Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2006
10/17/2006US7122901 Semiconductor device
10/17/2006US7122896 Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component
10/17/2006US7122894 Wiring substrate and process for manufacturing the same
10/17/2006US7122746 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
10/17/2006US7122745 Circuit board having metallic plate, printed circuit board and flexible circuit board
10/17/2006US7122460 Electromigration barrier layers for solder joints
10/17/2006US7122403 Method of interconnecting die and substrate
10/17/2006US7122389 Method for processing semiconductor devices in a singulated form
10/17/2006US7122131 Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same
10/17/2006US7122124 Method of fabricating film carrier
10/17/2006US7121893 Electrical switch having an electrical connection element
10/17/2006US7121859 Flexible cable interconnect assembly
10/17/2006US7121839 Compliant interconnect assembly
10/17/2006US7121449 Method and device for applying material to a workpiece
10/17/2006US7121178 Punching tool with re-usable, neutral structural groups
10/17/2006US7121000 Method for manufacturing multilayer wiring board
10/17/2006US7120999 Methods of forming a contact array in situ on a substrate
10/17/2006US7120995 Apparatus for mounting semiconductors
10/17/2006CA2395080C Multilayer printed board
10/17/2006CA2211533C Glass bonding layer for a ceramic circuit board support substrate
10/12/2006WO2006108110A1 Probe pad structure in a ceramic space transformer
10/12/2006WO2006107475A1 Aqueous cleaner with low metal etch rate
10/12/2006WO2006106850A1 Conductive paste composition and printed wiring board
10/12/2006WO2006106849A1 Conductive paste composition and printed wiring board
10/12/2006WO2006105759A1 Semi-conductor sensor component with a cavity housing and sensor chip and method for the production thereof
10/12/2006US20060228833 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
10/12/2006US20060228533 Discharging solution, method for producing patterns and method for producing for producing an electronic device using the discharging solution, and electronic device
10/12/2006US20060227058 Ground connection of a printed circuit board placed in a wristwatch type electronic device
10/12/2006US20060226927 Method of terminating bus,bus termination resistor and wiring subtrate having terminated buses and method of its manufacture
10/12/2006US20060226851 Conductor inspection apparatus and conductor inspection method
10/12/2006US20060226544 Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same
10/12/2006US20060226531 Power semiconductor module
10/12/2006US20060226398 Conductive powder, conductive composition, and producing method of the same
10/12/2006US20060226237 Method for mounting an electronic component on a substrate
10/12/2006US20060226142 Enhancement of performance of a conductive wire in a multilayered substrate
10/12/2006US20060226115 surface treatment with adhesion promoters, then with acid resistance promoters, and with post-dip solutions, to form surfaces suitable for subsequent multilayer lamination; printed circuits having bonding strength
10/12/2006US20060226021 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
10/12/2006US20060225919 Plating buss and a method of use thereof
10/12/2006US20060225918 Electronic device substrate and its fabrication method, and electronic device and its fabrication method
10/12/2006US20060225917 Conductive bump structure of circuit board and fabrication method thereof
10/12/2006US20060225276 Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board
10/12/2006US20060225274 Insulated implantable electrical circuit
10/12/2006US20060225273 Transferring die(s) from an intermediate surface to a substrate
10/12/2006US20060225272 Method of fabricating semiconductor chip assemblies
10/12/2006US20060225271 System and method for insertion and retention of a daughter card in a motherboard
10/12/2006DE29825229U1 Device for positioning electrode for electroplating moving substrate has number of parallel electrically insulating elements made from high capacity polypropylene, all these elements being parallel to each other
10/12/2006DE19819057B4 Vorrichtung zum Biegen von flexiblen elektrischen Flachleitern Device for bending a flat flexible electrical conductors
10/12/2006DE10343255B4 Verfahren zum Herstellen elektrischer Verbindungen zwischen einem Halbleiterchip in einem BGA-Gehäuse und einer Leiterplatte A method of making electrical connections between a semiconductor chip in a BGA package and a printed circuit board
10/12/2006DE102005016283A1 Attachment of electrical and electronic components on circuit substrate involves inserting leads of component into openings formed on circuit substrate, and filling space between leads and openings with solder material
10/12/2006DE102005015656A1 RFID chip and strip substrate contact surfaces electrical and mechanical connection establishing method for transponder, involves hooking chip surfaces having hooks/lugs with substrate surfaces having hooks/lugs with size in nanometer range
10/12/2006DE102005015644A1 Strip conductors connecting device for e.g. printed circuit board, has heating device with diode laser with laser beam of pre-set wavelength that is adapted to absorption behavior of strip conductor carrier and strip conductor material
10/12/2006DE102004010013B4 Verfahren zum Kontaktieren eines Chipmoduls A method for contacting a chip module
10/12/2006DE10164606B4 Flip-Chip-Halbleitereinrichtung mit außerhalb von Energiezufuhranschlussflächen angeordneten Signalanschlussflächen Flip-chip semiconductor device having arranged outside of power supply pads signal pads
10/12/2006DE10154884B4 Vorrichtung zum Transport von flexiblem Flachmaterial, insbesondere Leiterplatten Device for the transport of flexible flat material, especially printed circuit boards
10/12/2006DE10005836B4 Leiterplattensicherung mit erhöhter Sicherheit PCB fuse with enhanced security
10/11/2006EP1711044A2 Method of transferring components onto a surface
10/11/2006EP1711041A2 Wiring board, multilayer wiring board, and method for manufacturing the same
10/11/2006EP1711040A1 Circuit device and manufacturing method thereof
10/11/2006EP1710095A1 Method for manufacturing a printing screen for serigraphy
10/11/2006EP1709852A2 Improved populated printed wiring board and method of manufacture
10/11/2006EP1709849A1 Method of manufacturing a circuit carrier and the use of the method
10/11/2006EP1709848A1 Partially etched dielectric film with conductive features
10/11/2006EP1709847A1 Micro-electromechanical sub-assembly having an on-chip transfer mechanism
10/11/2006EP1709846A1 Screen printer
10/11/2006EP1709675A1 Wafer level super stretch solder
10/11/2006EP1709674A1 Plasma processing method and method for fabricating electronic component module using the same
10/11/2006EP1709261A1 Façade covering
10/11/2006EP1709215A2 Chromium-free antitarnish adhesion promoting treatment composition
10/11/2006EP1708870A1 Press for the production of laminates
10/11/2006EP1587728B1 Stanchion with an integrated device for securing a load, in particular for tarpaulin-covered transport vehicles
10/11/2006EP1456911B1 Assembly and connecting technique in textile structures
10/11/2006EP1264347B1 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
10/11/2006EP1168899B1 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same
10/11/2006EP1087844A4 Apparatus and method for coating a multilayer article
10/11/2006EP0998760B1 Solid-state energy storage module employing integrated interconnect board
10/11/2006EP0870325B1 Microelectronic mounting with multiple lead deformation
10/11/2006CN2826916Y LED fixer with polarity mark action
10/11/2006CN2826913Y Universal template for wiring
10/11/2006CN2826903Y Structure improvement of assembling and positioning method for interface card expansion groove
10/11/2006CN1846306A Method for producing an electronic component or module and a corresponding component or module
10/11/2006CN1845984A Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards
10/11/2006CN1845977A Adhesive agent and method for production thereof
10/11/2006CN1845666A Shielding structure
10/11/2006CN1845657A Method for making electrical behavior connection structure
10/11/2006CN1845656A Switch made on circuit board
10/11/2006CN1845655A Wiring board, multilayer wiring board, and method for manufacturing the same
10/11/2006CN1845654A Vacuum air compression warehouse for circuit board
10/11/2006CN1845653A Single plate and its processing method
10/11/2006CN1845652A Printed circuit board structure and method for manufacturing same
10/11/2006CN1843758A Printing device and printing method
10/11/2006CN1279797C Transparent substrate setted with electroconductive channel
10/11/2006CN1279796C Method for fixing and treating film material
10/11/2006CN1279612C Circuit base plate, electronic machine, and method of manufacture
10/11/2006CN1279552C Resistance wiring board and its mfg. method
10/11/2006CN1279155C Detergent
10/11/2006CN1279134C Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus
10/11/2006CN1279114C Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same
10/10/2006US7120893 System and method for evaluation of electric characteristics of printed-circuit boards
10/10/2006US7120885 Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise
10/10/2006US7120492 Flyback transformer wire attach method to printed circuit board