Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2006
08/16/2006CN1269991C Method for depositing metal and metal oxide films and patterned films
08/16/2006CN1269633C Novel composite foil and its mfg. method, and copper-coated laminated plate
08/16/2006CN1269612C Solder foil, semiconductor device, electronic device, semiconductor assembly and power assembly
08/15/2006US7092639 EMI shield for reducing clock jitter of a transceiver
08/15/2006US7092255 Thermal management system and method for electronic equipment mounted on coldplates
08/15/2006US7092237 Printed circuit board with embedded capacitors therein, and process for manufacturing the same
08/15/2006US7092050 Liquid crystal device, manufacturing method therefor, and electronic apparatus
08/15/2006US7092000 Pulse light pattern writer
08/15/2006US7091818 Noise suppressor unit for a power source module
08/15/2006US7091803 Signal transmission structure
08/15/2006US7091716 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
08/15/2006US7091606 Circuit device and manufacturing method of circuit device and semiconductor module
08/15/2006US7091593 Circuit board with built-in electronic component and method for manufacturing the same
08/15/2006US7091589 Multilayer wiring board and manufacture method thereof
08/15/2006US7091583 Method and structure for prevention leakage of substrate strip
08/15/2006US7091424 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
08/15/2006US7091066 Method of making circuitized substrate
08/15/2006US7091065 Method of making a center bond flip chip semiconductor carrier
08/15/2006US7091060 Circuit and substrate encapsulation methods
08/15/2006US7090966 Variations in the accumulated illumination intensity of radiation on the surface of the plate are controlled to 20% or less, thus alleviating unevenness of distribution of energy to be irradiated on the plate; forming a conductive film by discharging a liquid material using an ink-jet
08/15/2006US7090896 Thermally treating a sol-gel product of a multifunctional carbosilane
08/15/2006US7090743 Pressure laminator apparatus
08/15/2006US7090517 Electrical connector assembly with pick up cap
08/15/2006US7090506 Signal transmission device having flexible printed circuit boards
08/15/2006US7090505 Connecting method for structure with implantable electrodes
08/15/2006US7090139 IC card and method of manufacturing the same
08/15/2006US7090132 Long range optical reader
08/15/2006US7089661 Method for packaging small size memory cards
08/15/2006US7089660 Method of fabricating a circuit board
08/15/2006US7089659 Method of producing ceramic laminates
08/15/2006US7089657 Fixing holder for fixing an electronic component having wire-shaped leg portions to a printed circuit board
08/15/2006US7089655 System for operating and resetting PCB holding device
08/15/2006US7089646 Methods of manufacturing a printed circuit board shielded against interfering radiation
08/15/2006CA2211540C Conductive via fill inks for ceramic multilayer circuit boards on support substrates
08/10/2006WO2006084064A2 Selective catalytic activation of non-conductive substrates
08/10/2006WO2006082960A1 Jet solder bath
08/10/2006WO2006082959A1 Method for removing fume in reflow furnace and reflow furnace
08/10/2006WO2006082838A1 Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board
08/10/2006WO2006082817A1 Capacitor and wiring board incorporating same
08/10/2006WO2006082785A1 Multilayer printed wiring board
08/10/2006WO2006082784A1 Multilayer printed wiring board
08/10/2006WO2006082783A1 Multilayer printed wiring board
08/10/2006WO2006082699A1 Surface mount electric part
08/10/2006WO2006064977A3 Ceramic aggregate substrate, ceramic substrate and ceramic aggregate substrate fabrication method
08/10/2006WO2005114658A3 Method for making noble metal conductive leads for suspension assemblies
08/10/2006WO2005086549A8 Backup board for machining process
08/10/2006WO2005038070A3 Surface reactive preservative for use with solder preforms
08/10/2006US20060178542 Aromatic ring polymer and low-dielectric material
08/10/2006US20060178479 Non-sticky water-based conformal coating material
08/10/2006US20060178074 Flat panel display device and its method of manufacture
08/10/2006US20060177965 Semiconductor device and process for producing the same
08/10/2006US20060177963 Process for producing copy protection for an electronic circuit
08/10/2006US20060177787 Quartz glass single hole nozzle for feeding fluid and quartz glass multihole burner head for feeding fluid
08/10/2006US20060177568 Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
08/10/2006US20060177472 Insect repellent coating and industrial product using the same
08/10/2006US20060176675 Multi-layer polymeric electronic device and method of manufacturing same
08/10/2006US20060176327 Method of jetting viscous medium
08/10/2006US20060175321 Methods of forming a variable watt density layered heater
08/10/2006US20060175203 Electroplating pcb components
08/10/2006US20060175187 Stretchable fabric switch
08/10/2006US20060175084 Wiring board and method for fabricating the same
08/10/2006US20060175082 Flexible printed circuit board and connecting method of the same
08/10/2006US20060175081 method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material
08/10/2006US20060175003 Security tag and system for fabricating a tag including an integrated surface processing system
08/10/2006US20060174477 Wiring board provided with a resistor and process for manufacturing the same
08/10/2006DE10343256B4 Anordnung zur Herstellung einer elektrischen Verbindung zwischen einem BGA-Package und einer Signalquelle, sowie Verfahren zum Herstellen einer solchen Verbindung An arrangement for producing an electrical connection between a BGA package and a signal source, and to processes for producing such a compound
08/09/2006EP1689219A2 Sealed electronic module with seal-in-place connector header
08/09/2006EP1688993A2 Standardized bonding location process and apparatus
08/09/2006EP1688992A1 Column suction head and column mounting method
08/09/2006EP1688868A2 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
08/09/2006EP1688810A1 Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same
08/09/2006EP1688770A1 Ic chip mounting board, substrate for mother board, device for optical communication, method for manufacturing substrate for mounting ic chip thereon, and method for manufacturing substrate for mother board
08/09/2006EP1688247A1 Metal-clad substrate and method for producing same
08/09/2006EP1688022A1 Electric circuit arrangement
08/09/2006EP1687678A2 Chemically amplified positive photosensitive thermosetting resin composition method of forming cured article and method of producing functional device
08/09/2006EP1687381A1 Formation of self-assembled monolayers
08/09/2006EP1687114A1 Vertical removal of excess solder from a circuit substrate
08/09/2006EP1543083B1 Process and ink for making electronic devices
08/09/2006EP1540193A4 Fastener for assembly and disassembly
08/09/2006EP1273609B1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them
08/09/2006EP1195079B1 An arrangement for mounting chips in multilayer printed circuit boards
08/09/2006EP0951739B1 High density electrical connectors
08/09/2006CN2805321Y Press fitting equipment
08/09/2006CN2805302Y Patch strut attachment of circuit board
08/09/2006CN2803582Y Improved cylinder of micro aperture switching system for circuit board borer
08/09/2006CN1817075A Gluing method and device
08/09/2006CN1817073A Wiring board member for forming multilayer printed circuit board, method for producing same, and multilayer printed circuit board
08/09/2006CN1817072A Method of manufacturing electronic part and electronic part
08/09/2006CN1817071A Reflow soldering method using pb-free solder alloy and hybrid packaging method and structure
08/09/2006CN1817070A Soft magnetic material for manufacturing printed circuit boards
08/09/2006CN1816918A Light-emitting diode thermal management system
08/09/2006CN1816502A Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition
08/09/2006CN1816258A Method for making hard-soft composite circuit board
08/09/2006CN1816257A Printing-head electromagnet fixing method and device
08/09/2006CN1816256A Film pattern forming method and application of the same
08/09/2006CN1816255A Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus
08/09/2006CN1816254A Method of forming film pattern, device, method of manufacturing the same, electro-optical apparatus, and electronic apparatus
08/09/2006CN1816253A Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus
08/09/2006CN1816252A Flexible circuit board compression moulding membrane device
08/09/2006CN1816251A Method of making printed wiring board and method of forming plating film