| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/22/2006 | US7095623 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 08/22/2006 | US7095621 Leadless leadframe electronic package and sensor module incorporating same |
| 08/22/2006 | US7095615 Environmentally tuned circuit card assembly and method for manufacturing the same |
| 08/22/2006 | US7095595 Hard disk drive comprising flexible printed circuit with damping material |
| 08/22/2006 | US7095590 Head gimbal assembly and method for manufacturing the same |
| 08/22/2006 | US7095106 Collars, support structures, and forms for protruding conductive structures |
| 08/22/2006 | US7094975 Circuit board with localized stiffener for enhanced circuit component reliability |
| 08/22/2006 | US7094822 formed by injection molding; for use as thermal interface to protect heat-generating electronic devices |
| 08/22/2006 | US7094677 Method of forming a penetration electrode and substrate having a penetration electrode |
| 08/22/2006 | US7094641 Method for forming wiring pattern, method for manufacturing semiconductor device, electro-optic device and electronic equipment |
| 08/22/2006 | US7094632 Low profile chip scale stacking system and method |
| 08/22/2006 | US7094307 Methods for coating surfaces with metal and products made thereby |
| 08/22/2006 | US7094068 Load board |
| 08/22/2006 | US7094067 Connection structure between printed circuit board and flexible circuit board |
| 08/22/2006 | US7094065 Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| 08/22/2006 | US7094063 High density interconnect |
| 08/22/2006 | US7094060 Via providing multiple electrically conductive paths |
| 08/22/2006 | US7094049 Quartz glass single hole nozzle for feeding fluid and quartz glass multi-hole burner head for feeding fluid |
| 08/22/2006 | US7094046 Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging |
| 08/22/2006 | US7093746 Coated stencil with reduced surface tension |
| 08/22/2006 | US7093358 Method for fabricating an interposer |
| 08/22/2006 | US7093356 Method for producing wiring substrate |
| 08/22/2006 | CA2169022C Tweezer-like heater |
| 08/17/2006 | WO2006085669A1 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same |
| 08/17/2006 | WO2006085436A1 Substrate with built-in component and capacitor with built-in substrate |
| 08/17/2006 | WO2006084525A1 Adhesive strip conductor on an insulating layer |
| 08/17/2006 | US20060183358 Connector having a built-in electronic part |
| 08/17/2006 | US20060183354 Via providing multiple electrically conductive paths |
| 08/17/2006 | US20060183316 Method of providing printed circuit board with conductive holes and board resulting therefrom |
| 08/17/2006 | US20060183306 Method for producing an electronic component with shielding |
| 08/17/2006 | US20060183298 Method for manufacturing a ceramic/metal substrate |
| 08/17/2006 | US20060183004 Magnetic recording medium, magnetic recording and reproducing apparatus, and manufacturing method of magnetic recording medium |
| 08/17/2006 | US20060182879 Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
| 08/17/2006 | US20060182385 Method of fabricating multi-layered printed circuit board for optical waveguides |
| 08/17/2006 | US20060180936 Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 08/17/2006 | US20060180915 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 08/17/2006 | US20060180821 Light-emitting diode thermal management system |
| 08/17/2006 | US20060180805 Film comprising organic semiconductors |
| 08/17/2006 | US20060180345 Perimeter matrix ball grid array circuit package with a populated center |
| 08/17/2006 | US20060180344 Multilayer printed wiring board and process for producing the same |
| 08/17/2006 | US20060180343 Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same |
| 08/17/2006 | US20060180342 Multilayer substrate and method for producing same |
| 08/17/2006 | US20060180341 Multilayer printed wiring board and method of manufacturing the same |
| 08/17/2006 | US20060180338 Electrical connection component |
| 08/17/2006 | US20060180265 Apparatus for producing non-woven fabric |
| 08/17/2006 | US20060179950 Method for forming a pressure proof assembly between a component and house and such an assembly |
| 08/17/2006 | US20060179652 Connecting flexible circuitry by stitching |
| 08/17/2006 | DE112004001275T5 Systeme und Verfahren zum Verbinden elektrischer Komponenten Systems and methods for connecting electrical components |
| 08/17/2006 | DE102005004360A1 Effizientes Verfahren zum Herstellen und Zusammenfügen eines mikroelektronischen Chips mit Lothöckern Efficient process for producing and assembling a microelectronic chips with solder bumps |
| 08/17/2006 | DE102004035020B4 Laser beam-deflecting device for laser processing machine, has beam splitter arranged in switch beam path and arranged outside of another path, when optical module is found in respective positions |
| 08/17/2006 | DE10110151B4 Verdrahtungssubstrat, Verfahren zum Herstellen desselben und elektronische Vorrichtung, die dasselbe verwendet Wiring substrate, process for producing the same and electronic apparatus using the same |
| 08/16/2006 | EP1691591A1 Circuit board having recesses for inserting electronic components |
| 08/16/2006 | EP1691589A1 Wired circuit board and producing method thereof |
| 08/16/2006 | EP1691206A2 Method and apparatus for testing semiconductor dice |
| 08/16/2006 | EP1690283A2 Methods for making vertical electrical feed through structures |
| 08/16/2006 | EP1689909A2 Formation of solid layers on substrates |
| 08/16/2006 | EP1689906A1 Method of preparing a metal-silicone rubber composite |
| 08/16/2006 | EP1689572A1 Circuit insulation methods and systems for vehicle door latches |
| 08/16/2006 | EP1689554A2 Laser-based system for memory link processing with picosecond lasers |
| 08/16/2006 | EP1586223B1 Electrical connection element, especially for electric tool switches |
| 08/16/2006 | EP1464211B8 Electric circuit module and method for its assembly |
| 08/16/2006 | EP1354077B1 Method and apparatus for the continuous deposition of a nickel-containing coating on a metallic film |
| 08/16/2006 | EP1299324A4 Freestanding reactive multilayer foils |
| 08/16/2006 | EP1181566B1 Testing fastenings of printed circuit board |
| 08/16/2006 | CN2807721Y 穿线装置 Threader |
| 08/16/2006 | CN2807714Y Clasping and holding device |
| 08/16/2006 | CN2807702Y Material removing mechanism of circuit board forming machine |
| 08/16/2006 | CN2807701Y Radio-frequency head joining structure |
| 08/16/2006 | CN1820557A Method for manufacturing a sequential backplane |
| 08/16/2006 | CN1820394A Electrical connector solder terminal |
| 08/16/2006 | CN1820368A Lead frame and manufacture thereof |
| 08/16/2006 | CN1820361A Method for interconnecting terminals and method for mounting semiconductor device |
| 08/16/2006 | CN1820342A Filling vias with thick film paste using contact printing |
| 08/16/2006 | CN1820328A Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same |
| 08/16/2006 | CN1820307A Electric connector and member assembly for hard disk driver |
| 08/16/2006 | CN1819980A Method for producing laminated dielectric |
| 08/16/2006 | CN1819748A Etching liquid, bulking liquid and forming method of conductive image using same |
| 08/16/2006 | CN1819747A Method for manufacturing circuit substrate with cable part |
| 08/16/2006 | CN1819746A Wired circuit board and producing method thereof |
| 08/16/2006 | CN1819745A Single-face flexible printing board with double-face access by chemical etching method |
| 08/16/2006 | CN1819744A Punched hole processing method of flexible printed circuit lining |
| 08/16/2006 | CN1819741A Copper foil for polyimide like flexible copper laminated board, polyimide like flexible copper laminated board and polyimide like flexible printed circuit board |
| 08/16/2006 | CN1819738A Flexible printed circuit board and connecting method of the same |
| 08/16/2006 | CN1819330A Narrow-frequency band filter on circuit board for inhibiting high-frequency harmonic wave |
| 08/16/2006 | CN1819191A Memory module and method of mounting memory device on PCB for memory module |
| 08/16/2006 | CN1819189A Method for manufacturing circuit device |
| 08/16/2006 | CN1819184A Devices comprising a power core and methods of making thereof |
| 08/16/2006 | CN1819132A Method for manufacturing circuit device |
| 08/16/2006 | CN1818794A Exposure apparatus |
| 08/16/2006 | CN1817639A Composite reactive multilayer foil |
| 08/16/2006 | CN1817638A Composite reactive multilayer foil |
| 08/16/2006 | CN1817539A Composite reactive multilayer foil |
| 08/16/2006 | CN1817538A Solder interconnect structure and method using injection molded solder |
| 08/16/2006 | CN1270403C Circuit board device and its manufacturing method |
| 08/16/2006 | CN1270376C Method for connecting down-lead of lead frame or components to contact welding disk of substrate |
| 08/16/2006 | CN1270365C Method for contacting electrical component with substrate comprising conducting structure |
| 08/16/2006 | CN1270364C Semiconductor device and making method |
| 08/16/2006 | CN1270363C Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 08/16/2006 | CN1270275C Method for checking data production and substrate checking apparatus by the same method |
| 08/16/2006 | CN1269994C Apparatus for spraying printed circuit-board |