Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2006
10/04/2006CN1842245A Electronic assembly with conductive layer and conductive film and its producing method
10/04/2006CN1842239A Electronic device substrate, electronic device, method of manufacturing electronic device
10/04/2006CN1841726A 电路装置及其制造方法 Circuit device and manufacturing method thereof
10/04/2006CN1841719A Multilayer wiring board and its manufacturing method
10/04/2006CN1841691A Method and apparatus for bonding electronic components
10/04/2006CN1841686A Method for producing flexible printed wiring board, and flexible printed wiring board
10/04/2006CN1841202A Exposure worktable and exposure device
10/04/2006CN1841049A Welding disk pattern inspection method and inspection device
10/04/2006CN1840598A Adhesive sheet for fixing flexible print circuit board and containing method of electronic part on flexible print circuit board
10/04/2006CN1840592A Method for manufacturing printed circuit board using ag-pd alloy nanoparticles
10/04/2006CN1840276A Conductive ball mounting method, and apparatus therefor
10/04/2006CN1278593C Method for preparing epiphragma for flexible printed circuit board
10/04/2006CN1278592C 阻抗测量结构 Impedance measurement structure
10/04/2006CN1278460C Bayonet connector, its mfg. method, electronic insertion sheet and electronic appliance
10/04/2006CN1278455C Printed circuit board for containing differential pair contact terminal part of plug
10/04/2006CN1278451C Apparatus and methods to pre-stress anisotropic conductive elastomer meterials
10/04/2006CN1278447C Grouped element transmission channel link termination assemblies
10/04/2006CN1278413C Semiconductor element and method of manufacturing and multi-layer printed wiring board and mfg. method
10/04/2006CN1278401C Manufacturing method for mounting substrate and method for making circuit device
10/04/2006CN1278400C Method for forming convex point on back side of single side flexible substrate
10/04/2006CN1278399C Process for making multiplayer wire distributed board having film capacitor
10/04/2006CN1278337C Conductive powder and producing method thereof
10/04/2006CN1278128C Method for checking linewidth of power wire in wiring overall arrangement
10/04/2006CN1278100C Printed circuit board blind hole quality analysing method
10/04/2006CN1277965C Length-measuring staying device for weft
10/04/2006CN1277958C Electroplating method
10/04/2006CN1277876C Hot-pressed blotter rubber and manufacture thereof
10/04/2006CN1277673C Vacuum printing mechanism
10/04/2006CN1277672C Screen printing plate and its producing method and device
10/04/2006CN1277648C Laser drilling method
10/03/2006US7117459 Layout check system
10/03/2006US7116522 System and method related to a flexible circuit
10/03/2006US7116299 Liquid crystal display device
10/03/2006US7116208 Printed-circuit board with fuse
10/03/2006US7116184 Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture
10/03/2006US7116179 Crystal oscillator
10/03/2006US7116118 Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
10/03/2006US7115996 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
10/03/2006US7115844 Flexible electric circuit for heating comprising a metallised fabric
10/03/2006US7115818 Flexible multilayer wiring board and manufacture method thereof
10/03/2006US7115673 Photosensitive resin composition, porous resin, circuit board, and wireless suspension board
10/03/2006US7115507 Patterning method
10/03/2006US7115495 Methods of making projected contact structures for engaging bumped semiconductor devices
10/03/2006US7115435 Manufacturing method for wiring substrates
10/03/2006US7115432 Base pattern forming material for electrode and wiring material absorption, electrode and wiring forming method, and method of manufacturing image forming apparatus
10/03/2006US7115302 Paste coating method
10/03/2006US7115218 Low temperature method and composition for producing electrical conductors
10/03/2006US7114960 Compliant interconnect assembly
10/03/2006US7114831 Mounting arrangement for light emitting diodes
10/03/2006US7114802 Pattern formation method and substrate manufacturing apparatus
10/03/2006US7114693 Stable cell platform
10/03/2006US7114448 Method for large-area patterning dissolved polymers by making use of an active stamp
10/03/2006US7114371 Integration of atmospheric intrusion sensors in electronic component packages
10/03/2006US7114251 Method of producing of circuit board; for semiconductor device
10/03/2006US7114250 Method of making components with releasable leads
10/03/2006US7114249 Substrate inspecting method and substrate inspecting apparatus using the method
10/03/2006US7114246 Method for handling boards in a component mounting machine and a component mounting machine for performing the method
10/03/2006US7114245 Component holding head, component mounting apparatus using same, and component mounting method
10/03/2006CA2338237C Folded insulated foil conductor and method of making same
09/2006
09/28/2006WO2006101862A1 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
09/28/2006WO2006101460A1 Embedded capacitor structure
09/28/2006WO2006101134A1 Multi-layer printed circuit board
09/28/2006WO2006101124A1 Heating device, reflow device, heating method, and bump forming method
09/28/2006WO2006100899A1 Jet solder vessel
09/28/2006WO2006100817A1 Pattern forming material, pattern forming apparatus, and pattern forming method
09/28/2006WO2006100790A1 Process for producing wiring board, and wiring board
09/28/2006WO2006100764A1 Printed wiring board
09/28/2006WO2006100746A1 Electronic component and circuit board
09/28/2006WO2006100467A1 Treatment of flexible web material
09/28/2006WO2006100460A1 Treatment of items
09/28/2006WO2006099811A1 A printed circuit board assembly and the manufacturing method thereof
09/28/2006WO2006099713A1 Device and applications for passive rf components in leadframes
09/28/2006US20060217909 Method and device for electromagnetic field analysis of circuit board, and circuit board and its design method
09/28/2006US20060217277 Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards
09/28/2006US20060216927 Methods and systems for processing a device, methods and systems for modeling same and the device
09/28/2006US20060216502 Bonding sheet and on-side metal-clad laminate
09/28/2006US20060216486 Entry board suitable for use during drilling of an integrated circuit board
09/28/2006US20060215420 Direct backlight module
09/28/2006US20060215382 Integrated circuit carrier
09/28/2006US20060215376 Secondary battery protecting module and lead mounting method
09/28/2006US20060213885 Micro-machining employing multiple independently focused and independently steered beams
09/28/2006US20060213685 Single or multi-layer printed circuit board with improved edge via design
09/28/2006US20060213683 Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
09/28/2006US20060213613 Process for manufacturing printed circuit boards and a machine for this purpose
09/28/2006US20060213609 RFID label technique
09/28/2006US20060213602 Electrode is formed on surface of transparent base member and photosensitive slurry containing dielectric powder is applied thereon; photosensitive slurry is exposed from backside of base member up to predetermined thickness, and subjected to development; excellent uniformity in thickness; cell phones
09/28/2006US20060213060 Die attach methods and apparatus for micro-fluid ejection device
09/28/2006US20060213058 Circuit board for surface-mount device to be mounted thereon
09/28/2006US20060213052 Apparatus and method of application and development
09/28/2006US20060213044 Component comprising a variable capacitor
09/28/2006US20060213043 Piezoelectric element and method for manufacturing the same, ink jet recording head and ink jet printer
09/28/2006DE202006011765U1 Printed circuit board connecting system for rigid, flexible boards has flexible foil having projecting area that protrudes in arc shape and is springy
09/28/2006DE10235311B4 Flexibles Leiterelement Flexible conductor element
09/28/2006DE102006002483A1 Double printed circuit board for connecting components, has pin press-fitted through holes of boards, and having compliant portions formed at upper and lower portions of pin body to electrically connect boards, respectively
09/28/2006DE10147890B4 Verfahren zur Herstellung eines Substrats aus Keramikmaterial mit einer strukturierten Metallschicht und derartiges Substrat A method of manufacturing a substrate made of ceramic material having a structured metal layer and such a substrate
09/28/2006DE10113912B4 Elektronische Vorrichtung Electronic device
09/28/2006CA2595402A1 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
09/27/2006EP1705974A2 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
09/27/2006EP1705973A2 Build-up mulitlayer printed circuit board
09/27/2006EP1705972A1 Multilayer printed wiring board