| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/24/2008 | CN101330800A Methods for manufacturing circuit substrate |
| 12/24/2008 | CN101330799A Non-conductor electroplating method for independent soldering pad |
| 12/24/2008 | CN101330798A System for processing overlapping membrana |
| 12/24/2008 | CN101330163A Film type antenna and production method thereof |
| 12/24/2008 | CN101330071A Mounting substrate and manufacturing method thereof |
| 12/24/2008 | CN101329937A Hollow coil structured by multiple layer mirrorimage wiring printed circuit board |
| 12/24/2008 | CN100446652C Micro modular pasting header for high speed fully automatic chip machine |
| 12/24/2008 | CN100446651C Assembling method for column on machine board and its structure |
| 12/24/2008 | CN100446641C Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof |
| 12/24/2008 | CN100446640C An after-treatment fluid for copper surface black oxidation |
| 12/24/2008 | CN100446639C Wiping mechanism |
| 12/24/2008 | CN100446638C Method and system for creating B side and T side detailed list of veneer |
| 12/24/2008 | CN100446343C Circuit board mounting bracket |
| 12/24/2008 | CN100446305C Battery with connector |
| 12/24/2008 | CN100446224C Wiring substrate and method of fabricating the same |
| 12/24/2008 | CN100446205C Semiconductor device and process for manufacturing the same |
| 12/24/2008 | CN100446137C Manufacturing method of ceramic raw sheet and manufacturing method of electronic member using the ceramic raw sheet |
| 12/24/2008 | CN100445096C Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors |
| 12/24/2008 | CN100444998C Silver powder and method for producing same |
| 12/24/2008 | CA2690339A1 Split wave compensation for open stubs |
| 12/23/2008 | US7468648 Magnetic device |
| 12/23/2008 | US7468645 Signal line circuit device |
| 12/23/2008 | US7468558 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof |
| 12/23/2008 | US7468294 Semiconductor device and a method of manufacturing the same |
| 12/23/2008 | US7468197 Flexible metal-clad laminate and method for producing the same |
| 12/23/2008 | US7468113 Method for producing non-woven fabric |
| 12/23/2008 | US7467468 Method for manufacturing an ink-jet head |
| 12/23/2008 | US7467464 Method of manufacturing a memory card |
| 12/23/2008 | CA2342232C Method for producing etched circuits |
| 12/18/2008 | WO2008154123A2 Method of forming solid blind vias through the dielectric coating on high density interconnect (hdi) substrate materials |
| 12/18/2008 | WO2008153939A1 Multilayer printed wiring boards with holes requiring copper wrap plate |
| 12/18/2008 | WO2008153398A1 Method for preparing a patterned electric circuit |
| 12/18/2008 | WO2008153208A1 Resin composition for interlayer insulation of multilayer printed wiring board |
| 12/18/2008 | WO2008153185A1 Embedding copper plating method for manufacture of printed wiring board, and printed wiring board obtained by using the embedding copper plating method |
| 12/18/2008 | WO2008153156A1 Apparatus and method for manufacturing multilayer wiring board |
| 12/18/2008 | WO2008153137A1 Transfer film for burning |
| 12/18/2008 | WO2008152974A1 Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property |
| 12/18/2008 | WO2008152827A1 Printed-wiring board and method for manufacturing the same |
| 12/18/2008 | WO2008152735A1 Pressure welding jig for surface mount component and process for manufacturing circuit board |
| 12/18/2008 | WO2008152629A2 Method for attaching smt stencil to a substrate |
| 12/18/2008 | WO2008152506A2 A method and a device for depositing or removing a layer on/from a workpiece, an analysis method and device for analysing an expected layer thickness, a method for setting up a database for such an analysis method or device, as well as such a database |
| 12/18/2008 | WO2008152240A2 Dashboard indicator module formed by a motor and electrical connection means |
| 12/18/2008 | WO2008152193A1 Method in manufacturing of circuit boards |
| 12/18/2008 | WO2008151472A1 Multilayer board surface-treated configuration and the producing method thereof |
| 12/18/2008 | US20080311777 Pin grid array socket having a base with interior standoffs and hightening peripheral walls |
| 12/18/2008 | US20080311768 Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries |
| 12/18/2008 | US20080311737 Manufacturing method for semiconductor device containing stacked semiconductor chips |
| 12/18/2008 | US20080311703 Lead frame and a method of manufacturing the same |
| 12/18/2008 | US20080311359 free of laser irradiation defect; thin film layer of antimony doped tin oxide or mixed oxides of tin and iridium; thin film layer is irradiated with an excimer laser light or a YAG laser light |
| 12/18/2008 | US20080311285 Contact hole forming method, conducting post forming method, wiring pattern forming method, multilayered wiring substrate producing method, electro-optical device producing method, and electronic apparatus producing method |
| 12/18/2008 | US20080310137 Function Element, Method For Manufacturing The Function Element, Electronic Device Equipped With The Function Element, And Method For Manufacturing The Electronic Device |
| 12/18/2008 | US20080310135 Shielded circuit assembly and method |
| 12/18/2008 | US20080310132 Printed circuit board and manufacturing method thereof |
| 12/18/2008 | US20080309726 Printhead integrated circuit with ink supply channel feeding a plurality of nozzle rows |
| 12/18/2008 | US20080309725 Inkjet printhead with filter structure at inlet to ink chambers |
| 12/18/2008 | US20080309459 Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor |
| 12/18/2008 | US20080308943 Wiring structure and semiconductor device, and their fabrication methods |
| 12/18/2008 | US20080308931 Electronic Structures Including Barrier Layers Defining Lips |
| 12/18/2008 | US20080308923 High performance chip carrier substrate |
| 12/18/2008 | US20080308315 Multilayer printed circuit board and method of fabricating the same |
| 12/18/2008 | US20080308313 Split wave compensation for open stubs |
| 12/18/2008 | US20080308309 Structure of packaging substrate having capacitor embedded therein and method for fabricating the same |
| 12/18/2008 | US20080308308 Method of manufacturing wiring board, method of manufacturing semiconductor device and wiring board |
| 12/18/2008 | US20080308307 Trace structure and method for fabricating the same |
| 12/18/2008 | US20080308304 Multilayer Wiring Board and Its Manufacturing Method |
| 12/18/2008 | US20080308303 Chip carrier substrate and production method therefor |
| 12/18/2008 | US20080308001 Metallic colloidal solution and inkjet-use metallic ink |
| 12/18/2008 | US20080307644 Metal plugged substrates with no adhesive between metal and polyimide |
| 12/18/2008 | US20080307643 Method of assembly to achieve thermal bondline with minimal lead bending |
| 12/18/2008 | US20080307642 Method of manufacturing electronic component integrated substrate |
| 12/18/2008 | US20080307641 Method of fabricating paste bump for printed circuit board |
| 12/18/2008 | US20080307640 Method for reinforcing the connection of flat cable member and method for manufacturing image display unit |
| 12/18/2008 | DE102007027999A1 Heißprägen von Strukturen Hot embossing of structures |
| 12/18/2008 | DE102007027998A1 Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer Hot embossing of conductor tracks on photovoltaic silicon wafer |
| 12/18/2008 | DE102007027473A1 Drucktechnisch hergestellte funktionale Komponenten Functional components Pressure Engineered |
| 12/18/2008 | CA2690198A1 Method in manufacturing of circuit boards |
| 12/17/2008 | EP2003943A2 Method and apparatus for aligning and installing flexible circuit interconnects |
| 12/17/2008 | EP2003942A2 Method of assembly to achieve thermal bondline with minimal lead bending |
| 12/17/2008 | EP2003941A2 Printed functional components |
| 12/17/2008 | EP2003940A2 Printed functional components |
| 12/17/2008 | EP2003939A1 Method for preparing a pattern for a 3-dimensional electric circuit |
| 12/17/2008 | EP2003698A2 Hot stamping of PCB tracks on photovoltaic silicon wafers |
| 12/17/2008 | EP2002973A1 Mold release film, mold release cushion material, and process for manufacturing printed board |
| 12/17/2008 | EP2002698A1 Components joining method and components joining structure |
| 12/17/2008 | EP2001988A2 Improved alkaline solutions for post cmp cleaning processes |
| 12/17/2008 | EP2001603A2 Process for creating a pattern on a copper surface |
| 12/17/2008 | EP1917340B1 Method for removing ionic contaminants from the surface of a workpiece |
| 12/17/2008 | EP1385234B1 Mechanical-contact adapter |
| 12/17/2008 | EP1371754B1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 12/17/2008 | CN201167453Y Supercharging type cold air refrigerating device |
| 12/17/2008 | CN201165561Y Electroplating localization mechanism of flexible printed circuit boards |
| 12/17/2008 | CN101326865A Apparatus and method for soldering flat work piece |
| 12/17/2008 | CN101326864A Padless substrate for surface mounted components |
| 12/17/2008 | CN101325846A 多层配线基板及其制造方法 A multilayer wiring board and its manufacturing method |
| 12/17/2008 | CN101325845A Multilayer printed circuit board and method of fabricating the same |
| 12/17/2008 | CN101325844A Method for preparing solder pad of printed circuit board |
| 12/17/2008 | CN101325843A Method of fabricating paste bump for printed circuit board |
| 12/17/2008 | CN101325842A Tool for flexible circuit board |
| 12/17/2008 | CN101325840A Anti-oxidization printed circuit board and gold finger thereof as well as method for manufacturing the printed circuit board |
| 12/17/2008 | CN101325839A Method for assembling electronic part and locating structure thereof |