| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/10/2006 | US7120033 Electrically conducting bonding connection |
| 10/10/2006 | US7120031 Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors |
| 10/10/2006 | US7120024 Electronic control device |
| 10/10/2006 | US7119801 Display device and electronic apparatus |
| 10/10/2006 | US7119685 Method for aligning capacitor plates in a security tag and a capacitor formed thereby |
| 10/10/2006 | US7119671 Seat buckle sensor |
| 10/10/2006 | US7119565 Chip carrier and method for testing electrical performance of passive component |
| 10/10/2006 | US7119438 Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device |
| 10/10/2006 | US7119430 Spacer for mounting a chip package to a substrate |
| 10/10/2006 | US7119285 Flexible printed circuit board |
| 10/10/2006 | US7119026 Basic material for patterning and patterning method |
| 10/10/2006 | US7119003 Extension of fatigue life for C4 solder ball to chip connection |
| 10/10/2006 | US7118984 Method for fabricating semiconductor component |
| 10/10/2006 | US7118837 Photoimaged dielectric polymer and film, and circuit package containing the same |
| 10/10/2006 | US7118817 Coin cell protection against reverse insertion in cell holder |
| 10/10/2006 | US7118798 Polyimide-metal layered products and polyamideimide-metal layered product |
| 10/10/2006 | US7118664 plating in fine channels or in opening portions in a resist formed on a substrate surface after deaerating dissolved gas in the plating solution without needing to add a surface active agent |
| 10/10/2006 | US7118646 potting material is used to mechanically secure the circuit board to the housing and to provide an environmental seal at the open end of the housing |
| 10/10/2006 | US7118389 Stud bump socket |
| 10/10/2006 | US7118199 Liquid jet recording head |
| 10/10/2006 | US7117592 Method of manufacturing a connector |
| 10/10/2006 | US7117589 Method of installing a plug and play device driver |
| 10/10/2006 | US7117588 Method for assembling tiled detectors for ionizing radiation based image detection |
| 10/10/2006 | US7117587 Method for fabricating a substrate, including a plurality of chip package substrates |
| 10/05/2006 | WO2006104792A1 Method for making rfid device antennas |
| 10/05/2006 | WO2006104279A1 Surface graft material and its manufacturing method, electrically conductive material and its manufacturing method, and electrically conductive pattern material |
| 10/05/2006 | WO2006104238A1 Production method of solder circuit board |
| 10/05/2006 | WO2006104032A1 Electronic part mounting structure |
| 10/05/2006 | WO2006103979A1 (meth)acryloyl group-containing aromatic isocyanate compound and production process thereof |
| 10/05/2006 | WO2006103948A1 Flip chip mounting method and bump forming method |
| 10/05/2006 | WO2006103847A1 Conductor paste and electronic component |
| 10/05/2006 | WO2006103766A1 Ball capturing device, solder ball arrangement device, ball capturing method, and solder ball arranging method |
| 10/05/2006 | WO2006103299A1 Low- thickness electronic module comprising a pile of electronic package provided with connection balls |
| 10/05/2006 | WO2006007141A3 Lead solder indicator and method |
| 10/05/2006 | US20060223732 Being lead-free or high melting, with a mixture of benzyl alcohol, a glycol ether, and an amino alcohol such as diethanolamine, and then rinsing with ethanol; electronics |
| 10/05/2006 | US20060223345 Sockets for "springed" semiconductor devices |
| 10/05/2006 | US20060223331 Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
| 10/05/2006 | US20060223307 Process for producing electornic component and electronic component |
| 10/05/2006 | US20060223230 Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
| 10/05/2006 | US20060222234 Inspection system for and method of inspecting deposits printed on workpieces |
| 10/05/2006 | US20060221587 Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board |
| 10/05/2006 | US20060221586 Packaging substrate having adhesive-overflowing prevention structure |
| 10/05/2006 | US20060220665 Alignment fences and devices and assemblies including the same |
| 10/05/2006 | US20060220229 Methods and apparatus for a flexible circuit interposer |
| 10/05/2006 | US20060220228 Methods and apparatus for a flexible circuit interposer |
| 10/05/2006 | US20060220219 Substrate for IC package |
| 10/05/2006 | US20060219985 Coating surface of roughly spherical copper powder with silver; coating a surface of the roughly spherical and silver-plated copper powder with aliphatic acid; smoothening coated layer of the silver; uniformly mixing the copper powder which is roughly spherical and coated with silver and aliphatic acid |
| 10/05/2006 | US20060219429 Multilayer wiring board and its manufacturing method |
| 10/05/2006 | US20060219428 Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor |
| 10/05/2006 | US20060218782 Method for manufacturing an electronic module |
| 10/05/2006 | US20060218781 Electronic-component alignment method and apparatus therefor |
| 10/05/2006 | US20060218779 Resistor element, stress sensor, and method for manufacturing them |
| 10/05/2006 | DE19855023B4 Verfahren zum Aufbringen von Leiterstrukturen auf beliebig geformte Oberflächen A method for applying conductor patterns to surfaces of any shape |
| 10/05/2006 | DE19825836B4 Verfahren zum Aufbringen wenigstens einer Dickschicht-Heizleiterbahn auf einen Wasserbehälter und Wasserbehälter A method for applying at least one thick film conductive heating on a water tank and water tank |
| 10/05/2006 | DE19615481B4 Gewölbtes Metall-Keramik-Substrat Corrugated metal-ceramic substrate |
| 10/05/2006 | DE112004002009T5 Laserbearbeitung eines lokal erhitzten Zielmaterials Laser processing of a locally heated target material |
| 10/05/2006 | DE10354694B4 Induktiver Sensor Inductive sensor |
| 10/05/2006 | DE102006013412A1 Substrate assembly has substrate forming slot adjacent to conductive path, flat band wire cable with freely lying end section stick in slot and including solder connected and electric conductively contacting with path |
| 10/05/2006 | DE102006012291A1 Printed circuit board drilling or boring device, uses annular body for removing drilling chips from boring tool in two radial planes |
| 10/05/2006 | DE102005015205A1 Printed circuit board for e.g. fuse in motor vehicle power distributor, has conductor layer comprising area that is formed as part of edge of recess, where part contacts and accommodates contact unit to be contacted with layer |
| 10/05/2006 | DE102005015109A1 Semiconductor chip assembling method, involves lifting component region of chip from substrate such that region indirectly contacts substrate via soldering material and chip is assembled on substrate by flip-chip technique |
| 10/05/2006 | DE102005014162A1 Heat sink fixing device for use on circuit board, has U-shaped course with base part, and side pieces bent at ends of base part, where device is spring elastically designed and is in the form of spring clamp |
| 10/05/2006 | DE102005013763A1 Verfahren zur Herstellung eines elektronischen Gerätes und elektronisches Gerät A process for producing an electronic device and electronic device |
| 10/05/2006 | DE102005013599A1 Verfahren zum Reparaturlöten vielpoliger Miniatur-Steckverbinder A method of repair soldering multi-pole miniature connectors |
| 10/04/2006 | EP1708554A1 Multilayer printed wiring board and test body for printed wiring board |
| 10/04/2006 | EP1708553A2 Secondary battery protecting module and lead mounting method |
| 10/04/2006 | EP1708552A2 Method of production of circuit board utilizing electroplating |
| 10/04/2006 | EP1708551A1 Land structure, printed wiring board, and electronic device |
| 10/04/2006 | EP1708258A1 Composite ceramic substrate |
| 10/04/2006 | EP1707315A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components |
| 10/04/2006 | EP1707037A1 Method for the production of a circuit board element and circuit board element |
| 10/04/2006 | EP1706844A2 Method and system for manufacturing radio frequency identification tag antennas |
| 10/04/2006 | EP1706789A1 Photographic materials having improved keeping properties |
| 10/04/2006 | EP1623483B1 Contacting device for a flexible ribbon conductor |
| 10/04/2006 | EP1573806B1 Surface mountable clip suitable for use in a mobile communication device |
| 10/04/2006 | EP1436605A4 Sensor substrate and method of fabricating same |
| 10/04/2006 | EP1419559B1 Electromagnetic emission reduction technique for shielded connectors |
| 10/04/2006 | EP1380193A4 A method for forming a printed circuit board and a printed circuit board formed thereby |
| 10/04/2006 | EP1194025B1 Multilayer printed wiring board |
| 10/04/2006 | EP1120214B1 Sheet retainer for punching ceramic green sheet and punching device |
| 10/04/2006 | EP0979854B1 Circuit connecting material, and structure and method of connecting circuit terminal |
| 10/04/2006 | CN2824518Y Mobile terminal apparatus with heat storage material |
| 10/04/2006 | CN2824506Y Replacing structure of poor printed circuit module in printed circuit board |
| 10/04/2006 | CN2824505Y Embedded combined composite circuitboard |
| 10/04/2006 | CN2824504Y Chip circuitboard connected with main circuitboard by plugging part |
| 10/04/2006 | CN1843067A Metal pattern and process for producing the same |
| 10/04/2006 | CN1843066A Method of patterning an electroconductive layer on a support |
| 10/04/2006 | CN1842945A Lamp base for a high-pressure discharge lamp, and corresponding high-pressure discharge lamp |
| 10/04/2006 | CN1842910A 复合电子部件 Composite electronic component |
| 10/04/2006 | CN1842879A Printed circuit board with integrated inductor |
| 10/04/2006 | CN1842742A Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing printed wiring board, and method for removing photocured product |
| 10/04/2006 | CN1842543A Photopatterning of conductive electrode layers containing electrically-conductive polymer particles |
| 10/04/2006 | CN1842255A Method of manufacturing multi-layered substrate |
| 10/04/2006 | CN1842254A Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor |
| 10/04/2006 | CN1842253A Production technique for surface mounting multi-layer resistive plate |
| 10/04/2006 | CN1842252A Method for manufacturing bonded substrates and substrates for use in the bonded substrates |
| 10/04/2006 | CN1842251A Wiping mechanism |
| 10/04/2006 | CN1842250A Light source device and method for manufacturing same |
| 10/04/2006 | CN1842249A High precision connector member and manufacturing method thereof |
| 10/04/2006 | CN1842248A Off-grid decoupling device and method of ball grid array (BGA) |