| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 09/18/2008 | US20080223612 Wiring substrate and manufacturing method thereof |
| 09/18/2008 | US20080223606 Ceramic Substrate and Method for Manufacturing the Same |
| 09/18/2008 | US20080223605 Embedded circuit board and process thereof |
| 09/18/2008 | US20080223527 Method For Patterning Reel-To-Reel Strip In Automatic Manufacturing Process |
| 09/18/2008 | US20080222884 Packaging for chip-on-board pressure sensor |
| 09/18/2008 | US20080222866 Multilayered piezoelectric element and method of manufacturing the same |
| 09/18/2008 | US20080222864 Method for forming a multi-frequency surface acoustic wave device |
| 09/18/2008 | DE102007012501A1 Conductor and circuit carrier assembly, for a hybrid circuit or circuit board, has a conductor embedded in a base plate with an extended tine in contact with a circuit component |
| 09/18/2008 | DE10084996B4 Lottragender Körper zur Verwendung bei Lötvorgängen Solder-bearing body for use in soldering |
| 09/18/2008 | CA2677150A1 Conformal coating comprising binder and non-conductive particulate |
| 09/17/2008 | EP1971194A2 Wiring substrate and manufacturing method thereof |
| 09/17/2008 | EP1970722A2 Protection Circuit Board for Secondary Battery |
| 09/17/2008 | EP1969910A2 Lead(pb)-free electronic component attachment |
| 09/17/2008 | EP1969908A2 Electric device comprising a lubricated joint point and method for lubricating said type of joint point |
| 09/17/2008 | EP1969677A2 Wire comb |
| 09/17/2008 | EP1969631A2 Microelectronic intercionnect substrate and packaging techniques |
| 09/17/2008 | EP1969624A1 Integrated electronic device and cooling device for an integrated electronic device |
| 09/17/2008 | EP1604556B1 Electronic card with wire-braced structure |
| 09/17/2008 | EP0728166B2 Pressure sensitive adhesives |
| 09/17/2008 | CN201119264Y Precise location platform for fully automatic no lead tin plaster printer based on flexible mechanism |
| 09/17/2008 | CN201119128Y Built-in microwave circuit board for micro assembly cavity with temporary block welding film |
| 09/17/2008 | CN201119127Y Resistance repair structure for current inductance component |
| 09/17/2008 | CN201119126Y Bulb elimination and solution recycling device |
| 09/17/2008 | CN201119125Y Coating copper plate erosion device |
| 09/17/2008 | CN201119124Y Vacuum taphole machine |
| 09/17/2008 | CN201119123Y Processing device for half-automatic PCB board jumper |
| 09/17/2008 | CN201119122Y Carrying tool for printed circuit board |
| 09/17/2008 | CN101268725A Ceramic multilayer substrate and method for manufacturing the same |
| 09/17/2008 | CN101268724A Printing template of an smt process and method of coating it |
| 09/17/2008 | CN101268411A Device and method for producing electronic device such as display device, and electronic device such as display device |
| 09/17/2008 | CN101268146A Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
| 09/17/2008 | CN101267964A Combined fastening and contacting system for electrical components on superimposed circuit boards |
| 09/17/2008 | CN101267911A Lead-free low-temperature solder |
| 09/17/2008 | CN101267717A Multilayer build-up wiring board |
| 09/17/2008 | CN101267716A Multilayer build-up wiring board |
| 09/17/2008 | CN101267715A Multilayer build-up wiring board |
| 09/17/2008 | CN101267714A Electronic device and electronic component mounting method |
| 09/17/2008 | CN101267713A Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
| 09/17/2008 | CN101267712A A processing method for alleviating Galvanic corrosion of PCB board |
| 09/17/2008 | CN101267711A Printing circuit substrate and exhausting method thereof |
| 09/17/2008 | CN101267710A Printed circuit board unit and printed wiring board |
| 09/17/2008 | CN101266484A Process control method, data registration program, and method for manufacturing electronic device |
| 09/17/2008 | CN101266408A Laminating body, grafting film forming method using the same and forming method for grafting pattern |
| 09/17/2008 | CN101266400A Portable equipment, bonded type camera shooting module group and its assembled method |
| 09/17/2008 | CN101265577A Quick assembling and maintenance type vertically conveyed lamella etching conveyer device |
| 09/17/2008 | CN101265440A Printed wiring board cleaning agent |
| 09/17/2008 | CN100420357C Method and apparatus for determining fastener fabrication dimension |
| 09/17/2008 | CN100420356C Improved method for imlaying thick-film assembly |
| 09/17/2008 | CN100420355C Figure-forming method and wire-layout figure forming method and photoelectronic device |
| 09/17/2008 | CN100420354C Method for forming wire-layout pattern and method for making semiconductor device and photoelectronic device |
| 09/17/2008 | CN100420106C Method of making an electrical connector |
| 09/17/2008 | CN100419924C Composite electronic element and method for producing the same element |
| 09/17/2008 | CN100419505C 显示装置 The display device |
| 09/17/2008 | CN100419435C Board for probe card,inspection apparatus,photo-fabrication apparatus and photo-fabrication method |
| 09/17/2008 | CN100418960C New use of 4-(4-mothyl-n-amyl) cyclohexane-1,2-diacid anhydride |
| 09/17/2008 | CN100418787C Connection module |
| 09/17/2008 | CN100418643C Method for forming relief image and paatern formed by that method |
| 09/16/2008 | US7425766 Film substrate, fabrication method thereof, and image display substrate |
| 09/16/2008 | US7425762 Electronic apparatus |
| 09/16/2008 | US7425755 Semiconductor package, method for manufacturing the same and lead frame for use in the same |
| 09/16/2008 | US7425683 Flexible wiring base material and process for producing the same |
| 09/16/2008 | US7425470 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
| 09/16/2008 | US7425299 Forming solder bumps on substrate ; alloy of silver, copper, tin |
| 09/16/2008 | US7425135 Flex circuit assembly |
| 09/16/2008 | US7425081 LED lamp assembly with conductive epoxy LED interconnections |
| 09/16/2008 | CA2260885C Method for making printed circuits and resulting printed circuit |
| 09/12/2008 | WO2008109412A1 Method for fabricating electrical circuitry on ultra-thin plastic films |
| 09/12/2008 | WO2008108359A1 Solder resist, dry film thereof, cured product and printed wiring board |
| 09/12/2008 | WO2008108357A1 Photosensitive composition, solder resist and photosensitive dry film |
| 09/12/2008 | WO2008108313A1 Resin composition for composite laminate and composite laminate |
| 09/12/2008 | WO2008108172A1 Multilayer wiring substrate |
| 09/12/2008 | WO2008107983A1 Analyzer, analysis method, and analysis program |
| 09/12/2008 | WO2008088725A3 High-current traces on plated molded interconnect device |
| 09/12/2008 | WO2008068163A3 Base film for preventing the electro-static discharge of an electronic module and module producing method using the base film |
| 09/12/2008 | WO2008066786A3 Method for manufacturing printed circuit boards |
| 09/11/2008 | US20080220667 Electrical terminal for sealed accumulator |
| 09/11/2008 | US20080220645 Method for integrating an indicator light in a connector assembly |
| 09/11/2008 | US20080220566 Substrate process for an embedded component |
| 09/11/2008 | US20080220229 dielectrics; micelles |
| 09/11/2008 | US20080220208 Taped component and method of mounting product using the same |
| 09/11/2008 | US20080218985 Multilayer printed circuit board and method of manufacturing same |
| 09/11/2008 | US20080218983 Method of manufacturing circuit board and circuit board |
| 09/11/2008 | US20080218799 Extended COB-USB With Dual-Personality Contacts |
| 09/11/2008 | US20080218749 Metal comb structures, methods for their fabrication and failure analysis |
| 09/11/2008 | US20080217617 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same |
| 09/11/2008 | US20080217052 Wiring board and method of manufacturing wiring board |
| 09/11/2008 | US20080217051 Wiring board and method of manufacturing wiring board |
| 09/11/2008 | US20080217050 Multi-layered interconnect structure using liquid crystalline polymer dielectric |
| 09/11/2008 | US20080217046 Circuit board surface structure and fabrication method thereof |
| 09/11/2008 | US20080217045 Underlay substrate, screen printing method and manufacturing method of printed circuit substrate |
| 09/11/2008 | US20080216681 Frame Unit for Tensioning a Printing Screen and a Jig for Fitting a Printing Screen to or Removing a Printing Screen From a Frame Unit |
| 09/11/2008 | US20080216314 Method for manufacturing the bga package board |
| 09/11/2008 | US20080216313 Method For Fabricating IC Board Without Ring Structure |
| 09/11/2008 | US20080216298 Embedded capacitive stack |
| 09/11/2008 | DE19831394B4 Träger für Bauelemente Support for components |
| 09/11/2008 | DE10248020B4 Verfahren und Vorrichtung zum Fügen von zumindest zwei Bauteilen Method and apparatus for assembling at least two components |
| 09/11/2008 | DE102007011458A1 Steckverbindungssystem Plug connection system |
| 09/10/2008 | EP1968368A2 Printed wiring board and method for producing the same |
| 09/10/2008 | EP1968367A1 Soldering method, semiconductor module manufacturing method and soldering apparatus |
| 09/10/2008 | EP1968366A1 Soldering method, semiconductor module manufacturing method and soldering apparatus |