H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2006
10/26/2006	US20060240594 Method of making stacked chip electronic package having laminate carrier
10/26/2006	US20060240356 Positive type photosensitive epoxy resin composition and printed circuit board using the same
10/26/2006	US20060239855 Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure
10/26/2006	US20060238428 Domed circuit board of an antenna amplifier for a vehicle antenna device
10/26/2006	US20060237321 Method of forming conductive tracks
10/26/2006	US20060237225 Multilayer printed wiring board
10/26/2006	US20060237133 Methods for making laminated member for circuit board, making circuit board and laminating flexible film
10/26/2006	US20060237097 Immersion method
10/26/2006	US20060236534 Method for manufacturing printed wiring board
10/26/2006	US20060236533 Bonding arrangement and method for LTCC circuitry
10/26/2006	DE202006012798U1 PCB with electronic components arrangement for e.g. motor vehicle, has components, coupled to conductive tracks of printed circuit, with circuit board and electronic components completely embedded in formed plastics
10/26/2006	DE19907427B4 Kontaktfuß für eine flächige Lötverbindung Contact pad for a flat solder joint
10/26/2006	DE19904928B4 Verfahren zur Herstellung von Transpondern geringer Dicke Process for the preparation of transponders small thickness
10/26/2006	DE112004002603T5 Verfahren und Vorrichtung zum Löten von Modulen auf Substrate A method and apparatus for soldering of modules on substrates
10/26/2006	DE10300831B4 Stanzeinrichtung für Green Sheets Punching device for Green Sheets
10/26/2006	DE102005017849A1 Electronic component, has spring unit establishing electrical connection between board and support unit, mechanically and electrically connected with board or support unit and lying against support unit or board in prestressed manner
10/26/2006	DE102005012496B3 Electronic component mounting device for manufacturing electronic assembly, has press detention connection formed between electronic component and mounting part by pressing electronic component at mounting part
10/25/2006	EP1715732A2 Printed circuit board structure having a layer at one of its surfaces for dissipating heat by convection
10/25/2006	EP1715512A2 Semiconductor device and method of forming the same
10/25/2006	EP1715445A1 Electronic device
10/25/2006	EP1714730A1 Laser processing protection sheet and production methodfor laser processed article
10/25/2006	EP1714535A1 Device for the vibration-proof mounting of electric special components and/or electric circuits
10/25/2006	EP1714534A1 Electronic component on a supporting element
10/25/2006	EP1714533A1 Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board
10/25/2006	EP1714532A2 Metal deposition
10/25/2006	EP1714531A2 Preferential asymmetrical ground and differential signal via layout and preferential via exit structures for printed circuit boards
10/25/2006	EP1714530A1 Method for increasing a routing density for a circuit board and such a circuit board
10/25/2006	EP1714354A1 A system for detachably connecting a large number of signal lines of two components
10/25/2006	EP1714320A2 Conductive material compositions, apparatus, systems, and methods
10/25/2006	EP1713956A1 Stabilised 1, 2-dichloroethylene compositions
10/25/2006	EP1414050B1 Method for producing nanocomposite magnet using atomizing method
10/25/2006	EP1099507B1 Solder powder and method for preparing the same and solder paste
10/25/2006	EP1034193B1 Phenol-novolacs with improved optical properties
10/25/2006	CN2831693Y External waveform regulator for Tin furnace wave peak welding
10/25/2006	CN2831690Y Flexible printed circuit boards and folding cell phone thereof
10/25/2006	CN2831419Y Hole-like conducting structure having compensation area on reference plane
10/25/2006	CN1853452A Multilayer printed wiring board
10/25/2006	CN1853451A Method for manufacturing an electronic module
10/25/2006	CN1853446A Heater and method for manufacture heater using PCB
10/25/2006	CN1853445A Warming apparatus with heater produced by pcb
10/25/2006	CN1853113A A method of manufacturing an electronic device and an electronic device
10/25/2006	CN1852784A Closed loop backdrilling system
10/25/2006	CN1852639A Direct-pluging type high-brightness LED luminous device and welding technology for forming array by it
10/25/2006	CN1852638A Printing welding-paste method and printing tin steel-screen
10/25/2006	CN1852637A Electronic circuit device and manufacturing method of the same
10/25/2006	CN1852636A Printed circuit board with improved welded plate
10/25/2006	CN1852634A Projected electrode based on polymer substrate, its making method and use
10/25/2006	CN1852633A Printed circuit board capable of realizing high-speed signal transmission and making method
10/25/2006	CN1851917A Semiconductor device and method for producing the same
10/25/2006	CN1851913A Lead carriage and packing structure using same
10/25/2006	CN1851907A Semiconductor packing structure comprising passive element
10/25/2006	CN1282404C Production method of laminating double-side circuit board and multi-layer printed circuit board using it
10/25/2006	CN1282403C Multilayer wiring board
10/25/2006	CN1282402C Combination struicture of electronic element and circuit board
10/25/2006	CN1282244C Electronic module having 3-D array of carrier-mounted IC packages
10/25/2006	CN1282242C Chip ratio package and manufacturing method thereof
10/25/2006	CN1282240C 半导体装置 Semiconductor device
10/25/2006	CN1282206C Method for prodn. of laminated ceramic electronic components
10/25/2006	CN1282202C Conductive paste, its manufacturing method, and printed wiring board using same
10/25/2006	CN1282188C Wired circuit board
10/25/2006	CN1282154C Data processing device and method of a bitstream signal
10/25/2006	CN1282037C Method for mfg. printed wiring board and photosenstive resin compsn. to be used for it
10/25/2006	CN1282036C Resist curable resin composition and cured article thereof
10/25/2006	CN1281991C Optical communication apparatus
10/25/2006	CN1281923C Defect detector and defect detection method
10/25/2006	CN1281410C Process for producing transparent conductive laminate
10/25/2006	CN1281367C Method for integrating optical layers in a PCB for inter-board communications
10/24/2006	US7127142 Optical communication device
10/24/2006	US7126811 Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
10/24/2006	US7126452 Wiring structure, and fabrication method of the same
10/24/2006	US7126358 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
10/24/2006	US7126228 Apparatus for processing semiconductor devices in a singulated form
10/24/2006	US7126227 Wiring substrate, semiconductor device, semiconductor module, electronic equipment, method for designing wiring substrate, method for manufacturing semiconductor device, and method for manufacturing semiconductor module
10/24/2006	US7126221 Semiconductor package
10/24/2006	US7126220 Miniaturized contact spring
10/24/2006	US7126215 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
10/24/2006	US7126211 Circuit carrier
10/24/2006	US7126210 System and method for venting pressure from an integrated circuit package sealed with a lid
10/24/2006	US7126165 Light emitting device assembly
10/24/2006	US7126061 Printed circuit board for avoiding producing cutting burrs
10/24/2006	US7125798 Circuit device and manufacturing method of circuit device
10/24/2006	US7125789 Composite metal column for mounting semiconductor device
10/24/2006	US7125752 Methods for making microwave circuits including a ground plane
10/24/2006	US7125744 High-frequency module and method for manufacturing the same
10/24/2006	US7125729 Method for opening the plastic housing of an electronic module
10/24/2006	US7125653 Method of producing conductive or semiconducting structured polymers
10/24/2006	US7125586 Kinetic spray coating of powder particles onto a plastic covered substrate without first removing the covering; using a a supersonic nozzle to accelerate particles entrained in a heated gas to a velocity sufficient to force the particles through the covering to adhere to the substrate upon impact
10/24/2006	US7125294 Circuit board mounting bracket
10/24/2006	US7125293 Connector having improved contacts with fusible members
10/24/2006	US7125281 Systems and methods for connecting electrical components
10/24/2006	US7124931 Via heat sink material
10/24/2006	US7124504 Method and device for connecting conductors
10/24/2006	US7124502 Method of fabricating a high-layer-count backplane
10/24/2006	US7124501 Method of producing an electrical plug-in-connection
10/24/2006	CA2266263C Thermally reactive near infrared absorption polymer coatings, method of preparing and methods of use
10/19/2006	WO2006110364A1 Flexible circuit substrate
10/19/2006	WO2006109906A1 Multi-ram system having assembly-type ram head of vacuum pres for laminating multilayer printed circuit board
10/19/2006	WO2006109799A1 Metal conductive film and process for producing the same
10/19/2006	WO2006109785A1 Method for designing electronic component
10/19/2006	WO2006109721A1 Material for pattern formation, apparatus for pattern formation, and method for pattern formation

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