| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/27/2006 | US20060163199 Dispersion of nanowires of semiconductor material |
| 07/27/2006 | US20060163073 Process for producing metal plating film, process for producing electronic part and plating film forming apparatus |
| 07/27/2006 | US20060162956 Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them |
| 07/27/2006 | US20060162157 Economical high-frequency package |
| 07/27/2006 | US20060162156 Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces |
| 07/27/2006 | US20060162155 Component placement device and method |
| 07/27/2006 | US20060162154 In-line program system for assembly printed circuit board |
| 07/27/2006 | US20060162146 Isolated planar gyroscope with internal radial sensing and actuation |
| 07/27/2006 | DE19928788B4 Elektronisches Keramikbauelement Ceramic electronic component |
| 07/27/2006 | DE19847425B4 Aktuator mit MR-Elementschutzeinrichtungen Actuator with MR element protection devices |
| 07/27/2006 | DE10335153B4 Schaltungsanordnung auf einem Substrat, die einen Bestandteil eines Sensors aufweist, und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate having a part of a sensor and method for manufacturing the circuit arrangement on the substrate |
| 07/27/2006 | DE102006003137A1 Electronic package for mobile telephone, has encapsulating medium e.g. epoxy resin, to connect upper and lower substrates such that substrates engage with one another and encapsulate electronic components |
| 07/27/2006 | DE102005003723A1 Thermopile e.g. for measuring temperature differences, has thin-film or thick-film conductor paths on substrate |
| 07/27/2006 | DE102005003369A1 Verfahren zur Herstellung einer räumlichen Leiterplattenstruktur aus wenigstens zwei zueinander winkelig angeordneten Leiterplattenabschnitten A process for producing a three-dimensional printed circuit board structure comprising at least two mutually angularly disposed printed circuit board sections |
| 07/27/2006 | DE102005002707A1 Semiconductor component, has micro connecting unit to provide high frequency coupling of components and including three ply structure with two layers extending along common middle line and fixed on contact surface pairs of components |
| 07/27/2006 | DE102005001727A1 Electrical device, has contact plates arranged between connectors of conductor board and conductor junction areas soldered with connectors at conductor board and contacting areas at electrical component in electrically conductive manner |
| 07/27/2006 | DE102005001695A1 Application of a two dimensional soft solder pattern to a surface, comprises supplying a pattern with molten solder, and then transferring the solder onto a substrate |
| 07/26/2006 | EP1684560A2 Electronic assembly with reduced leakage current |
| 07/26/2006 | EP1684559A1 Conductive paste and multilayer ceramic substrate |
| 07/26/2006 | EP1683598A2 Vapour phase soldering |
| 07/26/2006 | EP1683592A1 Fine metal particles and fine metal oxide particles in dry powder form, and use thereof |
| 07/26/2006 | EP1683571A1 Patterning method, substrate for biomolecule immobilization using the patterning method, and biochip employing the substrate |
| 07/26/2006 | EP1682957A2 A method for generating a jetting program |
| 07/26/2006 | EP1682386A1 Method for fixing ribbon cable systems |
| 07/26/2006 | EP1682174A2 Erysipelothrix rhusiopathiae-haemophilus parasuis vaccine and methods of using the same |
| 07/26/2006 | EP1546275A4 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 07/26/2006 | CN2800699Y Circuit board and connector assembling structure |
| 07/26/2006 | CN1810066A Circuit assembly and method of its manufacture |
| 07/26/2006 | CN1810065A Printed wiring board |
| 07/26/2006 | CN1809787A Aqueous developable photoimageable thick film compositions |
| 07/26/2006 | CN1809439A Electrode for machine for electromagnetic induction welding of the layers forming a multi-layer printed circuit |
| 07/26/2006 | CN1809270A Film carrier tape for mounting electronic devices thereon and flexible substrate |
| 07/26/2006 | CN1809254A Magnetic cover for surface-mounted components and surface-mounted component assembly with same |
| 07/26/2006 | CN1809253A Electronic component package and packaging method |
| 07/26/2006 | CN1809252A Method of manufacturing printed circuit board |
| 07/26/2006 | CN1809251A Method of fabricating rigid flexible printed circuit board |
| 07/26/2006 | CN1809250A System and method of producing automatic wiring macros |
| 07/26/2006 | CN1809248A Printed wiring substrate and method for identifying printed wiring substrate |
| 07/26/2006 | CN1809247A Multilayer soft printed wiring board and production method thereof |
| 07/26/2006 | CN1809245A Double printed circuit board with solderless connecting structure |
| 07/26/2006 | CN1808769A Ball grid array connection device |
| 07/26/2006 | CN1808701A Manufacturing method of package base plate |
| 07/26/2006 | CN1808194A Method of forming optical devices |
| 07/26/2006 | CN1807098A Structure of soft printed circuit board |
| 07/26/2006 | CN1266989C Soldering method and soldering structural body |
| 07/26/2006 | CN1266810C Electric contactor and electric connection device using same |
| 07/26/2006 | CN1266759C Manufacture method of electrical contact |
| 07/26/2006 | CN1266753C Method for manufacturing semiconductor device |
| 07/26/2006 | CN1266752C Manufacturing method of circuit device |
| 07/26/2006 | CN1266715C Multilayer circuit and method of manufacturing |
| 07/26/2006 | CN1266546C Device for exposing printed circuit board |
| 07/26/2006 | CN1266532C Liquid crystal display apparatus |
| 07/26/2006 | CN1266364C Bonding structure for plastic parts with of clamper of clamp mould pressing and bonding method thereof |
| 07/26/2006 | CN1266314C Improvement of adhesive property and compound method for direct metalization |
| 07/26/2006 | CN1266218C Heat resistant resin composition, its heat resistant film or sheet and laminated product containing the film or sheet as base material |
| 07/26/2006 | CN1266062C Insulative ceramic compact |
| 07/26/2006 | CN1265928C Working device and working method, and production equipment using it |
| 07/25/2006 | US7081803 Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module |
| 07/25/2006 | US7081680 Self-aligned corrosion stop for copper C4 and wirebond |
| 07/25/2006 | US7081661 High-frequency module and method for manufacturing the same |
| 07/25/2006 | US7081650 Interposer with signal and power supply through vias |
| 07/25/2006 | US7081590 Wiring board and method of fabricating tape-like wiring substrate |
| 07/25/2006 | US7081405 Package module for an IC device and method of forming the same |
| 07/25/2006 | US7081402 Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
| 07/25/2006 | US7081304 Surface conductive resin, process for forming the same and wiring board |
| 07/25/2006 | US7081209 Solder mask removal method |
| 07/25/2006 | US7081043 Molded abrasive brush and methods of using for manufacture of printed circuit boards |
| 07/25/2006 | US7080988 Flexible contact-connection device |
| 07/25/2006 | US7080897 System for delivering material onto a substrate |
| 07/25/2006 | US7080596 Micro-casted silicon carbide nano-imprinting stamp |
| 07/25/2006 | US7080575 Mechatronic transmission control |
| 07/25/2006 | US7080451 Method for manufacturing an electronic component |
| 07/25/2006 | US7080448 PCB with inlaid outer-layer circuits and production methods thereof |
| 07/25/2006 | US7080447 Coating a layer of semi-solid solder mask; pressing said metal foil and curing semi-solid solder mask; covering a photo-resist layer; photoimaging positions of the photo-resist layer; removing the photo-resist layer and the metal foil; removing the residual photoresist; removing the residual metal foil |
| 07/25/2006 | US7080446 Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method |
| 07/25/2006 | US7080445 Method for connecting printed circuit boards and connected printed circuit boards |
| 07/25/2006 | US7080444 Apparatus for forming an electronic assembly |
| 07/25/2006 | CA2387012C Method of manufacturing printed wiring board |
| 07/25/2006 | CA2214874C Process for producing rigid and flexible circuits |
| 07/25/2006 | CA2123183C Agent for treating surfaces of copper and copper alloys |
| 07/20/2006 | WO2006076615A1 Ink-jet printing of compositionally no-uniform features |
| 07/20/2006 | WO2006076614A1 A process for manufacturing application specific printable circuits (aspc's) and other custom electronic devices |
| 07/20/2006 | WO2006076613A2 Metal nanoparticle compositions |
| 07/20/2006 | WO2006076609A2 Printable electronic features on non-uniform substrate and processes for making same |
| 07/20/2006 | WO2006076608A2 A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics |
| 07/20/2006 | WO2006076607A1 Ink-jet printing of passive electricalcomponents |
| 07/20/2006 | WO2006076606A2 Optimized multi-layer printing of electronics and displays |
| 07/20/2006 | WO2006076604A2 Processes for planarizing substrates and encapsulating printable electronic features |
| 07/20/2006 | WO2006076603A2 Printable electrical conductors |
| 07/20/2006 | WO2006075803A1 Reflow furnace |
| 07/20/2006 | WO2006075751A1 Capacitor layer forming material, process for producing the same, and printed wiring board having built-in capacitor layer obtained using the material |
| 07/20/2006 | WO2006075674A1 Image exposing apparatus and microlens array unit |
| 07/20/2006 | WO2006075669A1 Screen printer and screen printing method |
| 07/20/2006 | WO2006075654A1 Curable resin composition for ink-jet printing, cured object obtained therefrom, and printed wiring board obtained with the same |
| 07/20/2006 | WO2006075573A1 Cushioning material for heat press |
| 07/20/2006 | WO2006075459A1 Solder paste and electronic device |
| 07/20/2006 | WO2006075176A1 Electrical power substrate |
| 07/20/2006 | WO2006050286A3 An apparatus and method for improving printed circuit board signal layer transitions |
| 07/20/2006 | WO2005096351A3 Fabrication and use of superlattice |
| 07/20/2006 | WO2005072111A3 Improved populated printed wiring board and method of manufacture |