Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2008
11/05/2008CN100431120C Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
11/05/2008CN100431119C Manufacturing method of lead frame
11/05/2008CN100431074C Capacitor and capacitor built-in circuit substrate and its producing method
11/05/2008CN100431071C Multiple terminal SMT BGA-style wound capacitor
11/05/2008CN100431065C Ceramic electronic element with leads
11/05/2008CN100430810C Process for forming a patterned thin film conductive structure on a substrate
11/05/2008CN100430517C Process for improving the adhesion of polymeric materials to metal surfaces
11/05/2008CN100430427C Electronic material composition, electronic product and method of using electronic material composition
11/05/2008CN100430175C Method for boring holes in a substrate, especially in an electrical circuit substrate, by means of a laser beam
11/05/2008CN100430172C Method for soldering miniaturised components to a base plate
11/04/2008US7446388 Integrated thin film capacitor/inductor/interconnect system and method
11/04/2008US7446383 Electronic device mountable onto a substrate using surface mount techniques, and method
11/04/2008US7446263 Multilayer printed circuit board
11/04/2008US7446262 Laminated electronic component and method for producing the same
11/04/2008US7446030 Methods for fabricating current-carrying structures using voltage switchable dielectric materials
11/04/2008US7445809 Method of forming gate wiring pattern by droplet discharge
11/04/2008US7445731 Comprising metallic particles deposited by reducing metallic ions in water and having primary-particle diameter of at most 200 nm, dispersant having molecular weight of 200 to 30,000, and dispersion medium made of mixed solvent of water and water-soluble organic solvent; easy in handling; circuits, films
11/04/2008US7444733 Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
10/2008
10/30/2008WO2008130493A2 Connecting microsized devices using ablative films
10/30/2008WO2008129911A1 Image formation device, image formation method, pattern formation system, and pattern formation method
10/30/2008WO2008129815A1 Prepreg with carrier, method for manufacturing the prepreg, multilayered printed wiring board, and semiconductor device
10/30/2008WO2008129704A1 Multilayer printed wiring board and method for manufacturing the same
10/30/2008WO2008128945A1 Component having a ceramic base with a metalized surface
10/30/2008WO2008128944A1 Component having a ceramic base the surface of which is metalized
10/30/2008WO2008128943A1 Method for the selective surface treatment of non-flat workpieces
10/30/2008WO2008128754A1 Method and device for applying media to flat substrates
10/30/2008WO2008077608A3 Method and device for spraying on particularly a conductor, electric component comprising a conductor, and metering device
10/30/2008WO2008010978A3 Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
10/30/2008US20080270964 Integrated Power Supply System Analysis System, Integrated Power Supply System Analysis Method, and Multilayer Printed Circuit Board
10/30/2008US20080268669 Transferable Micro Spring Structure
10/30/2008US20080266822 Electronic elements carrier and manufacturing method thereof
10/30/2008US20080266816 Light-Weight Solid State Drive With Rivet Sets
10/30/2008US20080266808 Cooling Assembly
10/30/2008US20080265444 Thin-film aluminum nitride encapsulant for metallic structures on integrated circuits and method of forming same
10/30/2008US20080265405 Substrate with multi-layer interconnection structure and method of manufacturing the same
10/30/2008US20080264798 Copper Plating Bath and Plating Method
10/30/2008US20080264687 Printed circuit board and manufacturing method thereof
10/30/2008US20080264686 Multilayer printed wiring board with filled viahole structure
10/30/2008US20080264684 Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same
10/30/2008US20080264683 Metal wiring plate
10/30/2008US20080264680 Voltage-Operated Layer Arrangement
10/30/2008US20080264678 Member for Interconnecting Wiring Films and Method for Producing the Same
10/30/2008US20080264677 Circuit board structure having embedded capacitor and fabrication method thereof
10/30/2008US20080263860 Method for manufacturing printed circuit board having embedded component
10/30/2008DE4412364B4 Leiterplatte mit einem auf einem Träger laminierten Foliensystem Printed circuit board with a laminated on a support film system
10/30/2008DE202008011121U1 Mikroelektronischer Verbinder Microelectronic connector
10/30/2008DE202008011119U1 Elastischer mikroelektronischer Verbinder Elastic microelectronic connectors
10/30/2008DE202008011118U1 Doppelendiger mikroelektronischer Verbinder Double Terminated microelectronic connectors
10/30/2008DE202008011116U1 Doppelendiger elastischer mikroelektronischer Verbinder Double Terminated elastic microelectronic connectors
10/30/2008DE19937284B4 Elektrisch leitender Mehrschichtaufbau Electrically conductive multilayer structure
10/30/2008DE112006003567T5 Verfahren zum Ausbilden elektrischer Kontakte auf einem Halbleiterwafer unter Verwendung einer Phasenwechsel-Druckfarbe A method of forming electrical contacts on a semiconductor wafer using a phase-change printing ink
10/30/2008DE10297264B4 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
10/30/2008DE102007019116A1 Method for determination of soldering profile with rework of conductor board, involves heating housing of sample element with hot-air equipment for determination of temperature distribution
10/30/2008DE102007019055A1 Method for adjusting temperature of electronic components heated using hot air uses signals from temperature sensor to suddenly reduce flow of air to heater when temperature of component reaches threshold value
10/30/2008DE102007002193B4 Mehrteiliges Kontaktierungsbauteil Multipart Kontaktierungsbauteil
10/30/2008DE10103193B4 Verfahren zur Herstellung von Leiterbahnstrukturen A process for the production of conductor track structures
10/29/2008EP1986481A1 Ceramic laminated device and method for manufacturing same
10/29/2008EP1986480A1 Circuit board manufacturing method and circuit board
10/29/2008EP1986479A2 Wiring substrate and current detection device
10/29/2008EP1986478A2 Metal wiring plate
10/29/2008EP1986204A2 Component detection method
10/29/2008EP1985165A2 Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line
10/29/2008EP1985164A1 Method for producing an electronic module by sequential fixation of the components
10/29/2008EP1985163A1 Flexible printed circuit board with additional functional element and a milled notch, method of production and use
10/29/2008EP1985162A2 Holder for a flexible circuit board
10/29/2008EP1984981A2 Electronic component with high density, low cost attachment
10/29/2008EP1984976A1 An antenna arrangement for a portable radio coummunication device, and a portable radio communication device comprising such an antenna arrangement
10/29/2008EP1888338B1 Printing machine and a method for producing a printed product
10/29/2008EP1687114A4 Vertical removal of excess solder from a circuit substrate
10/29/2008EP1660763B1 Adjusting device, especially for the throttle valve of an internal combustion engine
10/29/2008EP1658661B1 Lamp base for a high-pressure discharge lamp, and corresponding high-pressure discharge lamp
10/29/2008EP1633823B1 Process for etching a metal or alloy surface
10/29/2008EP1342398A4 Energy pathway arrangements for energy conditioning
10/29/2008EP1334542A4 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
10/29/2008EP1277278A4 Isolating energy conditioning shield assembly
10/29/2008EP1264377A4 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways
10/29/2008EP1240667B1 Integrated circuit package
10/29/2008CN201142786Y Manufacturing system for high-frequency metal base printed board
10/29/2008CN201142780Y Preheating device of electric slurry etching reaction stove
10/29/2008CN101297610A Bending-type rigid printed wiring board and process for producing the same
10/29/2008CN101297305A A system for mapping defective printed circuits
10/29/2008CN101296977A Composite resin molded article, laminate, multi-layer circuit board, and electronic device
10/29/2008CN101296757A Flexible laminate board, process for manufacture of the board, and flexible print wiring board
10/29/2008CN101296607A Circuit board bearing device and circuit board fixing method
10/29/2008CN101296606A PCB real installing method
10/29/2008CN101296583A Method for processing printed circuit board
10/29/2008CN101296582A Method for replacing and mending bad circuit area on multi-layer printed circuit board
10/29/2008CN101296581A Laser processing bearing device of flexible circuit board
10/29/2008CN101296580A Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes
10/29/2008CN101296579A Station transplantation device of multi-gang circuit board
10/29/2008CN101296578A Soldering tin stove spout with upper tin blocking plate
10/29/2008CN101296577A Impeller transmission structure of soldering tin stove
10/29/2008CN101296576A Soldering tin stove feeding tin from top
10/29/2008CN101296575A Clamper lifting device of PCB plate of soldering tin stove
10/29/2008CN101296574A Spout of soldering tin stove
10/29/2008CN101296573A Clamper pressure bar of PCB plate
10/29/2008CN101296572A Plate lifting device for PCB plate
10/29/2008CN101296571A Memory body device manufacturing carrier tool, manufacturing method and memory body device
10/29/2008CN101296570A Circuit board and production method thereof
10/29/2008CN101296569A 印刷电路板及其制造方法 The method of manufacturing a printed circuit board and
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