Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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10/17/2006 | US7122901 Semiconductor device |
10/17/2006 | US7122896 Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component |
10/17/2006 | US7122894 Wiring substrate and process for manufacturing the same |
10/17/2006 | US7122746 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
10/17/2006 | US7122745 Circuit board having metallic plate, printed circuit board and flexible circuit board |
10/17/2006 | US7122460 Electromigration barrier layers for solder joints |
10/17/2006 | US7122403 Method of interconnecting die and substrate |
10/17/2006 | US7122389 Method for processing semiconductor devices in a singulated form |
10/17/2006 | US7122131 Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same |
10/17/2006 | US7122124 Method of fabricating film carrier |
10/17/2006 | US7121893 Electrical switch having an electrical connection element |
10/17/2006 | US7121859 Flexible cable interconnect assembly |
10/17/2006 | US7121839 Compliant interconnect assembly |
10/17/2006 | US7121449 Method and device for applying material to a workpiece |
10/17/2006 | US7121178 Punching tool with re-usable, neutral structural groups |
10/17/2006 | US7121000 Method for manufacturing multilayer wiring board |
10/17/2006 | US7120999 Methods of forming a contact array in situ on a substrate |
10/17/2006 | US7120995 Apparatus for mounting semiconductors |
10/17/2006 | CA2395080C Multilayer printed board |
10/17/2006 | CA2211533C Glass bonding layer for a ceramic circuit board support substrate |
10/12/2006 | WO2006108110A1 Probe pad structure in a ceramic space transformer |
10/12/2006 | WO2006107475A1 Aqueous cleaner with low metal etch rate |
10/12/2006 | WO2006106850A1 Conductive paste composition and printed wiring board |
10/12/2006 | WO2006106849A1 Conductive paste composition and printed wiring board |
10/12/2006 | WO2006105759A1 Semi-conductor sensor component with a cavity housing and sensor chip and method for the production thereof |
10/12/2006 | US20060228833 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein |
10/12/2006 | US20060228533 Discharging solution, method for producing patterns and method for producing for producing an electronic device using the discharging solution, and electronic device |
10/12/2006 | US20060227058 Ground connection of a printed circuit board placed in a wristwatch type electronic device |
10/12/2006 | US20060226927 Method of terminating bus,bus termination resistor and wiring subtrate having terminated buses and method of its manufacture |
10/12/2006 | US20060226851 Conductor inspection apparatus and conductor inspection method |
10/12/2006 | US20060226544 Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
10/12/2006 | US20060226531 Power semiconductor module |
10/12/2006 | US20060226398 Conductive powder, conductive composition, and producing method of the same |
10/12/2006 | US20060226237 Method for mounting an electronic component on a substrate |
10/12/2006 | US20060226142 Enhancement of performance of a conductive wire in a multilayered substrate |
10/12/2006 | US20060226115 surface treatment with adhesion promoters, then with acid resistance promoters, and with post-dip solutions, to form surfaces suitable for subsequent multilayer lamination; printed circuits having bonding strength |
10/12/2006 | US20060226021 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
10/12/2006 | US20060225919 Plating buss and a method of use thereof |
10/12/2006 | US20060225918 Electronic device substrate and its fabrication method, and electronic device and its fabrication method |
10/12/2006 | US20060225917 Conductive bump structure of circuit board and fabrication method thereof |
10/12/2006 | US20060225276 Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board |
10/12/2006 | US20060225274 Insulated implantable electrical circuit |
10/12/2006 | US20060225273 Transferring die(s) from an intermediate surface to a substrate |
10/12/2006 | US20060225272 Method of fabricating semiconductor chip assemblies |
10/12/2006 | US20060225271 System and method for insertion and retention of a daughter card in a motherboard |
10/12/2006 | DE29825229U1 Device for positioning electrode for electroplating moving substrate has number of parallel electrically insulating elements made from high capacity polypropylene, all these elements being parallel to each other |
10/12/2006 | DE19819057B4 Vorrichtung zum Biegen von flexiblen elektrischen Flachleitern Device for bending a flat flexible electrical conductors |
10/12/2006 | DE10343255B4 Verfahren zum Herstellen elektrischer Verbindungen zwischen einem Halbleiterchip in einem BGA-Gehäuse und einer Leiterplatte A method of making electrical connections between a semiconductor chip in a BGA package and a printed circuit board |
10/12/2006 | DE102005016283A1 Attachment of electrical and electronic components on circuit substrate involves inserting leads of component into openings formed on circuit substrate, and filling space between leads and openings with solder material |
10/12/2006 | DE102005015656A1 RFID chip and strip substrate contact surfaces electrical and mechanical connection establishing method for transponder, involves hooking chip surfaces having hooks/lugs with substrate surfaces having hooks/lugs with size in nanometer range |
10/12/2006 | DE102005015644A1 Strip conductors connecting device for e.g. printed circuit board, has heating device with diode laser with laser beam of pre-set wavelength that is adapted to absorption behavior of strip conductor carrier and strip conductor material |
10/12/2006 | DE102004010013B4 Verfahren zum Kontaktieren eines Chipmoduls A method for contacting a chip module |
10/12/2006 | DE10164606B4 Flip-Chip-Halbleitereinrichtung mit außerhalb von Energiezufuhranschlussflächen angeordneten Signalanschlussflächen Flip-chip semiconductor device having arranged outside of power supply pads signal pads |
10/12/2006 | DE10154884B4 Vorrichtung zum Transport von flexiblem Flachmaterial, insbesondere Leiterplatten Device for the transport of flexible flat material, especially printed circuit boards |
10/12/2006 | DE10005836B4 Leiterplattensicherung mit erhöhter Sicherheit PCB fuse with enhanced security |
10/11/2006 | EP1711044A2 Method of transferring components onto a surface |
10/11/2006 | EP1711041A2 Wiring board, multilayer wiring board, and method for manufacturing the same |
10/11/2006 | EP1711040A1 Circuit device and manufacturing method thereof |
10/11/2006 | EP1710095A1 Method for manufacturing a printing screen for serigraphy |
10/11/2006 | EP1709852A2 Improved populated printed wiring board and method of manufacture |
10/11/2006 | EP1709849A1 Method of manufacturing a circuit carrier and the use of the method |
10/11/2006 | EP1709848A1 Partially etched dielectric film with conductive features |
10/11/2006 | EP1709847A1 Micro-electromechanical sub-assembly having an on-chip transfer mechanism |
10/11/2006 | EP1709846A1 Screen printer |
10/11/2006 | EP1709675A1 Wafer level super stretch solder |
10/11/2006 | EP1709674A1 Plasma processing method and method for fabricating electronic component module using the same |
10/11/2006 | EP1709261A1 Façade covering |
10/11/2006 | EP1709215A2 Chromium-free antitarnish adhesion promoting treatment composition |
10/11/2006 | EP1708870A1 Press for the production of laminates |
10/11/2006 | EP1587728B1 Stanchion with an integrated device for securing a load, in particular for tarpaulin-covered transport vehicles |
10/11/2006 | EP1456911B1 Assembly and connecting technique in textile structures |
10/11/2006 | EP1264347B1 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
10/11/2006 | EP1168899B1 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same |
10/11/2006 | EP1087844A4 Apparatus and method for coating a multilayer article |
10/11/2006 | EP0998760B1 Solid-state energy storage module employing integrated interconnect board |
10/11/2006 | EP0870325B1 Microelectronic mounting with multiple lead deformation |
10/11/2006 | CN2826916Y LED fixer with polarity mark action |
10/11/2006 | CN2826913Y Universal template for wiring |
10/11/2006 | CN2826903Y Structure improvement of assembling and positioning method for interface card expansion groove |
10/11/2006 | CN1846306A Method for producing an electronic component or module and a corresponding component or module |
10/11/2006 | CN1845984A Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards |
10/11/2006 | CN1845977A Adhesive agent and method for production thereof |
10/11/2006 | CN1845666A Shielding structure |
10/11/2006 | CN1845657A Method for making electrical behavior connection structure |
10/11/2006 | CN1845656A Switch made on circuit board |
10/11/2006 | CN1845655A Wiring board, multilayer wiring board, and method for manufacturing the same |
10/11/2006 | CN1845654A Vacuum air compression warehouse for circuit board |
10/11/2006 | CN1845653A Single plate and its processing method |
10/11/2006 | CN1845652A Printed circuit board structure and method for manufacturing same |
10/11/2006 | CN1843758A Printing device and printing method |
10/11/2006 | CN1279797C Transparent substrate setted with electroconductive channel |
10/11/2006 | CN1279796C Method for fixing and treating film material |
10/11/2006 | CN1279612C Circuit base plate, electronic machine, and method of manufacture |
10/11/2006 | CN1279552C Resistance wiring board and its mfg. method |
10/11/2006 | CN1279155C Detergent |
10/11/2006 | CN1279134C Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus |
10/11/2006 | CN1279114C Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same |
10/10/2006 | US7120893 System and method for evaluation of electric characteristics of printed-circuit boards |
10/10/2006 | US7120885 Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise |
10/10/2006 | US7120492 Flyback transformer wire attach method to printed circuit board |