| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/21/2006 | DE102005038416B3 Thermode mechanism for manufacturing smart label, has heating plates aligned vertically and arranged next to one another, in lower side of base plates, where heating units are arranged at front and bottom sides of heating plates |
| 09/21/2006 | DE102005034916A1 Verfahren zum Herstellen eines Schäumteils und Schäumteil, insbesondere Karosserieanbauteil A method for producing a Schäumteils and Schäumteil, in particular vehicle body part |
| 09/21/2006 | DE102005011545A1 Verfahren zur Kontaktierung von Leiterbahnen einer Leiterplatte Method for contacting circuit traces of a printed circuit board |
| 09/21/2006 | DE102005011145A1 Printed circuit board for use in mobile phone, has conductor path structure including test points made of copper, in which test points requiring high-order contacting safety are coated with hard gold and other points are coated with carbon |
| 09/21/2006 | DE102004037336B4 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement |
| 09/21/2006 | CA2604517A1 Circuitry module |
| 09/20/2006 | EP1703555A2 Printed wiring board and method for manufacturing the same |
| 09/20/2006 | EP1702968A1 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
| 09/20/2006 | EP1702705A1 Reflow furnace |
| 09/20/2006 | EP1702502A2 Patterned circuits and method for making same |
| 09/20/2006 | EP1701984A1 Uv led control loop and controller for uv curing |
| 09/20/2006 | EP1701837A2 Method and apparatus for producing a detail |
| 09/20/2006 | EP1039789B1 Method of manufacturing multilayer printed wiring board |
| 09/20/2006 | EP1025418A4 Three-dimensional inspection system |
| 09/20/2006 | CN2819709Y Circuit board combination |
| 09/20/2006 | CN2819708Y Conductive pattern manufacturing device of printing circuit board |
| 09/20/2006 | CN1836472A Printed wiring board and method of producing the same |
| 09/20/2006 | CN1836295A Insulation-coated electroconductive particles |
| 09/20/2006 | CN1836257A Inspection system for and method of inspecting deposits printed on workpieces |
| 09/20/2006 | CN1836238A Printed circuit wiring board designing support device, printed circuit board designing method, and its program |
| 09/20/2006 | CN1836159A Method of making a biosensor |
| 09/20/2006 | CN1835677A Strip part feeding device |
| 09/20/2006 | CN1835661A Wiring board manufacturing method |
| 09/20/2006 | CN1835660A Mfg method of precast type multi-layer circuit board |
| 09/20/2006 | CN1835659A Anti-welding procedue of PCB |
| 09/20/2006 | CN1835658A Base plate cleaning device and base plate feeding device with same |
| 09/20/2006 | CN1835657A Capacitor-embedded PCB having blind via hole and method of manufacturing the same |
| 09/20/2006 | CN1835655A Printed wiring board, manufacturing method therefor, and mounting method therefor |
| 09/20/2006 | CN1835654A Wiring board and method of manufacturing the same |
| 09/20/2006 | CN1835649A Substrate-loading instrument having the function of heating a substrate |
| 09/20/2006 | CN1835211A Circuit board of electronic device and mfg method thereof |
| 09/20/2006 | CN1834732A Matrix display device and method for manufacturing the same, and heat pressing connection head |
| 09/20/2006 | CN1833847A Method for machining compound crude piece |
| 09/20/2006 | CN1276702C Method for positioning on base and placing view-point characteristic of semiconductor piece |
| 09/20/2006 | CN1276696C Multi layer connection board and its producing method |
| 09/20/2006 | CN1276695C Circuit board making process |
| 09/20/2006 | CN1276563C Multi-functional energy conditioner |
| 09/20/2006 | CN1276545C Method of making an electrical connector |
| 09/20/2006 | CN1276495C Laser system and method for processing memory link with burst of laser pulses having ultra-short pulse widths |
| 09/20/2006 | CN1276259C Photoetching contact elements |
| 09/20/2006 | CN1276045C Method of adhesion of conductive materials, laminate, and adhesive composition |
| 09/20/2006 | CN1275769C Inkjet deposition apparatus and method |
| 09/20/2006 | CN1275764C Multilayered metal laminate and process for producing the same |
| 09/20/2006 | CN1275747C Entry board for use in drilling small holes |
| 09/20/2006 | CN1275734C Lead-less joining material and joining method using such material |
| 09/19/2006 | US7111271 Inductive filters and methods of fabrication thereof |
| 09/19/2006 | US7110257 Electronic apparatus including printed wiring board provided with heat generating component |
| 09/19/2006 | US7110245 Solid electrolytic capacitor and mounting method therefor |
| 09/19/2006 | US7110241 Substrate |
| 09/19/2006 | US7110227 Universial energy conditioning interposer with circuit architecture |
| 09/19/2006 | US7109825 Passive devices and modules for transceiver |
| 09/19/2006 | US7109817 Interference signal decoupling on a printed circuit board |
| 09/19/2006 | US7109592 SMT passive device noflow underfill methodology and structure |
| 09/19/2006 | US7109590 Semiconductor component comprising a surface metallization |
| 09/19/2006 | US7109583 Mounting with auxiliary bumps |
| 09/19/2006 | US7109578 Semiconductor device and electronic equipment using the same |
| 09/19/2006 | US7109426 Printed board and electronic apparatus |
| 09/19/2006 | US7109410 EMI shielding for electronic component packaging |
| 09/19/2006 | US7109106 Methods for providing support for conductive structures protruding from semiconductor device components |
| 09/19/2006 | US7109067 Semiconductor device and method for fabricating same |
| 09/19/2006 | US7109064 Method of forming a semiconductor package and leadframe therefor |
| 09/19/2006 | US7108961 Component for inkjet print head and manufacturing method thereof |
| 09/19/2006 | US7108894 Supplying the material to be deposited;atomizing the material to produce a plurality of discrete particles;applying a force; collimating particles by surrounding the carrier gas with a coflowing sheath gas; passing the particles through no more than one orifice; depositing |
| 09/19/2006 | US7108806 Mixing epoxy resin, amine, filler, corrosion inhibitor and oxygen scavenger, imidazole curing agent and solvent |
| 09/19/2006 | US7108795 surface treatment with adhesion promoters, then with acid resistance promoters, and with post-dip solutions, to form surfaces suitable for subsequent multilayer lamination; printed circuits having bonding strength |
| 09/19/2006 | US7108733 Spherical nano particle sized silver powder ; dispersion medium( water and lower molecualr weight alochol) for dispersing silver spherical powder, in a volume % content ratio with the powder between 1:99 and 40:60 ; high density electrode film |
| 09/19/2006 | US7108711 Protection apparatus for implantable medical device |
| 09/19/2006 | US7108526 Component and circuit module |
| 09/19/2006 | US7108521 Pressfit terminal and connection structure |
| 09/19/2006 | US7108516 Flexible board, connection method thereof, and connection structure thereof |
| 09/19/2006 | US7108369 Inkjet deposition apparatus and method |
| 09/19/2006 | US7107901 Method and apparatus for rapid cooling of metal screening masks |
| 09/19/2006 | US7107674 Method for manufacturing a chip carrier |
| 09/19/2006 | US7107673 Technique for accommodating electronic components on a multiplayer signal routing device |
| 09/19/2006 | US7107672 Method of mounting electronic parts on a flexible printed circuit board |
| 09/19/2006 | US7107661 Method of recycling printed circuit board |
| 09/14/2006 | WO2006095892A1 Image processing method, image processor, drawing system, and program |
| 09/14/2006 | WO2006095852A1 Electronic component module and method for manufacturing same |
| 09/14/2006 | WO2006095805A1 Electronic circuit and method for manufacturing same |
| 09/14/2006 | WO2006095677A1 Composition having metal particles dispersed therein, and method for flip chip mounting and method for forming bump using the same |
| 09/14/2006 | WO2006095590A1 Filler for resin, resin base material containing same and electronic component substrate material |
| 09/14/2006 | WO2006095498A1 Method for analyzing component mounting board |
| 09/14/2006 | WO2006095494A1 Photosensitive solder resist composition, photosensitive solder resist film, permanent pattern and method for forming same |
| 09/14/2006 | WO2006094755A1 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit |
| 09/14/2006 | WO2006060520A3 Membrane-limited selective electroplating of a conductive surface |
| 09/14/2006 | WO2006020330A3 Methods and apparatuses for imprinting substrates |
| 09/14/2006 | WO2005111274A3 Selective catalytic activation of non-conductive substrates |
| 09/14/2006 | US20060204895 Photocrosslinkable polyurethanes |
| 09/14/2006 | US20060204741 Contact surfaces for electrical contacts and method for producing the same |
| 09/14/2006 | US20060204670 Uniform distribution of ligth to photoinitiator; light emitting diodes; coolign |
| 09/14/2006 | US20060204397 Sn-zn lead-free solder alloy, and solder junction portion |
| 09/14/2006 | US20060203040 Structure and method for connecting flexible printed circuit board to inkjet print head |
| 09/14/2006 | US20060202349 Circuit substrate and its manufacturing method |
| 09/14/2006 | US20060202344 Printed Wiring Board and Method for Manufacturing The Same |
| 09/14/2006 | US20060202333 Package of a semiconductor device with a flexible wiring substrate and method for the same |
| 09/14/2006 | US20060202322 Interposer, and multilayer printed wiring board |
| 09/14/2006 | US20060201997 Fine pad pitch organic circuit board with plating solder and method for fabricating the same |
| 09/14/2006 | US20060201818 Manufacturing method of double-sided wiring glass substrate |
| 09/14/2006 | US20060201705 Electrical device allowing for increased device densities |
| 09/14/2006 | US20060201702 Component for a printed circuit board and method for fitting a printed circuit board with this component |