| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/29/2006 | US7097287 Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink |
| 08/29/2006 | US7097090 Solder ball |
| 08/29/2006 | US7096926 Thermal pouch interface |
| 08/29/2006 | US7096581 Method for providing a redistribution metal layer in an integrated circuit |
| 08/29/2006 | US7096580 I/C package/thermal-solution retention mechanism with spring effect |
| 08/29/2006 | US7096579 Method of manufacturing an optical device |
| 08/29/2006 | US7096578 Manufacturing method for wiring circuit substrate |
| 08/29/2006 | US7096572 Device for fitting substrates with electric components |
| 08/29/2006 | US7096555 Closed loop backdrilling system |
| 08/24/2006 | WO2006087820A1 Reflow system and reflow method |
| 08/24/2006 | WO2006087529A2 Printing screens |
| 08/24/2006 | WO2006053206A9 Single or multi-layer printed circuit board with improved via design |
| 08/24/2006 | WO2006049853A3 Method of connecting a semiconductor package to a printed wiring board |
| 08/24/2006 | WO2006039633A3 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
| 08/24/2006 | WO2006011020A3 Electric circuit battery support |
| 08/24/2006 | WO2005112100A3 Stacked module systems and methods |
| 08/24/2006 | US20060189176 Electrical contact |
| 08/24/2006 | US20060189141 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 08/24/2006 | US20060189127 Method to improve palanarity of electroplated copper |
| 08/24/2006 | US20060189125 Multilayer wiring substrate, and method of producing same |
| 08/24/2006 | US20060189044 High reliability multilayer circuit substrates and methods for their formation |
| 08/24/2006 | US20060187063 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| 08/24/2006 | US20060186541 Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
| 08/24/2006 | US20060186538 Land grid array package |
| 08/24/2006 | US20060186181 Ball mounting method |
| 08/24/2006 | US20060186097 Systems and methods for forming apertures in microfeature workpieces |
| 08/24/2006 | US20060185894 Conductive contamination reliability solution for assembling substrates |
| 08/24/2006 | US20060185790 Security tag & method using a flowable material |
| 08/24/2006 | US20060185782 Manufacturing apparatus for manufacturing electronic monolithic ceramic components |
| 08/24/2006 | US20060185535 Stencil manufacture |
| 08/24/2006 | US20060185164 Methods for making plated through holes usable as interconnection wire or probe attachments |
| 08/24/2006 | US20060185163 Method of manufacturing wiring board |
| 08/24/2006 | US20060185162 Electronic component mounting method and electronic component mounting apparatus |
| 08/24/2006 | US20060185161 Method of fabrication of low-loss filter and frequency multiplexer |
| 08/24/2006 | US20060185159 Memory card insertion tool |
| 08/24/2006 | US20060185157 Parts packaging device and parts packaging method |
| 08/24/2006 | US20060185141 Multilayer wiring board and manufacture method thereof |
| 08/24/2006 | US20060185140 Method of making multilayered construction for use in resistors and capacitors |
| 08/24/2006 | US20060185139 Film acoustically-coupled transformers with two reverse c-axis piezoelectric elements |
| 08/24/2006 | DE4321390B4 Elektrisches Bauteil Electrical component |
| 08/24/2006 | DE4305399B4 Verfahren zur Herstellung einer Kernschicht für Mehrlagenleiterplatten sowie Mehrlagenleiterplatte A process for producing a core layer for multilayer printed circuit boards and multilayer printed wiring board |
| 08/24/2006 | DE202006005809U1 Signal interface for connecting e.g. mouse with personal computer, has coupling body connected with attachment part and projecting from attachment surface in order to be inserted into hole in board and thus to attach interface to board |
| 08/24/2006 | DE19540140B4 Substrat, Modul und Verfahren zum Befestigen von Komponenten des Moduls auf dem Substrat Substrate module and method for attaching components of the module on the substrate |
| 08/24/2006 | DE10317675B4 Keramisches Multilayersubstrat und Verfahren zu seiner Herstellung A ceramic multilayer substrate and process for its preparation |
| 08/24/2006 | DE10220981B4 Sensor für schwach magnetische Felder unter Verwendung der Herstellungstechnik für gedruckte Leiterplatten und Verfahren zum Herstellen eines solchen Sensors Sensor for weak magnetic fields using the manufacturing technology for printed circuit boards and methods for manufacturing of such a sensor |
| 08/24/2006 | DE102005007487A1 Tool for electrostatic discharge protected assembly of detector module e.g. for x-ray computed tomography, has module electrical plug connection located between plug and electrostatic discharge protected tool operative |
| 08/24/2006 | DE102005006819A1 SMD-component soldering, involves soldering contacts of component on lower side of printed circuit board via through-holes in region of contacts by wave-soldering process, where board is made of glass fibers with epoxy resin |
| 08/24/2006 | DE102005002751A1 Printed circuit board, has recess, in which functional unit e.g. permanent magnet, is arranged, where recess is hole that is closed with punching part and thin layer and functional unit is bonded on thin section using adhesive |
| 08/24/2006 | DE10194457B4 System und Verfahren zum Anbringen elektronischer Komponenten auf flexiblen Substraten System and method for mounting electronic components on flexible substrates |
| 08/23/2006 | EP1694105A1 Method of manufacturing circuit board |
| 08/23/2006 | EP1694104A1 Surface-mounting type electronic circuit unit |
| 08/23/2006 | EP1694103A2 Method for implanting an electronic component on a support in order to increase resistance of the assembly to repeated impacts and vibrations and system comprising said component and support |
| 08/23/2006 | EP1693792A1 Method for manufacturing RFID labels |
| 08/23/2006 | EP1693772A1 Printed circuit board design method, program thereof, recording medium containing the program, printed circuit board design device using them, and cad system |
| 08/23/2006 | EP1507906A4 Plural layer woven electronic textile, article and method |
| 08/23/2006 | EP1467837B1 Depaneling systems |
| 08/23/2006 | EP1425358B1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus. |
| 08/23/2006 | EP1289678B1 Process for improving the adhesion of polymeric materials to metal surfaces |
| 08/23/2006 | EP1279323B1 A method for fastening a printed board to an element and a guide element |
| 08/23/2006 | CN2810098Y Universal glue injecting machine |
| 08/23/2006 | CN2808395Y Spray nozzle structure for selective tinning |
| 08/23/2006 | CN1823558A Overmolded mcm with increased surface mount component reliability |
| 08/23/2006 | CN1823557A Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same |
| 08/23/2006 | CN1823556A Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them |
| 08/23/2006 | CN1823555A Circuit board with embedded components and method of manufacture |
| 08/23/2006 | CN1823459A Electric junction box and its assembling process |
| 08/23/2006 | CN1823449A Component for a printed circuit board and method for fitting a printed circuit board with this component |
| 08/23/2006 | CN1823448A Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box |
| 08/23/2006 | CN1823416A Stackable integrated circuit package and method therefor |
| 08/23/2006 | CN1823409A Packaging method and system of electric component |
| 08/23/2006 | CN1823341A Memory card with raised portion |
| 08/23/2006 | CN1823339A Memory card with raised portion |
| 08/23/2006 | CN1823181A Surface treating agent for tin or tin alloy material |
| 08/23/2006 | CN1823145A Palladium complexes for printing circuits |
| 08/23/2006 | CN1822904A Method of pattern coating |
| 08/23/2006 | CN1822749A Copper-clad laminated sheet |
| 08/23/2006 | CN1822748A Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus |
| 08/23/2006 | CN1822747A Three-dimensional circuit module and method of manufacturing the same |
| 08/23/2006 | CN1822746A Printed board |
| 08/23/2006 | CN1822359A TAB tape and method of manufacturing the same |
| 08/23/2006 | CN1822358A Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized subs |
| 08/23/2006 | CN1822357A Semiconductor device package, method of manufacturing semiconductor device and semiconductor device |
| 08/23/2006 | CN1822324A Method for forming thin film pattern, thin film manufacturing device, conductive thin film wiring |
| 08/23/2006 | CN1822323A Method for forming thin film pattern, thin film manufacturing device, conductive thin film wiring |
| 08/23/2006 | CN1822316A Method of manufacturing wiring board |
| 08/23/2006 | CN1821882A Exposure method and apparatus |
| 08/23/2006 | CN1821876A Solder resist ink composition |
| 08/23/2006 | CN1820942A Apparatus and method for manufacturing copper clad laminate with improved peel strength |
| 08/23/2006 | CN1820889A Non low eutectic lead free solder composition |
| 08/23/2006 | CN1271902C Electric connector and its producing method |
| 08/23/2006 | CN1271900C Sandwich-structured intelligent power module |
| 08/23/2006 | CN1271899C Joint area pattern structure and substrate for mounting electric assembly |
| 08/23/2006 | CN1271898C Printing wiring substrate for high-speed communication |
| 08/23/2006 | CN1271896C Wiring plate, electronic device and mounting method of electronic elements |
| 08/23/2006 | CN1271894C Aqueous dispersion for forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing |
| 08/23/2006 | CN1271704C Plate for forming metal wires and method of forming metal wires using same |
| 08/23/2006 | CN1271699C Probe card for testing wafer having plurality of semiconductor devices and its manufacturing method |
| 08/23/2006 | CN1270864C Carbon dioxide gas laser machining method of multilayer material |
| 08/22/2006 | US7096450 Enhancement of performance of a conductive wire in a multilayered substrate |
| 08/22/2006 | US7095625 Electronic component mounting circuit board and electronic component replacing method |