H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2006
11/22/2006	CN1867597A Process for producing resin-coated metal powder, resin-coated metal powder and circuit forming toner
11/22/2006	CN1867455A Elastomeric stamp, patterning method using such a stamp and method for producing such a stamp
11/22/2006	CN1867419A Laser-based system for memory link processing with picosecond lasers
11/22/2006	CN1867229A Copper foil for printed circuit board with taking environmental conservation into consideration
11/22/2006	CN1867228A Circuit board element welding method
11/22/2006	CN1867227A Multilayer film, electrooptic device, electronic apparatus, and process for forming multilayer film
11/22/2006	CN1867226A Method of manufacturing wiring circuit board
11/22/2006	CN1867225A Multilayer module and method of manufacturing the same
11/22/2006	CN1867224A Component-embedded substrate and method of manufacturing the same
11/22/2006	CN1867223A Flexible substrate and method for manufacturing same, flexible substrate for LED mounting and lighting device
11/22/2006	CN1866489A Electronic component joint device
11/22/2006	CN1866483A Wiring substrate and manufacturing method thereof
11/22/2006	CN1865520A Sheet product plating method
11/22/2006	CN1286353C Device and method for installing electronic elements
11/22/2006	CN1286223C Method for welding unit on connection supporting seat without addition material
11/22/2006	CN1286212C Connecting structure between flexible circuit board and printed circuit board
11/22/2006	CN1286057C Non-contact communication medium
11/22/2006	CN1285970C Composition for forming wiring protective film and uses thereof
11/22/2006	CN1285941C Lens barrel and imaging apparatus
11/22/2006	CN1285916C Electrical parameter inspection apparatus
11/22/2006	CN1285765C Acidic treatment liquid and method of treating copper surfaces
11/22/2006	CN1285420C Microdeposition apparatus
11/21/2006	US7139177 Printed circuit board with void between pins
11/21/2006	US7139176 Circuit substrate and method for fabricating the same
11/21/2006	US7139060 Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
11/21/2006	US7138805 Device and method for inspection
11/21/2006	US7138659 LED assembly with vented circuit board
11/21/2006	US7138334 Systems for forming insulative coatings for via holes in semiconductor devices
11/21/2006	US7138330 High reliability multilayer circuit substrates and methods for their formation
11/21/2006	US7138294 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same
11/21/2006	US7138171 Printing ink layer formed on surface of the flexible substrate of polyimide, Teflon, polyamide, polymethyl methacrylate, polycarbonate, polylester, and/or polyethylene terephthalate by coating, exposing, and developing to uncover parts of the conductive trace layer; curing
11/21/2006	US7138170 Terminated conductive patterned sheet utilizing conductive conduits
11/21/2006	US7138064 Semiconductor device and method of manufacturing the same
11/21/2006	US7137852 Fixing structure for electron device
11/21/2006	US7137830 Miniaturized contact spring
11/21/2006	US7137828 Reinforced flexible printed circuit board
11/21/2006	US7137827 Interposer with electrical contact button and method
11/21/2006	US7137547 Process for forming electrical/mechanical connections
11/21/2006	US7137195 Method for mounting electronic parts onto a board
11/21/2006	US7137194 Apparatus and method for maintaining a dry atmosphere in a surface mount device placement machine
11/21/2006	US7137193 Programmed material consolidation methods for fabricating printed circuit board
11/21/2006	US7137189 Method of constructing an integrated lead suspension
11/21/2006	US7137188 Method of constructing an integrated lead suspension
11/21/2006	US7137187 Integrated lead suspension for high density drive
11/16/2006	WO2006122025A1 Process for minimizing electromigration in an electronic device
11/16/2006	WO2006120826A1 Ceramic multilayer board
11/16/2006	US20060258200 Conductive terminal and the electrical connector using the conductive terminal
11/16/2006	US20060258141 Ball Film For Integrated Circuit Fabrication and Testing
11/16/2006	US20060258139 Manufacturing method for wiring circuit substrate
11/16/2006	US20060258132 Templated cluster assembled wires
11/16/2006	US20060258058 Surface-mounted device with leads
11/16/2006	US20060258057 Electronic part manufacturing method and base sheet
11/16/2006	US20060258050 Module component and method for manufacturing the same
11/16/2006	US20060255876 Compact via transmission line for printed circuit board and its designing method
11/16/2006	US20060255440 Composite multi-layer substrate and module using the substrate
11/16/2006	US20060255157 Method for production of a card with a double interface and microcircuit card obtained thus
11/16/2006	US20060255147 Long range optical reader
11/16/2006	US20060255013 Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate
11/16/2006	US20060254813 Plating buss and a method of use thereof
11/16/2006	US20060254810 Technique for accommodating electronic components on a multilayer signal routing device
11/16/2006	US20060254809 Modular integrated circuit chip carrier
11/16/2006	US20060254808 Substrate precursor structures
11/16/2006	US20060254053 Post chemical mechanical polishing etch for improved time dependent dielectric breakdown reliability
11/16/2006	US20060254052 Dielectric substrate with aperture; grounding layer; electroconductive overcoating; multilayer ; irradiating with ions
11/16/2006	US20060254051 Method for the space-saving installation of electrical wiring
11/16/2006	US20060254050 Method for fabricating wiring board provided with passive element, and wiring board provided with passive element
11/16/2006	DE102006021765A1 Electronic component-embedded printed circuit board (PCB) manufacture for e.g. mobile telephones, involves pressing metal foils against B-stage thermosetting layer to form core layer in which electronic components are embedded
11/16/2006	DE102005032489B3 Circuit board multi-layer structure with integrated electric component, has insert embedded between two flat electrically insulating liquid resin structures
11/16/2006	DE102005022927A1 Electrical coil element produced by automatic assembly has coil wound onto a core with increased spacing between sections
11/16/2006	DE102005021495A1 Method for local removal of covering compound e.g. for circuit board, has part-surface not to be processed covered with hole-mask
11/16/2006	DE102005019920A1 Partially formed electroconductive structure producing method for use with e.g. carrier foil, involves producing latent magnetic image of graphic form of electro conductive structure from digital data set on magnetizable printing drum
11/15/2006	EP1722616A2 Technique for defining a wettable solder joint area for an electronic assembly substrate
11/15/2006	EP1722615A2 A printed circuit board having protection means and a method of use thereof
11/15/2006	EP1722614A1 Wiring board and method of manufacturing the same
11/15/2006	EP1722613A1 Three-dimensional circuit board
11/15/2006	EP1722612A1 Component mounting board structure and production method thereof
11/15/2006	EP1722414A2 Improved reliability and improved frequency response package for extremely high power density transistors
11/15/2006	EP1722411A2 Ceramic circuit board
11/15/2006	EP1722268A1 Flat panel display and method of manufacturing the same
11/15/2006	EP1721500A1 Molded abrasive brush and methods of using for manufacture of printed circuit boards
11/15/2006	EP1721499A1 Environmentally tuned circuit card assembly and method for manufacturing the same
11/15/2006	EP1721498A2 Electronic module and method for the production thereof
11/15/2006	EP1721496A2 Preferential ground and via exit structures for printed circuit boards
11/15/2006	EP1721369A1 Soldering nest for a bus bar
11/15/2006	EP1720956A1 Etched dielectric film in microfluidic devices
11/15/2006	EP1649734B1 Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device
11/15/2006	EP1569757A4 Apparatus for microdeposition of multiple fluid materials
11/15/2006	EP1543453A4 System and method for modifying electronic design data
11/15/2006	EP1374651B1 Encapsulation arrangement
11/15/2006	EP1284357B1 Fuel injection device
11/15/2006	EP1018099B1 Deactivateable resonant circuit
11/15/2006	EP0882086B1 Composition exhibiting improved fluorescent response
11/15/2006	EP0826152B1 Method and apparatus for testing semiconductor dice
11/15/2006	EP0815709B1 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple intgrated circuit packages
11/15/2006	CN2838210Y Auxiliary clamps for production of flexible PCB
11/15/2006	CN1864450A Electrical circuit apparatus and method for assembling same
11/15/2006	CN1864276A Multi-stack surface mount light emitting diodes
11/15/2006	CN1864258A Electrical circuit apparatus and methods for assembling same
11/15/2006	CN1864095A Device and method of making a device having a flexible layer structure
11/15/2006	CN1864070A Circuit board inspection device

1 ... 428 429 430 431 432 433 434 435 436 437 438 439 440 441 442 443 444 445 446 447 448 ... 1185