Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2006
11/08/2006EP1410403B1 Low temperature method and compositions for producing electrical conductors
11/08/2006EP1214191A4 Treated copper foil and process for making treated copper foil
11/08/2006EP1200340B1 Method for preparing highly stabilised hydroxylamine solutions
11/08/2006CN2836409Y Elastic stop plate with elastic cantilever on welded part
11/08/2006CN2836408Y Elastic stop plate with elastic cantilever on side wall
11/08/2006CN1860835A Method for producing substrates
11/08/2006CN1860834A Method of producing module with embedded component and module with embedded component
11/08/2006CN1860833A Multilayer laminated circuit board
11/08/2006CN1860832A Improved method for micro-roughening treatment of copper and mixed-metal circuitry
11/08/2006CN1860831A Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board
11/08/2006CN1860825A Hearing aid with printed circuit board and microphone suspension
11/08/2006CN1860641A Dielectric resonator, oscillator and transmitter/receiver
11/08/2006CN1860625A Method of fabricating electronic interconnect devices using direct imaging of dielectric composite material
11/08/2006CN1860415A Alkaline developable resin composition
11/08/2006CN1860413A Spin-printing of electronic and display components
11/08/2006CN1860258A Method of preparing printed or daubed image and printed or daubed image element by it
11/08/2006CN1859829A Method for producing circuit board
11/08/2006CN1859828A Copper removing method for lead-free tin spray process in PCB, SMT
11/08/2006CN1859827A Method for preventing golden finger and base board from pollution
11/08/2006CN1859826A Touch inductive circuit board and its producing method
11/08/2006CN1859816A Electric heating mirror and its producing method
11/08/2006CN1284431C Method for manufacturing multilayer wiring substrate
11/08/2006CN1284430C Substrate adhesion enhancement to film
11/08/2006CN1284429C Using method of grouping element in wiring layout
11/08/2006CN1284428C Self-aligned coaxial via capacitors
11/08/2006CN1284426C Via-in-pad with off-center geometry and method of manufacture
11/08/2006CN1284425C Thermophilic polyimide polymer and cast-on-copper circuit board
11/08/2006CN1284424C Multilayer printed circuit board
11/08/2006CN1284276C Anti-wicking board to board connector
11/08/2006CN1284234C Ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
11/08/2006CN1284230C 高频模块 High-frequency module
11/08/2006CN1284206C Non-planography through selective reaction for producing mask, its products and compsns. for such method
11/08/2006CN1284046C Photosensitive resin composition, photosensitive element, resist pattern, method for producing resist pattern, and substrate having the resist pattern laminated thereon
11/08/2006CN1284017C Device for arranging a photoelectric transducer at an electric signal processing device
11/08/2006CN1283848C Method of copper-plating small-diameter holes
11/08/2006CN1283457C Extrusion head for lamination press
11/08/2006CN1283408C Laser processing device
11/08/2006CN1283371C UV-urable inks for PTF laminates (including flxible circuitry)
11/08/2006CN1283205C Dedusting cleaner
11/07/2006US7133797 Method, apparatus, system, program and medium for inspecting a circuit board and an apparatus incorporating the circuit board
11/07/2006US7133259 Head suspension for disk drive and method of manufacturing head suspension
11/07/2006US7133037 Signal transmission system
11/07/2006US7132843 Method and apparatus for positioning a test head on a printed circuit board
11/07/2006US7132756 Semiconductor device and method for manufacturing the same
11/07/2006US7132745 Method for attaching shields on substrates
11/07/2006US7132742 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
11/07/2006US7132738 Semiconductor device having multiple semiconductor chips stacked in layers and method for manufacturing the same, circuit substrate and electronic apparatus
11/07/2006US7132628 Variable watt density layered heater
11/07/2006US7132608 Electronic device having side electrode, method of manufacturing the same, and apparatus using the same
11/07/2006US7132607 Wired circuit board
11/07/2006US7132599 Circuit board
11/07/2006US7132366 Method for fabricating semiconductor components using conductive layer and grooves
11/07/2006US7132357 Method for shielding printed circuit board circuits
11/07/2006US7132168 Printed circuit board that includes a solder resist has a photocurable and thermosetting resin composition derived from the reaction of a multifunctional oxetane compound, an acrylic acid, where the hydroxy group of the subsequent acrylate ester is reacted with an acid anhydride to form carboxyl groups
11/07/2006US7132158 Support layer for thin copper foil
11/07/2006US7132029 Multilayer circuit board and method for manufacturing the same
11/07/2006US7132020 Solder for use on surfaces coated with nickel by electroless plating
11/07/2006US7131861 Connection device for flexible circuit
11/07/2006US7131848 Helical microelectronic contact and method for fabricating same
11/07/2006US7131800 Circuit board router apparatus and method thereof
11/07/2006US7131566 Packaging method using lead-free solder
11/07/2006US7131483 Apparatus, mold, and method for manufacturing metal-ceramic composite member
11/07/2006US7131195 Method for forming metal contacts on a substrate
11/07/2006US7131194 Method of manufacturing a device
11/07/2006US7131193 Heat-shrinkable retainer for PCB double-sided assembly
11/07/2006US7131192 Method of manufacturing printed circuit boards using miniature contact block packagings
11/07/2006US7131174 Ceramic electronic device and method of production of same
11/07/2006CA2213590C Flexible circuit connector and method of making same
11/02/2006WO2006115146A1 Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board
11/02/2006WO2006114974A1 Process for producing ceramic substrate, and ceramic substrate
11/02/2006WO2006114928A1 High frequency module
11/02/2006WO2006076610A3 Controlling ink migration during the formation of printable electronic features
11/02/2006WO2006076606A3 Optimized multi-layer printing of electronics and displays
11/02/2006WO2005094409B1 Process for preparing a non-conductive substrate for electroplating
11/02/2006US20060246702 Non-solder mask defined (nsmd) type wiring substrate for ball grid array (bga) package and method for manufacturing such a wiring substrate
11/02/2006US20060246690 Electro-chemical deposition system
11/02/2006US20060246295 Thick-film sheet member, devices to which the sheet member is applied, and methods of producing the sheet member and the devices
11/02/2006US20060246279 Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
11/02/2006US20060245696 Optical module and optical transmitter/receiver device
11/02/2006US20060245637 Systems for detecting defects in printed solder paste
11/02/2006US20060244886 Process of surface treatment, surface treating device, surface treated plate, and electro-optic device, and electronic equipment
11/02/2006US20060244475 Compliant contact pin test assembly and methods thereof
11/02/2006US20060244141 Bow control in an electronic package
11/02/2006US20060244137 Semiconductor package board using a metal base
11/02/2006US20060244134 Multilayer printed wiring board
11/02/2006US20060244123 Composite electronic component
11/02/2006US20060244119 Circuit board with built-in electronic component and method for manufacturing the same
11/02/2006US20060244113 Leadless leadframe electronic package and sensor module incorporating same
11/02/2006US20060243483 Semiconductor device assemblies with compliant spring contact structures
11/02/2006US20060243478 Multilayer printed wiring board
11/02/2006US20060242828 Fabrication of compliant spring contact structures and use thereof
11/02/2006US20060242827 Method for producing circuit-forming board and material for producing circuit-forming board
11/02/2006US20060242826 Method of manufacturing a metal-ceramic circuit board
11/02/2006US20060242825 Method of making a circuitized substrate
11/02/2006EP1718139A2 Method for manufacturing a circuit board
11/02/2006EP1718138A2 Technique for compensating for substrate shrinkage during manufacture of an electronic assembly
11/02/2006EP1718137A2 Three-dimensional circuit module and method of manufacturing the same
11/02/2006EP1717851A1 Circuit-connecting material and circuit terminal connected structure and connecting method
11/02/2006EP1717033A2 Electric component, method of forming conductive pattern, and inkjet head
11/02/2006EP1717029A2 Screen printer