| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 09/27/2006 | EP1705971A2 Electronic component disposing device and electronic component disposing method |
| 09/27/2006 | EP1705970A2 Distributor comprising a circuit board |
| 09/27/2006 | EP1705969A2 Electronic assembly having a substrate laminated within a backplate cavity |
| 09/27/2006 | EP1705099A2 Control unit and method of manufacturing the same |
| 09/27/2006 | EP1705029A1 Screen for screen printing |
| 09/27/2006 | EP1704761A1 Method for gluing a circuit component to a circuit board |
| 09/27/2006 | EP1704759A1 Nozzle arrangement and method for processing a material for processing with a processing medium |
| 09/27/2006 | EP1704758A1 Method for the production of an electromagnetic component |
| 09/27/2006 | EP1704572A1 Flexible carrier with an electrically conducting structure |
| 09/27/2006 | EP1704441A1 Method for gravure printing transparent electrodes, and ink composition therefor |
| 09/27/2006 | EP1704168A1 Uv for ink jet printer |
| 09/27/2006 | EP1543703B1 Plating process |
| 09/27/2006 | EP1195081B1 Transition between asymmetric stripline and microstrip in cavity |
| 09/27/2006 | EP1190607B1 Integrated circuits with copper metallization for interconnections |
| 09/27/2006 | EP1061784B1 Radio-electronic unit |
| 09/27/2006 | CN2822120Y Adhesive spring sheet |
| 09/27/2006 | CN2822106Y Device for producing intelligent double side circuit board |
| 09/27/2006 | CN2822105Y Electronic element and device fixer |
| 09/27/2006 | CN1839492A Method for forming electrically conductive layers by ink printing |
| 09/27/2006 | CN1839452A Method of layering green sheet and method of producing laminated ceramic electronic component |
| 09/27/2006 | CN1839219A Adhesion promotion in printed circuit boards |
| 09/27/2006 | CN1839008A Method for soldering electrical connector pins on a support by means of hot gas |
| 09/27/2006 | CN1839000A Coating metal particles |
| 09/27/2006 | CN1838871A Device and method for conveying and holding plate-like member |
| 09/27/2006 | CN1838868A Printed circuit board assembly and its processing method |
| 09/27/2006 | CN1838866A Electronic device and method for producing the same |
| 09/27/2006 | CN1838863A Method of manufacturing substrate for display device and substrate for display device |
| 09/27/2006 | CN1838862A Soft-hard composite circuit board manufacturing method |
| 09/27/2006 | CN1838860A Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |
| 09/27/2006 | CN1838859A Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |
| 09/27/2006 | CN1838857A A printed circuit board and production method thereof |
| 09/27/2006 | CN1838856A Method and apparatus for routing a differential pair on a printed circuit board |
| 09/27/2006 | CN1838855A Circuit substrate and making method and multilayer circuit structure using it and information processing system |
| 09/27/2006 | CN1838393A Welding flux transfer-printing apparatus |
| 09/27/2006 | CN1838380A Apparatus and method for forming bump |
| 09/27/2006 | CN1838348A Passive element packaging structure and making method thereof |
| 09/27/2006 | CN1838251A Apparatus and method for reducing solder pad size in an electrical lead suspension |
| 09/27/2006 | CN1838250A Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension |
| 09/27/2006 | CN1837961A Exposure apparatus and exposing method and method of manufacturing a printed wiring board |
| 09/27/2006 | CN1837135A Method of manufacturing ceramic laminate, laminated electronic element and method for producing same |
| 09/27/2006 | CN1277454C Electronic component mistake assembling preventing system |
| 09/27/2006 | CN1276997C Method of producing high temperature heat resistant electrolytic copper foil with carrier foil and electrolytic copper foil obtained by the method |
| 09/27/2006 | CN1276996C Composite foil and its manufacturing process |
| 09/27/2006 | CN1276994C Bath and method of electroless plating of silver on metal surfaces |
| 09/27/2006 | CN1276817C Flux composition for solder, solder paste, and method of soldering |
| 09/26/2006 | US7113408 Contact grid array formed on a printed circuit board |
| 09/26/2006 | US7113383 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 09/26/2006 | US7113136 Integrated dual function circuitry and antenna system |
| 09/26/2006 | US7112986 Method for testing using a universal wafer carrier for wafer level die burn-in |
| 09/26/2006 | US7112985 Method for testing using a universal wafer carrier for wafer level die burn-in |
| 09/26/2006 | US7112888 Solder ball assembly for bump formation and method for its manufacture |
| 09/26/2006 | US7112876 Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers |
| 09/26/2006 | US7112524 Substrate for pre-soldering material and fabrication method thereof |
| 09/26/2006 | US7112520 Semiconductor die packages with recessed interconnecting structures and methods for assembling the same |
| 09/26/2006 | US7112467 Structure and method for temporarily holding integrated circuit chips in accurate alignment |
| 09/26/2006 | US7112388 Battery provided with terminals |
| 09/26/2006 | US7112365 Multilayer, oriented film capable of structuring by means of electromagnetic radiation and composed of thermoplastic polyester, for the production of selectively metallized films |
| 09/26/2006 | US7112285 Conductive core substrate fabrication |
| 09/26/2006 | US7112271 Method and apparatus for making very low roughness copper foil |
| 09/26/2006 | US7112270 Algorithm for real-time process control of electro-polishing |
| 09/26/2006 | US7112069 Attachment plate for directly mating circuit boards |
| 09/26/2006 | US7112066 Electrical connector assembly with pick up cap |
| 09/26/2006 | US7111771 Doped tin-indium; superplasticity; microelectronics; for use in computers, wireless communicators, hand-held devices, automobiles, locomotives, aircraft, watercraft, and spacecraft |
| 09/26/2006 | US7111382 Methods for fabricating redeposition free thin film CPP read sensors |
| 09/21/2006 | WO2006099419A1 Circuitry module |
| 09/21/2006 | WO2006098863A1 A 2-metal flex circuit and a method of manufacturing the same |
| 09/21/2006 | WO2006098497A1 Apparatus for and method of manufacturing photosensitive laminated body |
| 09/21/2006 | WO2006098459A1 Resin ejection nozzle, resin encapsulation method, and electronic part assembly |
| 09/21/2006 | WO2006098426A1 Electronic component mounting method and electronic component mounting device |
| 09/21/2006 | WO2006098406A1 Method for manufacturing circuit forming board |
| 09/21/2006 | WO2006098294A1 Method for mounting electronic component, circuit board with electronic component mounted thereon, and electronic equipment with said circuit board mounted thereon |
| 09/21/2006 | WO2006098207A1 Multilayer wiring structure and method of manufacturing the same |
| 09/21/2006 | WO2006097733A1 Composite films suitable for use in opto-electronic and electronic devices |
| 09/21/2006 | WO2006097371A1 Rigid/flexible printed circuit board |
| 09/21/2006 | WO2006076604A3 Processes for planarizing substrates and encapsulating printable electronic features |
| 09/21/2006 | WO2006050691A3 Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit |
| 09/21/2006 | WO2005091955A3 Conductive circuits or cables manufactured from conductive loaded resin-based materials |
| 09/21/2006 | US20060212155 Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program |
| 09/21/2006 | US20060211276 Electrical contact |
| 09/21/2006 | US20060211251 Removal of copper oxides from integrated interconnects |
| 09/21/2006 | US20060211236 Surface-coating method, production of microelectronic interconnections using said method and integrated circuits |
| 09/21/2006 | US20060211174 Flip-chip adaptor package for bare die |
| 09/21/2006 | US20060211172 System and Method to Increase Die Stand-off Height |
| 09/21/2006 | US20060210780 Circuit board and production method therefor |
| 09/21/2006 | US20060210705 drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, reducing the copper fine particles with the surface oxide film layer with glycerol reducing agent, baking the copper fine particles produced |
| 09/21/2006 | US20060210420 Sn-zn lead-free solder alloy, its mixture, and soldered bond |
| 09/21/2006 | US20060209519 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof |
| 09/21/2006 | US20060209497 Pad structure of wiring board and wiring board |
| 09/21/2006 | US20060208041 Forming solder balls on substrates |
| 09/21/2006 | US20060208030 Structure to accommodate increase in volume expansion during solder reflow |
| 09/21/2006 | US20060207975 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 09/21/2006 | US20060207889 Etchant solution comprising dilute acid and adsorbate comprising 2-benzimidazole proprionic acid, generating electric field within etchant solution, and anisotropically etching pattern in NiP surface; discrete track recording pattern |
| 09/21/2006 | US20060207888 Electrochemical etching of circuitry for high density interconnect electronic modules |
| 09/21/2006 | US20060207091 Printed wiring board, manufacturing method therefor, and mounting method therefor |
| 09/21/2006 | US20060207090 Electronic-component holding apparatus, electronic-component mounting system, and electronic-component mounting method |
| 09/21/2006 | US20060207089 Component verification method |
| 09/21/2006 | US20060207088 Wiring board manufacturing method |
| 09/21/2006 | US20060207087 Method of manufacturing vibrating micromechanical structures |
| 09/21/2006 | US20060207086 Method for laminating chips and method for manufacturing semiconductor device using the same |
| 09/21/2006 | DE202006009139U1 Soldering wave installation e.g. evaluating processing stability for circuit boards, uses transparent disc in place of circuit board in soldering plant |