| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/01/2008 | CN100421818C Dispensation of controlled quantities of material onto a substrate |
| 09/30/2008 | US7430127 Electronic circuit board |
| 09/30/2008 | US7430125 Data processing terminal, parent board, child board, terminal designing apparatus and method, computer program, and information storage medium |
| 09/30/2008 | US7429797 Electronic device and carrier substrate |
| 09/30/2008 | US7429789 Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 09/30/2008 | US7429401 Two-step process involving immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst; produces a a seam-free and void-free metal microelectronic conductor. |
| 09/30/2008 | US7428979 Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process |
| 09/30/2008 | US7428776 Method of manufacturing a magnetic head |
| 09/30/2008 | CA2371986C Low cost antennas using conductive plastics or conductive composites |
| 09/30/2008 | CA2336889C A thermal management device and method of making such a device |
| 09/25/2008 | WO2008114711A1 Water soluble pressure sensitive adhesive for fine solder ball replacement |
| 09/25/2008 | WO2008114674A1 Insulating composite body, method for producing the same, and use of insulating composite body |
| 09/25/2008 | WO2008114551A1 Method for forming via hole by electrophotographic printing method |
| 09/25/2008 | WO2008114546A1 Wiring board module and method for manufacturing the wiring board module |
| 09/25/2008 | WO2008114465A1 Method of forming solder bumps and solder bump-forming assembly |
| 09/25/2008 | WO2008114434A1 Mount substrate, process for producing the same, semiconductor device and process for producing the same |
| 09/25/2008 | WO2008113644A2 Sensor element of a gas sensor |
| 09/25/2008 | WO2008113304A1 Panel devices comprising electric circuit boards and method for the production thereof |
| 09/25/2008 | WO2008049504A3 Module |
| 09/25/2008 | WO2008009283A8 Resistor assembly and method for producing said assembly |
| 09/25/2008 | US20080233822 Electrical Components and Circuits Constructed as Textiles |
| 09/25/2008 | US20080233740 Method for Producing Electrically Conductive Bushings Through Non-Conductive or Semiconductive Substrates |
| 09/25/2008 | US20080232676 Fabrication method of semiconductor integrated circuit device |
| 09/25/2008 | US20080232119 Led lamp assembly with temperature control and method of making the same |
| 09/25/2008 | US20080232077 Conversion substrate for a leadframe and the method for making the same |
| 09/25/2008 | US20080232075 Electronic Component and Manufacturing the Same |
| 09/25/2008 | US20080232072 Circuit board cam-action standoff connector |
| 09/25/2008 | US20080232057 Method For Docking An Electronic Circuit Board |
| 09/25/2008 | US20080231305 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 09/25/2008 | US20080230914 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/25/2008 | US20080230749 Low molecular weight unsaturated polyester; thermosetting agent for bonding |
| 09/25/2008 | US20080230515 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| 09/25/2008 | US20080230512 Printed Circuit Board and Method for Processing Printed Circuit Board |
| 09/25/2008 | US20080230464 Two sided conductive filtration media |
| 09/25/2008 | US20080230390 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating |
| 09/25/2008 | US20080230357 Gold-metal oxide thin films for wear-resistant microelectromechanical systems ("mems") |
| 09/25/2008 | US20080230264 Interconnection structure and method thereof |
| 09/25/2008 | US20080230263 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board |
| 09/25/2008 | US20080230171 Method for producing catalyst-layer-supporting substrate, method for producing membrane-electrode assembly and method for producing fuel cell |
| 09/25/2008 | US20080230118 Printing Mask and Solar Cell |
| 09/25/2008 | US20080229575 Semiconductor Chip Attachment |
| 09/25/2008 | DE112004000057B4 Plasmabehandlungsapparat und Plasmabehandlungsverfahren Plasma processing apparatus and plasma processing method |
| 09/25/2008 | DE10247409B4 Keramischer Substratkörper und Verfahren zu dessen Herstellung Ceramic substrate body and process for its preparation |
| 09/25/2008 | DE102008012256A1 Elektronik-Komponenten-Montageplatte An electronic components mounting plate |
| 09/25/2008 | DE102008011631A1 Elektronische Einrichtung und Montageverfahren für Elektronische Komponenten Electronic device and method for assembling electronic components |
| 09/25/2008 | DE102005016511B4 Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat A method for producing a conductor pattern on a substrate |
| 09/25/2008 | DE10125570B4 Verfahren zum Verbinden von Leiterbahnen mit Kunststoffoberflächen A method for connecting conductor tracks with plastic surfaces, |
| 09/24/2008 | EP1973119A2 Anisotropic conductive film and adhesion method thereof |
| 09/24/2008 | EP1506568A4 Direct-connect signaling system |
| 09/24/2008 | EP1200968A4 Aqueous carbon composition and method for coating a non conductive substrate |
| 09/24/2008 | CN201123174Y Film switch circuit and press key using the same |
| 09/24/2008 | CN201123173Y Exposure positioning device for printed circuit board |
| 09/24/2008 | CN201122462Y Printing type ultra-thin coaxial transmission line |
| 09/24/2008 | CN201122284Y Electric-controlled circuit structure for touch control plate |
| 09/24/2008 | CN201120612Y Mechanical arm and transmission mechanism, and circuit board retraction machine with the mechanical arm |
| 09/24/2008 | CN201120513Y Automatic tin soldering machine |
| 09/24/2008 | CN201120365Y Transversely clamping mechanism of glue dropping machine |
| 09/24/2008 | CN101273679A Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module |
| 09/24/2008 | CN101273674A Substrate structure |
| 09/24/2008 | CN101273673A Board structure and electronic device |
| 09/24/2008 | CN101273445A Atmosphere controlled joint device, method and electronic device |
| 09/24/2008 | CN101272931A Conductive textile, antenna and vehicle seat |
| 09/24/2008 | CN101272663A Method for manufacturing multi-layer wiring substrate |
| 09/24/2008 | CN101272662A Method for manufacturing multi-layer wiring substrate |
| 09/24/2008 | CN101272661A Method for manufacturing multi-layer wiring substrate |
| 09/24/2008 | CN101272660A Soft and hard combined printed wiring board production method |
| 09/24/2008 | CN101272659A Method for sticking wire on substrates |
| 09/24/2008 | CN101272658A Method for sticking wire on substrates |
| 09/24/2008 | CN101272657A Circuit board film pressing device and method |
| 09/24/2008 | CN101272133A Band pass filter |
| 09/24/2008 | CN101271996A Radio frequency recognizing electronic label antenna and method for producing the same |
| 09/24/2008 | CN101271886A High-density circuit module |
| 09/24/2008 | CN101271883A Production method of circuit substrates and inductor wire |
| 09/24/2008 | CN101271848A Method for manufacturing multi-layer wire substrate |
| 09/24/2008 | CN101271205A Liquid crystal display apparatus |
| 09/24/2008 | CN100421533C Method for producing electronic circuit and electronic circuit substrate |
| 09/24/2008 | CN100421532C Figure-forming method and wire-layout figure forming method, photoelectronic device and electronic apparatus |
| 09/24/2008 | CN100421249C Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 09/24/2008 | CN100421227C Manufacturing method of electronic part and wiring substrate |
| 09/24/2008 | CN100420524C Droplet discharge method, electro optical device and electronic apparatus |
| 09/23/2008 | US7427804 Optoelectronic semiconductor device and light signal input/output device |
| 09/23/2008 | US7427718 Ground plane having opening and conductive bridge traversing the opening |
| 09/23/2008 | US7427717 Flexible printed wiring board and manufacturing method thereof |
| 09/23/2008 | US7427716 Microvia structure and fabrication |
| 09/23/2008 | US7427557 Methods of forming bumps using barrier layers as etch masks |
| 09/23/2008 | US7427423 potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element |
| 09/23/2008 | US7427360 Process and ink for making electronic devices |
| 09/23/2008 | US7427338 Flow diffuser to be used in electro-chemical plating system |
| 09/23/2008 | US7426952 Bonding flexible film circuit and electronic circuit board |
| 09/18/2008 | WO2008112433A1 Conformal coating comprising binder and non-conductive particulate |
| 09/18/2008 | WO2008111484A1 Conductive ink for letterpress reverse printing |
| 09/18/2008 | WO2008111408A1 Multilayer wiring board and method for manufacturing the same |
| 09/18/2008 | WO2008111345A1 Electronic device, and electronic device manufacturing method |
| 09/18/2008 | WO2008111309A1 Recognition mark, and circuit substrate manufacturing method |
| 09/18/2008 | WO2008111247A1 Photosensitive composition, photosensitive film, method for formation of permanent pattern, and print substrate |
| 09/18/2008 | WO2008074447A3 Method for the production of a randomly patterned electrically conductive element |
| 09/18/2008 | US20080227946 Thermosetting Composition and Curing Method Thereof |
| 09/18/2008 | US20080227369 Apparatus and Method for Confined Area Planarization |
| 09/18/2008 | US20080226877 Method for mounting a semiconductor package onto PCB |
| 09/18/2008 | US20080224271 Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device |