| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/18/2006 | US7078650 Micro-machining employing multiple independently focused and independently steered beams |
| 07/18/2006 | US7078629 Multilayer wiring board |
| 07/18/2006 | US7078628 Substrate for circuit wiring |
| 07/18/2006 | US7078330 Metal electrode and bonding method using the metal electrode |
| 07/18/2006 | US7078095 Multilayer; release layer, dielectric adhesive matrix, electroconductivity particles; uniform distribution pattern |
| 07/18/2006 | US7077927 Method of applying an edge electrode pattern to a touch screen |
| 07/18/2006 | US7077908 Substrate holder |
| 07/18/2006 | US7077687 Connecting device to be soldered to circuit boards for connection of electrical conductors, a method for production of the connecting device and a device for connecting conductors to the connecting device |
| 07/18/2006 | US7077678 Electrical connector assembly having board hold down |
| 07/18/2006 | US7077660 Land grid array structures and methods for engineering change |
| 07/18/2006 | US7077659 Separable electrical interconnect with anisotropic conductive elastomer and a rigid adapter |
| 07/18/2006 | US7077305 Ball loading apparatus |
| 07/18/2006 | US7077262 Device and method for conveying and holding plate-like member |
| 07/18/2006 | US7076870 connecting multilayer printed circuits using apertures formed through layers, then sputtering or plating electroconductive plugs having contact pads |
| 07/18/2006 | US7076869 Solid via layer to layer interconnect |
| 07/18/2006 | US7076868 Wiring circuit board having bumps and method of producing same |
| 07/18/2006 | US7076867 press bonding sheets including anisotropic conductive film tapes, film-like components including flexible printed circuit boards, electronic or optics against plasma display panel boards or liquid crystals; supporting |
| 07/18/2006 | US7076862 System, method, and apparatus for installing and removing flat cable with respect to a protective sleeve |
| 07/18/2006 | CA2349081C Printed circuit board connector |
| 07/13/2006 | WO2006073295A1 Anti-static spacer for high temperature curing process of flexible printed circuit board |
| 07/13/2006 | WO2006049776A3 Ink-jet printing of coupling agents for trace or circuit deposition templating |
| 07/13/2006 | WO2005098941A3 Integrated circuit stacking system and method |
| 07/13/2006 | WO2005033798A3 Electrochemical micromanufacturing system and method |
| 07/13/2006 | US20060154499 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box |
| 07/13/2006 | US20060154496 Wiring board incorporating components and process for producing the same |
| 07/13/2006 | US20060154444 Method of forming wiring |
| 07/13/2006 | US20060154099 Multilayer body and method for producing same |
| 07/13/2006 | US20060154095 Mold release film |
| 07/13/2006 | US20060154070 Coated conductive particle coated conductive particle manufacturing method anisotropic conductive material and conductive connection structure |
| 07/13/2006 | US20060154052 Soft magnetic material for manufacturing printed circuit boards |
| 07/13/2006 | US20060154033 applying nonaqueous etch resistant inks comprising acrylic polymers to metals or alloys, then exposing to radiation to effect polymerization, removing exposed metals or alloys by etching and removing the polymerized ink, to form dielectric substrates laminated with an electroconductive metals or alloys |
| 07/13/2006 | US20060153973 Forming a barrier layer within the vias of a dielectric substrate; forming a ruthenium layer on the barrier; exposing a contact layer within the vias by removing material from the bottom surface during a punch-through step; and filling the vias with a copper material; high aspect ratio interconnects |
| 07/13/2006 | US20060152913 Method and apparatus for reducing electromagnetic emissions from electronic circuits |
| 07/13/2006 | US20060152323 Embedded inductor for semiconductor device circuit |
| 07/13/2006 | US20060151877 Semiconductor device and manufacturing method thereof |
| 07/13/2006 | US20060151580 Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| 07/13/2006 | US20060151330 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method |
| 07/13/2006 | US20060151328 Method of electroplating a workpiece having high-aspect ratio holes |
| 07/13/2006 | US20060151210 Microconnector for fpc connection and method of producing the same |
| 07/13/2006 | US20060151203 Encapsulated electronic component and production method |
| 07/13/2006 | US20060150404 Component placement device, nozzle exchange device as well as method for the exchange of nozzles |
| 07/13/2006 | US20060150403 Method and apparatus for inserting, retaining and extracting a device from a compartment |
| 07/13/2006 | DE19920593B4 Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls A chip carrier for a chip module and method of manufacturing the chip module |
| 07/13/2006 | DE19746408B4 Verfahren zum Anbringen eines Bauelements an einem plattenförmigen Träger A method for attaching a component to a plate-shaped carrier |
| 07/13/2006 | DE102005063086A1 Siebdruckverfahren und Vorrichtung hierfür Screen printing method and apparatus therefor |
| 07/13/2006 | DE102005057464A1 Komponente zur Impedanzanpassung Component for impedance matching |
| 07/13/2006 | DE102005020969A1 Füllplattierungsstruktur eines inneren Vialochs und Herstellungsverfahren hierfür Füllplattierungsstruktur an inner via hole and manufacturing method thereof |
| 07/13/2006 | DE102005000655A1 Bilderfassungseinrichtung Image capture device |
| 07/13/2006 | DE102004063773A1 Soldering and bonding of electronic components onto a circuit board is accompanied by cooling by airflow |
| 07/13/2006 | DE102004062028A1 Attaching and aligning sensor module with respect to circuit board, for motor vehicle rotation speed sensor |
| 07/13/2006 | DE102004053557B4 Verfahren und Vorrichtungen zum Drucken leitfähiger Dickfilme über Dickfilmdielektrika Methods and apparatus for printing conductive thick films on Dickfilmdielektrika |
| 07/12/2006 | EP1679149A1 Lead-free solder ball |
| 07/12/2006 | EP1678992A2 Method and device for reflow soldering with volume flow control |
| 07/12/2006 | EP1678991A1 A method of producing a conductive layer on a substrate |
| 07/12/2006 | EP1678990A2 Method and apparatus for the manufacture of electric circuits |
| 07/12/2006 | EP1678989A1 Method of conformal coating using noncontact dispensing |
| 07/12/2006 | EP1678988A1 Printed circuit board including a fuse |
| 07/12/2006 | EP1678789A1 Method of fabricating an rf substrate with selected electrical properties |
| 07/12/2006 | EP1678761A1 Electrical connection of components |
| 07/12/2006 | EP1678759A2 Paste for forming an interconnect and interconnect formed from the paste |
| 07/12/2006 | EP1678751A1 Gripping method and device for removing balls from a bulk container |
| 07/12/2006 | EP1678351A1 Method and system for selectively coating metal surfaces |
| 07/12/2006 | EP1678340A2 Surface reactive preservative for use with solder preforms |
| 07/12/2006 | EP1678288A1 Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards |
| 07/12/2006 | EP1388261B1 Device for arranging a photoelectric transducer at an electric signal processing device |
| 07/12/2006 | EP1269805B1 Electrical circuit and substrate therefor |
| 07/12/2006 | EP1169736B1 Power semiconductor module |
| 07/12/2006 | EP1131168B1 Methods of forming metal contact pads on a metal support substrate |
| 07/12/2006 | CN2796321Y Straight needle cold-heading riveter |
| 07/12/2006 | CN2796320Y Vertical forming machine |
| 07/12/2006 | CN2796307Y Fixing structure of light-emitting diode |
| 07/12/2006 | CN2796306Y Circuit capable of integrating different sound standard and circuit board structure |
| 07/12/2006 | CN2796305Y Silk screen printing positioner for printed circuit board |
| 07/12/2006 | CN2796303Y Welding pad structure of printed circuit |
| 07/12/2006 | CN1802886A Cover for ball-grid array connector |
| 07/12/2006 | CN1802885A Testing of interconnections between stacked circuit boards |
| 07/12/2006 | CN1802884A Electrical connection element, especially for electric tool switches |
| 07/12/2006 | CN1802883A Assembly apparatus and its manufacturing method |
| 07/12/2006 | CN1802743A Layered microelectronic contact and method for fabricating same |
| 07/12/2006 | CN1802452A Electroless gold plating solution |
| 07/12/2006 | CN1802407A Nanoporous laminates |
| 07/12/2006 | CN1802235A Method of soldering or brazing articles having surfaces that are difficult to bond |
| 07/12/2006 | CN1802230A Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| 07/12/2006 | CN1802083A Method for transporting circuit board to tin furnace transmission line and its automatic transfer-machine |
| 07/12/2006 | CN1802074A Automatic assembly machine of jumper switch |
| 07/12/2006 | CN1802073A Electromagnetic pump single/double wave crest generator |
| 07/12/2006 | CN1802072A Paste-tin printing apparatus for non-plane printed circuit board |
| 07/12/2006 | CN1802071A Module substrate and disk apparatus |
| 07/12/2006 | CN1802070A Processing method for punched hole of flexible pressing circuit substrate |
| 07/12/2006 | CN1802069A Substrate with high heat conduction and its making process |
| 07/12/2006 | CN1802068A Circuit board and semiconductor apparatus parts |
| 07/12/2006 | CN1801469A Chip packaging substrate gold finger and contact pad plating nickle gold process |
| 07/12/2006 | CN1800979A Solder resist composition of light-curing single liquid style and printing circuit board use same |
| 07/12/2006 | CN1264394C Method for forming conductive pattern and preparing multi-layer ceramic substrates |
| 07/12/2006 | CN1264393C Selective electroplating method |
| 07/12/2006 | CN1264392C Design method for electroplating of printed circuit board strip |
| 07/12/2006 | CN1264391C Wiring substrate manufacture method |
| 07/12/2006 | CN1264390C Wiring base board and its manufacturing method |
| 07/12/2006 | CN1264389C Electric part assembly and its making method |
| 07/12/2006 | CN1264388C Resin board and use thereof |