H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2006
11/15/2006	CN1863639A Lead-free solder ball
11/15/2006	CN1863452A Component assembling device
11/15/2006	CN1863449A Isolation structure for preventing electromagnetic interference and making method thereof
11/15/2006	CN1863440A Method and system for inspecting substrate for mounting components and method of producing substrate for mounting components
11/15/2006	CN1863439A Method for improving circuitboard welding quality and air knife device therefor
11/15/2006	CN1863438A Verfahren zum herstellen einer leiterplatte mit darin eingebetteten elektronikkomponenten
11/15/2006	CN1863437A Printing device and use method thereof
11/15/2006	CN1863436A Method of manufacturing a wiring board, a wiring board, a circuit element and a communications device
11/15/2006	CN1863435A Printed wiring board manufacturing method
11/15/2006	CN1863434A Component mounting board structure and production method thereof
11/15/2006	CN1863433A Laminate for printed circuit board and method of manufacturing the same
11/15/2006	CN1863432A Anisotropic conducting film and circuitboard using film
11/15/2006	CN1862259A Inspection standard setting device, inspection standard setting method and process inspection device
11/15/2006	CN1861842A Immersion method
11/15/2006	CN1861397A Screen printing apparatus
11/15/2006	CN1861270A Coating apparatus having vibrator and said coating method
11/15/2006	CN1285244C Method for etching laminated assembly containing polyimide layer
11/15/2006	CN1285242C Distribution base plate, electronic device, electrooptics device and electronic instrument
11/15/2006	CN1285144C Circuit board connector
11/15/2006	CN1284997C Forming method of electro-conductive film, distribution film structural body, electro-optical apparatus and electronic instrument
11/15/2006	CN1284886C Energy enhanced process for treating conductive surface and products formed thereby
11/15/2006	CN1284839C Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part
11/14/2006	US7136714 Procedure for determining modifications made to an electronic card and methods of fabricating an electronic card and an item equipment provided with an electronic card
11/14/2006	US7136276 Solid electrolytic capacitor and mounting method therefor
11/14/2006	US7136133 Active matrix substrate, liquid crystal display apparatus having the same, and method for manufacturing the same
11/14/2006	US7136008 Low cost electromagnetic energy absorbers manufactured from conductive loaded resin-based materials
11/14/2006	US7135777 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
11/14/2006	US7135397 Method and system for packaging ball grid arrays
11/14/2006	US7135394 Conductive layers and fabrication methods thereof
11/14/2006	US7135345 Methods for processing semiconductor devices in a singulated form
11/14/2006	US7135204 Method of manufacturing a wiring board
11/14/2006	US7135203 Continuous reel-to-reel printing process for forming a thin conductive polymer coating over a portion of a flexible circuit in the non-critical region to reduce the measured surface voltage substantially; for making hard disk drives
11/14/2006	US7135119 Method for making a multilayer module with high-density printed circuits
11/14/2006	US7134882 Connector having a built-in electronic part
11/14/2006	US7134879 Anisotropic conductive material body, display apparatus, method for producing the display apparatus, and conductive member
11/14/2006	US7134817 Printed board machining apparatus
11/14/2006	US7134599 Circuit board inspection apparatus
11/14/2006	US7134592 Method and protection apparatus for installation of a temperature-sensitive electronic component
11/14/2006	US7134390 Method and stencil for extruding material on a substrate
11/14/2006	US7134199 Fluxless bumping process
11/14/2006	US7134198 Method for manufacturing electric element built-in module with sealed electric element
11/14/2006	US7134197 Plastic lead frames utilizing reel-to-reel processing
11/14/2006	US7134196 Electronic device and manufacturing same
11/14/2006	US7134195 Method of production of multilayer circuit board with built-in semiconductor chip
11/14/2006	US7134194 Method of developing an electronic module
11/14/2006	US7134193 Method for manufacturing a wiring board
11/14/2006	US7134182 Method to form an embedded micro-pedestal in a conductive layer
11/14/2006	CA2377855C Excimer laser ablation process control of multilaminate materials
11/14/2006	CA2297738C Solid-state energy storage module employing integrated interconnect board
11/09/2006	WO2006118971A2 Generic patterned conductor for customizable electronic devices
11/09/2006	WO2006118239A1 Process for producing double-sided flexible printed board and double-sided flexible printed board
11/09/2006	WO2006118236A1 Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method
11/09/2006	WO2006118230A1 Material for plating and use thereof
11/09/2006	WO2006118181A1 Conductive paste and flexible printed wiring board obtained with the conductive paste
11/09/2006	WO2006118141A1 Multilayer wiring board and method for producing same
11/09/2006	WO2006118138A1 Multifunction soldering apparatus for printed board and soldering method
11/09/2006	WO2006118105A1 Thermosetting resin composition
11/09/2006	WO2006118091A1 Resin for filling into electronic substrate
11/09/2006	WO2006118059A1 Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
11/09/2006	WO2006077167A3 Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method
11/09/2006	WO2006076608A3 A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
11/09/2006	WO2006056643A3 Method for manufacturing an electronics module
11/09/2006	WO2005067693A3 Method and apparatus to create electrical junctions for information routing in textile structures
11/09/2006	US20060253270 Model for modifying drill data to predict hole locations in a panel structure
11/09/2006	US20060252843 Wiring-connecting material and wiring-connected board production process using the same
11/09/2006	US20060252310 Electrical connector
11/09/2006	US20060251871 laminating a porous film made of polytetrafluoroethylene with elasticity suitable for elastic recovery and used as a base film, adhering conductive metal by electroless plating at plural positions of the base film; use in the burn-in test of semiconductor devices
11/09/2006	US20060251823 Kinetic spray coating of powder particles onto a plastic covered substrate without first removing the covering; using a a supersonic nozzle to accelerate particles entrained in a heated gas to force them through a hole in a mask pressed to the surface to remove the plastic and adhere particles
11/09/2006	US20060250781 Electronic module and method for the production thereof
11/09/2006	US20060250451 Structure of flexible printed circuit board
11/09/2006	US20060250447 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
11/09/2006	US20060249858 Stencil and method for depositing material onto a substrate
11/09/2006	US20060249855 Method and apparatus for soldering modules to substrates
11/09/2006	US20060249825 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
11/09/2006	US20060249586 Flexible electrical display
11/09/2006	US20060249304 Circuit board and process for producing the same
11/09/2006	US20060248717 Method of making circuitized substrate with filled isolation border
11/09/2006	US20060248715 Manufacturing method of solid-state image sensing device
11/09/2006	US20060248714 Apparatus and method for storing an electronic component, method for packaging electronic components and method for mounting an electronic component
11/09/2006	DE102006003784A1 Method for electrically joining foil conductors, each conductor has, on upper and lower face, at least one connection zone with metalized contact region
11/09/2006	DE102004014476B4 HF-Anschlussteil für festen Anbau an eine Leiterplatte RF connector for fixed mounting on a printed circuit board
11/09/2006	CA2605613A1 Process for producing double-sided flexible printed board and double-sided flexible printed board
11/09/2006	CA2604614A1 Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method
11/08/2006	EP1720393A2 Multilayered printed wiring board and its manufacture
11/08/2006	EP1720392A2 Multilayered printed wiring board and its manufacture
11/08/2006	EP1720391A2 Double-sided printed circuit board with thermal dissipation
11/08/2006	EP1720390A2 Apparatus and method for making circuitized substrates in a continous manner
11/08/2006	EP1720389A2 Method for forming pattern and a wired board
11/08/2006	EP1720387A1 High current terminal with press fit portion
11/08/2006	EP1720385A2 Conductive connecting pin and package substrate
11/08/2006	EP1720203A2 Multilayer ceramic substrate and production method thereof
11/08/2006	EP1719394A1 Methods of forming tracks and track arrangements
11/08/2006	EP1719393A1 Printed circuit board
11/08/2006	EP1719208A2 Circuit board mounting bracket
11/08/2006	EP1719156A1 Device for singulating and bonding semiconductor chips, and singulating and bonding method
11/08/2006	EP1719121A1 Etched dielectric film in hard disk drives
11/08/2006	EP1719073A1 Method for producing rfid labels
11/08/2006	EP1718785A2 Method for zinc coating aluminum
11/08/2006	EP1718694A1 Etched polycarbonate films
11/08/2006	EP1579031A4 Peel strength enhancement of copper laminates 102426-201

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