Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/16/2006 | CN1269991C Method for depositing metal and metal oxide films and patterned films |
08/16/2006 | CN1269633C Novel composite foil and its mfg. method, and copper-coated laminated plate |
08/16/2006 | CN1269612C Solder foil, semiconductor device, electronic device, semiconductor assembly and power assembly |
08/15/2006 | US7092639 EMI shield for reducing clock jitter of a transceiver |
08/15/2006 | US7092255 Thermal management system and method for electronic equipment mounted on coldplates |
08/15/2006 | US7092237 Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
08/15/2006 | US7092050 Liquid crystal device, manufacturing method therefor, and electronic apparatus |
08/15/2006 | US7092000 Pulse light pattern writer |
08/15/2006 | US7091818 Noise suppressor unit for a power source module |
08/15/2006 | US7091803 Signal transmission structure |
08/15/2006 | US7091716 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
08/15/2006 | US7091606 Circuit device and manufacturing method of circuit device and semiconductor module |
08/15/2006 | US7091593 Circuit board with built-in electronic component and method for manufacturing the same |
08/15/2006 | US7091589 Multilayer wiring board and manufacture method thereof |
08/15/2006 | US7091583 Method and structure for prevention leakage of substrate strip |
08/15/2006 | US7091424 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers |
08/15/2006 | US7091066 Method of making circuitized substrate |
08/15/2006 | US7091065 Method of making a center bond flip chip semiconductor carrier |
08/15/2006 | US7091060 Circuit and substrate encapsulation methods |
08/15/2006 | US7090966 Variations in the accumulated illumination intensity of radiation on the surface of the plate are controlled to 20% or less, thus alleviating unevenness of distribution of energy to be irradiated on the plate; forming a conductive film by discharging a liquid material using an ink-jet |
08/15/2006 | US7090896 Thermally treating a sol-gel product of a multifunctional carbosilane |
08/15/2006 | US7090743 Pressure laminator apparatus |
08/15/2006 | US7090517 Electrical connector assembly with pick up cap |
08/15/2006 | US7090506 Signal transmission device having flexible printed circuit boards |
08/15/2006 | US7090505 Connecting method for structure with implantable electrodes |
08/15/2006 | US7090139 IC card and method of manufacturing the same |
08/15/2006 | US7090132 Long range optical reader |
08/15/2006 | US7089661 Method for packaging small size memory cards |
08/15/2006 | US7089660 Method of fabricating a circuit board |
08/15/2006 | US7089659 Method of producing ceramic laminates |
08/15/2006 | US7089657 Fixing holder for fixing an electronic component having wire-shaped leg portions to a printed circuit board |
08/15/2006 | US7089655 System for operating and resetting PCB holding device |
08/15/2006 | US7089646 Methods of manufacturing a printed circuit board shielded against interfering radiation |
08/15/2006 | CA2211540C Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
08/10/2006 | WO2006084064A2 Selective catalytic activation of non-conductive substrates |
08/10/2006 | WO2006082960A1 Jet solder bath |
08/10/2006 | WO2006082959A1 Method for removing fume in reflow furnace and reflow furnace |
08/10/2006 | WO2006082838A1 Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board |
08/10/2006 | WO2006082817A1 Capacitor and wiring board incorporating same |
08/10/2006 | WO2006082785A1 Multilayer printed wiring board |
08/10/2006 | WO2006082784A1 Multilayer printed wiring board |
08/10/2006 | WO2006082783A1 Multilayer printed wiring board |
08/10/2006 | WO2006082699A1 Surface mount electric part |
08/10/2006 | WO2006064977A3 Ceramic aggregate substrate, ceramic substrate and ceramic aggregate substrate fabrication method |
08/10/2006 | WO2005114658A3 Method for making noble metal conductive leads for suspension assemblies |
08/10/2006 | WO2005086549A8 Backup board for machining process |
08/10/2006 | WO2005038070A3 Surface reactive preservative for use with solder preforms |
08/10/2006 | US20060178542 Aromatic ring polymer and low-dielectric material |
08/10/2006 | US20060178479 Non-sticky water-based conformal coating material |
08/10/2006 | US20060178074 Flat panel display device and its method of manufacture |
08/10/2006 | US20060177965 Semiconductor device and process for producing the same |
08/10/2006 | US20060177963 Process for producing copy protection for an electronic circuit |
08/10/2006 | US20060177787 Quartz glass single hole nozzle for feeding fluid and quartz glass multihole burner head for feeding fluid |
08/10/2006 | US20060177568 Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation |
08/10/2006 | US20060177472 Insect repellent coating and industrial product using the same |
08/10/2006 | US20060176675 Multi-layer polymeric electronic device and method of manufacturing same |
08/10/2006 | US20060176327 Method of jetting viscous medium |
08/10/2006 | US20060175321 Methods of forming a variable watt density layered heater |
08/10/2006 | US20060175203 Electroplating pcb components |
08/10/2006 | US20060175187 Stretchable fabric switch |
08/10/2006 | US20060175084 Wiring board and method for fabricating the same |
08/10/2006 | US20060175082 Flexible printed circuit board and connecting method of the same |
08/10/2006 | US20060175081 method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material |
08/10/2006 | US20060175003 Security tag and system for fabricating a tag including an integrated surface processing system |
08/10/2006 | US20060174477 Wiring board provided with a resistor and process for manufacturing the same |
08/10/2006 | DE10343256B4 Anordnung zur Herstellung einer elektrischen Verbindung zwischen einem BGA-Package und einer Signalquelle, sowie Verfahren zum Herstellen einer solchen Verbindung An arrangement for producing an electrical connection between a BGA package and a signal source, and to processes for producing such a compound |
08/09/2006 | EP1689219A2 Sealed electronic module with seal-in-place connector header |
08/09/2006 | EP1688993A2 Standardized bonding location process and apparatus |
08/09/2006 | EP1688992A1 Column suction head and column mounting method |
08/09/2006 | EP1688868A2 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
08/09/2006 | EP1688810A1 Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same |
08/09/2006 | EP1688770A1 Ic chip mounting board, substrate for mother board, device for optical communication, method for manufacturing substrate for mounting ic chip thereon, and method for manufacturing substrate for mother board |
08/09/2006 | EP1688247A1 Metal-clad substrate and method for producing same |
08/09/2006 | EP1688022A1 Electric circuit arrangement |
08/09/2006 | EP1687678A2 Chemically amplified positive photosensitive thermosetting resin composition method of forming cured article and method of producing functional device |
08/09/2006 | EP1687381A1 Formation of self-assembled monolayers |
08/09/2006 | EP1687114A1 Vertical removal of excess solder from a circuit substrate |
08/09/2006 | EP1543083B1 Process and ink for making electronic devices |
08/09/2006 | EP1540193A4 Fastener for assembly and disassembly |
08/09/2006 | EP1273609B1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
08/09/2006 | EP1195079B1 An arrangement for mounting chips in multilayer printed circuit boards |
08/09/2006 | EP0951739B1 High density electrical connectors |
08/09/2006 | CN2805321Y Press fitting equipment |
08/09/2006 | CN2805302Y Patch strut attachment of circuit board |
08/09/2006 | CN2803582Y Improved cylinder of micro aperture switching system for circuit board borer |
08/09/2006 | CN1817075A Gluing method and device |
08/09/2006 | CN1817073A Wiring board member for forming multilayer printed circuit board, method for producing same, and multilayer printed circuit board |
08/09/2006 | CN1817072A Method of manufacturing electronic part and electronic part |
08/09/2006 | CN1817071A Reflow soldering method using pb-free solder alloy and hybrid packaging method and structure |
08/09/2006 | CN1817070A Soft magnetic material for manufacturing printed circuit boards |
08/09/2006 | CN1816918A Light-emitting diode thermal management system |
08/09/2006 | CN1816502A Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition |
08/09/2006 | CN1816258A Method for making hard-soft composite circuit board |
08/09/2006 | CN1816257A Printing-head electromagnet fixing method and device |
08/09/2006 | CN1816256A Film pattern forming method and application of the same |
08/09/2006 | CN1816255A Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus |
08/09/2006 | CN1816254A Method of forming film pattern, device, method of manufacturing the same, electro-optical apparatus, and electronic apparatus |
08/09/2006 | CN1816253A Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus |
08/09/2006 | CN1816252A Flexible circuit board compression moulding membrane device |
08/09/2006 | CN1816251A Method of making printed wiring board and method of forming plating film |