| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/31/2006 | WO2006090051A1 Method for forming electrically conductive patterns on an insulating substrate, and resulting device |
| 08/31/2006 | WO2006090050A1 Method for producing electrically conductive patterns on a non-developable surface of an insulating substrate, and resulting device |
| 08/31/2006 | WO2006090013A1 Interlocking means |
| 08/31/2006 | WO2006074902A3 Method for depositing palladium layers and palladium bath therefor |
| 08/31/2006 | WO2006058622A3 Method and device for producing structures from functional materials |
| 08/31/2006 | WO2006004929A3 Electrochemical deposition method utilizing microdroplets of solution |
| 08/31/2006 | WO2005089204A3 Maximizing capacitance per unit area while minimizing signal transmission delay in pcb |
| 08/31/2006 | WO2005076206A8 Method and device for continuously producing electronic film components, and an electronic film component |
| 08/31/2006 | US20060194920 Thermally conductive adhesive composition and process for device attachment |
| 08/31/2006 | US20060194514 Jet singulation |
| 08/31/2006 | US20060194369 Carrier for substrate film |
| 08/31/2006 | US20060194156 Method for forming patterned insulating elements and methods for making electron source and image display device |
| 08/31/2006 | US20060193116 Package for high frequency usages and its manufacturing method |
| 08/31/2006 | US20060192845 Methods and systems for thermal-based laser processing a multi-material device |
| 08/31/2006 | US20060192572 Method and structure for measuring a bonding resistance |
| 08/31/2006 | US20060191976 Flow soldering apparatus |
| 08/31/2006 | US20060191882 Systems and methods for forming apertures in microfeature workpieces |
| 08/31/2006 | US20060191869 Method for roughening copper surfaces for bonding to substrates |
| 08/31/2006 | US20060191798 Electrolytic copper foil with low roughness surface and process for producing the same |
| 08/31/2006 | US20060191715 Multilayer circuit board and manufacturing method thereof |
| 08/31/2006 | US20060191714 High frequency multilayer circuit structure and method for the manufacture thereof |
| 08/31/2006 | US20060191712 Interconnect |
| 08/31/2006 | US20060191711 Embedded chip printed circuit board and method of manufacturing the same |
| 08/31/2006 | US20060191710 Multilayer printed wiring board and a process of producing same |
| 08/31/2006 | US20060191709 Printed circuit board, flip chip ball grid array board and method of fabricating the same |
| 08/31/2006 | US20060191708 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 08/31/2006 | US20060191707 Circuit board and method for producing the same |
| 08/31/2006 | US20060191632 Method for producing flexible metal foil-polyimide laminate |
| 08/31/2006 | US20060191136 Method Of Making Microelectronic Spring Contact Array |
| 08/31/2006 | US20060191134 Patch substrate for external connection |
| 08/31/2006 | US20060191133 Multilayer board and its manufacturing method |
| 08/31/2006 | US20060191131 Electronic part mounting apparatus |
| 08/31/2006 | DE202006005208U1 Multi-layered backplane for data processing and telecommunications technique, has two printed circuit boards, where current-carrying conductors are provided only on rigid board and data transmission lines are provided only on other board |
| 08/31/2006 | DE19928225B4 Verfahren zur Herstellung von Mehrlagen-Hybriden A process for producing multi-layer hybrids |
| 08/31/2006 | DE19908979B4 Anschlusssockel mit darin eingeschobenem Halbleiterbauteil für photoelektrische Elemente Terminal block with inserted therein semiconductor device for photoelectric elements |
| 08/31/2006 | DE10324043B4 Kartenförmiger elektronischer Datenträger, Funktionsinlett dafür und ihre Herstellungsverfahren A card-shaped electronic media, Funktionsinlett for it and its manufacturing method |
| 08/31/2006 | DE10319525B4 Bandförmige Anordnung mit einer Leiterbahnstruktur und mit damit elektrisch verbundenen elektronischen Bauteilen, insbesondere Lichtband mit Leuchtelementen Strip-type arrangement with a printed conductor structure and electrically connected thereto with electronic components, in particular strip lighting with light emitting elements |
| 08/31/2006 | DE102005008878A1 Verfahren zur Bestimmung der Position eines Fräswerkzeuges und ein zur Durchführung des Verfahrens bestimmter Bearbeitungskopf A method for determining the position of a milling tool and a specific method for carrying out the machining head |
| 08/31/2006 | DE102005007772A1 Foil with printed aerial for use in radio frequency identification chip, with aerial consisting of conductive print ink |
| 08/31/2006 | DE102004040414B4 Verfahren zur Herstellung eines Verdrahtungssubstrats eines Halbleiterbauteils mit Außenkontaktanschlussflecken für Außenkontakte Process for the preparation of a wiring substrate of a semiconductor device with external contact pads for external contacts |
| 08/31/2006 | DE10158809B4 Herstellungsverfahren für eine Leiterbahn auf einem Substrat und eine entsprechende Leiterbahn Manufacturing method of a conductor track on a substrate and a corresponding conductor track |
| 08/31/2006 | CA2595302A1 Method of making multilayered construction for use in resistors and capacitors |
| 08/31/2006 | CA2593752A1 Wave solder nozzle with an exit trough having a weir, a surface of the through being wettable by solder; a wave soldering machine with such nozzle; a method of improving the flow of solder out of a wave solder nozzle |
| 08/30/2006 | EP1696716A1 Multilayer printed wiring board |
| 08/30/2006 | EP1696715A2 Soldering method and structure manufactured by using this soldering method |
| 08/30/2006 | EP1696714A2 Multilayer printed wiring board |
| 08/30/2006 | EP1696006A1 metal ink and substrate for a display and method for manufacturing the same |
| 08/30/2006 | EP1695600A1 Printed circuits on shrink film |
| 08/30/2006 | EP1695360A2 Printed circuit embedded capacitors |
| 08/30/2006 | EP1694886A2 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 08/30/2006 | EP1490450B1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 08/30/2006 | EP1252966B1 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
| 08/30/2006 | EP1121799B1 Image sensor mounted by mass reflow |
| 08/30/2006 | EP0993039B1 Substrate for mounting semiconductor chips |
| 08/30/2006 | CN1826845A Land grid array connector |
| 08/30/2006 | CN1826844A Solder ball loading method and solder ball loading unit |
| 08/30/2006 | CN1826689A Wiring board embedded with spherical semiconductor element |
| 08/30/2006 | CN1826664A Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
| 08/30/2006 | CN1826048A Method for binding IC chip and flexible circuitboard on panel display |
| 08/30/2006 | CN1826037A Rigid flexible printed circuit board and method of fabricating same |
| 08/30/2006 | CN1826036A Manufacture of digitizer surface |
| 08/30/2006 | CN1826035A Method for making single-face hollowed-out board |
| 08/30/2006 | CN1826034A Wired circuit board assembly |
| 08/30/2006 | CN1825581A Printed circuit board, flip chip ball grid array board and method of fabricating the same |
| 08/30/2006 | CN1825560A Method for preparing copper conductor for plane display substrate |
| 08/30/2006 | CN1825099A General view test device and general view test method |
| 08/30/2006 | CN1824842A Process and apparatus for continuous electrochemical treatment of pieces |
| 08/30/2006 | CN1824484A Molded part and electronic device comprising said molded part |
| 08/30/2006 | CN1824460A Method for determining the position of a milling tool and a machining head designed for carrying out the method |
| 08/30/2006 | CN1272876C Assembly unit for mounting electric element on flexible cable |
| 08/30/2006 | CN1272849C Flexible electronic device |
| 08/30/2006 | CN1272839C Apparatus for installing semiconductor chip |
| 08/30/2006 | CN1272837C Semiconductor device and circuit substrate |
| 08/30/2006 | CN1272635C Circuit distribution inspection device, circuit distribution inspection method, and recording medium |
| 08/30/2006 | CN1272632C Wafer-level burn-in and test |
| 08/30/2006 | CN1272234C Method for forming microelectronic spring structures on a substrate |
| 08/30/2006 | CN1272138C System and method for unveiling targets embedded in a multi-layered electrical circuit |
| 08/30/2006 | CN1272129C Automatic test method for cutting edges of drill bit dedicated to PC board |
| 08/29/2006 | US7098534 Sacrificial component |
| 08/29/2006 | US7098533 Printed circuit board with a heat dissipation element and package comprising the printed circuit board |
| 08/29/2006 | US7098532 Ceramic package and chip resistor, and methods for production of the same |
| 08/29/2006 | US7098531 Jumper chip component and mounting structure therefor |
| 08/29/2006 | US7098528 Embedded redistribution interposer for footprint compatible chip package conversion |
| 08/29/2006 | US7098475 Apparatuses configured to engage a conductive pad |
| 08/29/2006 | US7098423 Laser machining apparatus |
| 08/29/2006 | US7098407 Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate |
| 08/29/2006 | US7098396 Method and apparatus for making a lid with an optically transmissive window |
| 08/29/2006 | US7098163 Depositing an ink comprising a liquid vehicle, particulate support phase and molecular precursor to active species phase; heating ink to convert molecular precursor to active species phase dispersed on support phase and form a catalyst layer |
| 08/29/2006 | US7098136 Structure having flush circuit features and method of making |
| 08/29/2006 | US7098132 Method of manufacturing flexible wiring board |
| 08/29/2006 | US7098126 Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints |
| 08/29/2006 | US7098081 Semiconductor device and method of manufacturing the device |
| 08/29/2006 | US7098071 Method for flip chip bonding by utilizing an interposer with embedded bumps |
| 08/29/2006 | US7097958 Mixture of epoxy and phenolic resins, latent curing agents and photosensitive acid generator |
| 08/29/2006 | US7097915 Multilayer; pressing layers; heat conductive metallic core with coating; cold plating; surface hardness |
| 08/29/2006 | US7097801 Method of making an integrated mold product |
| 08/29/2006 | US7097788 Conducting inks |
| 08/29/2006 | US7097495 System and methods for connecting electrical components |
| 08/29/2006 | US7097462 Patch substrate for external connection |
| 08/29/2006 | US7097394 Circuit board production method and circuit board production data |