| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/02/2006 | CN1813348A Device comprising at least one heat source formed by a functional element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat |
| 08/02/2006 | CN1813345A Surface-coating method, production of microelectronic interconnections using said method and integrated circuits |
| 08/02/2006 | CN1813324A Stretchable fabric switch |
| 08/02/2006 | CN1813307A Improved method for adding flexiable circuit assembly of magnetic head stack assembly to actuator arm |
| 08/02/2006 | CN1813084A Process for producing metal plating film, process for producing electronic part and plating film forming apparatus |
| 08/02/2006 | CN1812883A Multilayer body and method for producing same |
| 08/02/2006 | CN1812860A Rotary tool holder assemblie |
| 08/02/2006 | CN1812697A High-wide-band impedance matching transmitting hole |
| 08/02/2006 | CN1812696A Method of fabricating printed circuit board |
| 08/02/2006 | CN1812695A Nickelplating gold-immersion technology and anti-bending agent in printing circuit |
| 08/02/2006 | CN1812694A Drawer type mould |
| 08/02/2006 | CN1812692A Print substrate with tab terminal, electronic equipment and method of manufacture the same |
| 08/02/2006 | CN1812689A Multilayer circuit board and manufacturing method thereof |
| 08/02/2006 | CN1812063A Circuit device manufacturing method |
| 08/02/2006 | CN1812039A Green sheet and method of manufacturing the same, and a method of manufacturing a plasma display panel |
| 08/02/2006 | CN1812024A Method of production of peeling layer paste and method of production of a multilayer type electronic device |
| 08/02/2006 | CN1811594A Mask, mask forming method, pattern forming method, and wiring pattern forming method |
| 08/02/2006 | CN1810856A Aromatic polyimide and its prepn and use |
| 08/02/2006 | CN1268185C Metal foil laminate and method for making same |
| 08/02/2006 | CN1268184C Program supply method of substrate mounting production line |
| 08/02/2006 | CN1268183C Electronic component and manufacture method thereof |
| 08/02/2006 | CN1268182C Silk screen printing method and silk-screen printing equipment |
| 08/02/2006 | CN1268181C Laminating method and product of circuit board with low dielectric coefficient insulating material to inhibitor electromagnetic interference |
| 08/02/2006 | CN1268180C Circuit substrate and manufacture thereof |
| 08/02/2006 | CN1268038C Batch electrically connecting sheet |
| 08/02/2006 | CN1267989C Circuit board for mounting electronic parts |
| 08/02/2006 | CN1267478C Heat-curable resin composition |
| 08/02/2006 | CN1267255C Cutting device |
| 08/02/2006 | CN1267243C Soldering tin paste |
| 08/02/2006 | CN1267237C Circle laser trepanning |
| 08/02/2006 | CN1267206C Variable volume positive displacement dispensing system and method |
| 08/01/2006 | US7085146 Flanged terminal pins for DC/DC converters |
| 08/01/2006 | US7085142 Electrical device |
| 08/01/2006 | US7084730 Chip coil and printed circuit board for the same |
| 08/01/2006 | US7084723 Waveguide coupler |
| 08/01/2006 | US7084657 Bump and method of forming bump |
| 08/01/2006 | US7084512 Circuit substrate and its manufacturing method |
| 08/01/2006 | US7084509 Electronic package with filled blinds vias |
| 08/01/2006 | US7084493 Wiring circuit board and production method thereof |
| 08/01/2006 | US7084355 Multilayer printed circuit board |
| 08/01/2006 | US7084354 PCB method and apparatus for producing landless interconnects |
| 08/01/2006 | US7084352 Thin-film resin substrate used in a high-frequency module |
| 08/01/2006 | US7084351 Electrical device allowing for increased device densities |
| 08/01/2006 | US7084350 Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby |
| 08/01/2006 | US7084288 Organometallic compound with hydrazine compound to form pattern with metal film and multilayer element |
| 08/01/2006 | US7084194 Heat resistance; flame retarders; adhesives; composites; laminated plates; printed circuits |
| 08/01/2006 | US7084098 Using mixture of hydroxylamine, hydroxide, antifoam agents,cleaner, precipitation inhibitor and water; printed circuits |
| 08/01/2006 | US7084097 Cleaning solution for substrates of electronic materials |
| 08/01/2006 | US7084067 Removal of copper oxides from integrated interconnects |
| 08/01/2006 | US7084014 Method of making circuitized substrate |
| 08/01/2006 | US7084009 Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate |
| 08/01/2006 | US7084008 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product |
| 08/01/2006 | US7084006 Electronic parts packaging structure and method of manufacturing the same |
| 08/01/2006 | US7083901 Joining member for Z-interconnect in electronic devices without conductive paste |
| 08/01/2006 | US7083859 Conductive powder and method for preparing the same |
| 08/01/2006 | US7083848 Single- or multilayer thermoplastic polymer film capable of structuring by means of electromagnetic radiation, process for its production, and its use |
| 08/01/2006 | US7083739 Transfer body and method using the same |
| 08/01/2006 | US7083436 Particle distribution interposer and method of manufacture thereof |
| 08/01/2006 | US7082682 Contact structures and methods for making same |
| 08/01/2006 | US7082681 Methods for modifying a vertical surface mount package |
| 08/01/2006 | US7082680 Mounting method of electronic components |
| 08/01/2006 | US7082679 Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof |
| 08/01/2006 | US7082666 Method for testing print circuit boards |
| 08/01/2006 | US7082655 Process for plating a piezoelectric composite |
| 08/01/2006 | CA2314116C Pb-free solder-connected structure and electronic device |
| 08/01/2006 | CA2119686C Pentafluorobutane compositions and their use |
| 07/27/2006 | WO2006079097A1 Structure and method of making interconnect element having metal traces embedded in suface of dielectric |
| 07/27/2006 | WO2006078027A1 Multilayer printed wiring board |
| 07/27/2006 | WO2006077823A1 Substrate inspecting apparatus and substrate inspecting method |
| 07/27/2006 | WO2006077804A1 Clamping apparatus and image forming apparatus |
| 07/27/2006 | WO2006077784A1 Lead wire connection method for touch panel |
| 07/27/2006 | WO2006077771A1 Curable resin composition and interlayer insulating film |
| 07/27/2006 | WO2006077694A1 Method for manufacturing resin filled substrate |
| 07/27/2006 | WO2006077618A1 Baffle plate, hot air blower for solder treatment, and nozzle for the hot air blower |
| 07/27/2006 | WO2006077210A1 Semiconductor sensor component comprising protected feeders, and method for the production thereof |
| 07/27/2006 | WO2006077167A2 Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method |
| 07/27/2006 | WO2006077163A2 Wire-printed circuit board or card comprising conductors with a rectangular or square cross-section |
| 07/27/2006 | WO2006076806A1 Assembly, production and quality assurance processes respecting electronic compliance monitor (ecm) tags |
| 07/27/2006 | WO2006050792A8 Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement |
| 07/27/2006 | WO2006040088A3 Drilling device for drilling contact holes for assembling contact surfaces of a multilayer circuit boards |
| 07/27/2006 | WO2006030352A3 Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder |
| 07/27/2006 | US20060167703 Dynamic resource allocation platform and method for time related resources |
| 07/27/2006 | US20060166490 Forming buried via hole substrates |
| 07/27/2006 | US20060166400 Electronic assembly with integrated IO and power contacts |
| 07/27/2006 | US20060166111 Mask, mask forming method, pattern forming method, and wiring pattern forming method |
| 07/27/2006 | US20060166005 Resin layer-coated copper foil and multilayer printed wiring board obtained with the resin layered-coated copper foil |
| 07/27/2006 | US20060165909 Producing solderable and bondable copper printed circuit boards by a two step displacement plating reaction: 1) depositing Ag on the substrate and 2) plating Ag on said substrate; Ag is deposited in the 1st step at a rate that is at most half the rate of plating of Ag in the 2nd step |
| 07/27/2006 | US20060165900 Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors |
| 07/27/2006 | US20060165875 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 07/27/2006 | US20060165345 System and method for integrating optical layers in a PCB for inter-board communications |
| 07/27/2006 | US20060164794 Part inserting head device, part inserting device, and part inserting method |
| 07/27/2006 | US20060164784 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation |
| 07/27/2006 | US20060164190 Coaxial waveguide microstructures and methods of formation thereof |
| 07/27/2006 | US20060164189 Strip line device, member to be mounted on printed wiring board, circuit board, semiconductor package, and its fabricating method |
| 07/27/2006 | US20060163989 Blue color filter, and organic electroluminescent device using the same |
| 07/27/2006 | US20060163750 Semiconductor device and method for producing the same |
| 07/27/2006 | US20060163740 Semiconductor mounting board |
| 07/27/2006 | US20060163718 Flexible wiring base material and process for producing the same |
| 07/27/2006 | US20060163329 Multilayered metal laminate and process for producing the same |
| 07/27/2006 | US20060163318 Continuous mode solder jet apparatus and method |