecting the laser markings on the objects
09/06/2006EP1699280A2 Multilayer printed wiring board and method for producing the same
09/06/2006EP1699279A2 Multilayer printed wiring board and method for producing the same
09/06/2006EP1699278A2 Multilayer printed wiring board and method for producing the same
09/06/2006EP1699277A1 Ceramic multilayer substrate
09/06/2006EP1699276A2 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
09/06/2006EP1699080A1 Ceramic circuit sustrate and manufacturing method thereof
09/06/2006EP1699056A1 A semiconductor memory module and a multi-layer circuit bord for
09/06/2006EP1698655A1 Mold release film
09/06/2006EP1698414A1 Method for producing metal powder
09/06/2006EP1698218A1 Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same
09/06/2006EP1698217A1 Electromagnetically shielded slot transmission line
09/06/2006EP1698216A1 Transmission line with a transforming impedance and solder lands
09/06/2006EP1698215A1 Method of manufacturing an electrical component
09/06/2006EP1698212A2 Lighting device of discharge lamp, illumination apparatus and illumination system
09/06/2006EP1698018A1 Transmission line having a transforming impedance
09/06/2006EP1698016A1 Triangular conforming transmission structure
09/06/2006EP1697989A2 Connector for making electrical contact at semiconductor scales and method for forming same
09/06/2006EP1697256A1 Method and system for self-aligning parts in mems
09/06/2006EP1697195A1 Railway beacon and related production method
09/06/2006EP1697102A2 Process for forming a patterned thin film structure for in-mold decoration
09/06/2006EP1696777A2 Apparatus and method for cleaning surfaces
09/06/2006EP1091626B1 Circuit board of protective circuit for storage battery, protective circuit for storage battery, and storage battery pack
09/06/2006CN2814916Y Circuit board radiator and application thereof
09/06/2006CN2814893Y Ultrasonic bonding wire device
09/06/2006CN1830234A Printed-wiring board and method of producing the same
09/06/2006CN1830233A Method for manufacturing printed wiring board and printed wiring board
09/06/2006CN1830232A Pieces for passive electronic components and method for production thereof
09/06/2006CN1830196A Modular terminal device
09/06/2006CN1829933A Electronic device with connection terminal
09/06/2006CN1829605A 丝网印刷设备 Screen printing equipment
09/06/2006CN1829420A Printed circuit board with embedded capacitors therein and manufacturing process thereof
09/06/2006CN1829419A Slow change type refractory ceramics heating material with positive temperature coefficient
09/06/2006CN1829418A Method and apparatus for perforating printed circuit board
09/06/2006CN1829417A Method and apparatus for printed circuit board different material layer separation in supercritical liquid
09/06/2006CN1829416A Embedded chip printed circuit board and method of manufacturing the same
09/06/2006CN1829413A Wired circuit board
09/06/2006CN1828634A Automatic indicating and checking compounding machine
09/06/2006CN1828633A Compounding machine for automatic indicating and interpreting
09/06/2006CN1828411A 感光性树脂组合物 The photosensitive resin composition
09/06/2006CN1828281A X-ray inspection device and x-ray inspection method
09/06/2006CN1274187C Sheet element for jumper line and its mounting structure
09/06/2006CN1274186C Wiring board and its mfg. method
09/06/2006CN1274068C 电连接器 The electrical connector
09/06/2006CN1274011C Crystalline grain in metal film growth control method
09/06/2006CN1273993C Conductive paste structure, product containing same and method for manufacturing same
09/06/2006CN1273867C Photosensitive resin composition and applications thereof
09/06/2006CN1273544C Electronic element for high frequency using low-dielectric loss angle tangent insulating material
09/06/2006CN1273535C High-temp. under mould-filling material with low heat generating in use
09/05/2006US7102892 Modular integrated circuit chip carrier
09/05/2006US7102721 Liquid crystal display having different shaped terminals configured to become substantially aligned
09/05/2006US7102631 Display panel with signal transmission patterns
09/05/2006US7102522 Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
09/05/2006US7102230 Circuit carrier and fabrication method thereof
09/05/2006US7102217 Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same
09/05/2006US7102212 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
09/05/2006US7102211 Semiconductor device and hybrid integrated circuit device
09/05/2006US7102148 Calibration method and device in electronic component mounting apparatus
09/05/2006US7102097 Method of making hole in ceramic green sheet
09/05/2006US7102085 Wiring substrate
09/05/2006US7102015 Maleimide compounds in liquid form
09/05/2006US7101782 Method of making a circuitized substrate
09/05/2006US7101781 Integrated circuit packages without solder mask and method for the same
09/05/2006US7101737 Method of encapsulating interconnecting units in packaged microelectronic devices
09/05/2006US7101730 Method of manufacturing a stackable ball grid array
09/05/2006US7101619 Laminate
09/05/2006US7101455 Method and device for manufacturing laminated plate
09/05/2006US7101197 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box
09/05/2006US7101193 Structure for controlled shock and vibration of electrical interconnects
09/05/2006US7101021 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
09/05/2006US7100813 System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication
09/05/2006US7100279 Method of mounting an electronic part
09/05/2006US7100278 Component mounting apparatus and method
09/05/2006US7100277 Methods of forming printed circuit boards having embedded thick film capacitors
09/05/2006US7100276 Method for fabricating wiring board provided with passive element
09/05/2006US7100275 Method of producing a multi-layered wiring board
09/05/2006US7100270 forming pairs of conductive electrodes as terminals of thick film resistors on a substrate, the electrodes are separated and parallel to each other forming a thick film resistor, a dielectric passivation layer over the thick film resistors, layering titanium and copper, a dry film and a photomask
09/05/2006US7100254 Method of manufacturing an ink-jet printhead
08/2006
08/31/2006WO2006091463A2 Method of making multilayered construction for use in resistors and capacitors
08/31/2006WO2006091410A1 Wave solder nozzle with an exit trough having a weir, a surface of the through being wettable by solder; a wave soldering machine with such nozzle; a method of improving the flow of solder out of a wave solder nozzle
08/31/2006WO2006090914A1 Calibration method for image rendering device and image rendering device