| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 11/19/2008 | CN100435605C Printed wiring board and method for manufacturing the same |
| 11/19/2008 | CN100435604C Composite multi-layer substrate and module using the substrate |
| 11/19/2008 | CN100435603C Method for forming multilayer circuit structure and base having multilayer circuit structure |
| 11/19/2008 | CN100435602C Process for producing electronic component and electronic component |
| 11/19/2008 | CN100435378C Organic electric excitation lighting display |
| 11/19/2008 | CN100435362C Light-emitting diode |
| 11/19/2008 | CN100435331C Method for producing microsystems |
| 11/19/2008 | CN100435304C Preparation method of electronic power integrated module based on metal ball crimping interconnection technique |
| 11/19/2008 | CN100435303C Method for aligning the bondhead of a die bonder |
| 11/19/2008 | CN100435302C Method of fabricating a built-in chip type substrate |
| 11/19/2008 | CN100435299C Method for preparing wiring placode |
| 11/19/2008 | CN100435259C Fuse holder component |
| 11/19/2008 | CN100435180C Circuit board connection structure, method of forming, circuit board connection structure and display device |
| 11/19/2008 | CN100434793C Fluorescent lamp container as ready for use |
| 11/18/2008 | US7454147 Printed circuit board and an image forming apparatus having the printed circuit board |
| 11/18/2008 | US7453702 Printed wiring board |
| 11/18/2008 | US7453046 Recording disk drive capable of suppressing vibration of flexible printed circuit board |
| 11/18/2008 | US7452923 Anisotropic conductive adhesive |
| 11/18/2008 | US7452828 plural nanotubes mutually cross-link, formed in an arbitrary pattern on a surface of a base body; extremely fine and excellent in electrical characteristics |
| 11/18/2008 | US7452799 Ball film for integrated circuit fabrication and testing |
| 11/18/2008 | US7452798 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 11/18/2008 | US7452797 Solder deposition method and solder bump forming method |
| 11/18/2008 | US7452656 Selectively electroplated antenna comprising a directly electroplateable resin (DER); use e.g. with radio frequency id tags (RFID) |
| 11/18/2008 | US7452508 Agitating fluids with preferential apparatus; obtain liquids, draw into agitation apparatus, agitate, monitor fluid in apparatus |
| 11/18/2008 | US7452197 Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof |
| 11/18/2008 | US7451699 Digital application of protective soldermask to printed circuit boards |
| 11/18/2008 | US7451698 Device for producing a coating on printed products from a printing press |
| 11/18/2008 | US7451540 Method for fabricating a printed circuit board |
| 11/18/2008 | US7451539 Method of making a conformal electromagnetic interference shield |
| 11/13/2008 | WO2008137459A2 Agitation of electrolytic solution in electrodeposition |
| 11/13/2008 | WO2008136419A1 Semiconductor device, semiconductor device manufacturing method and semiconductor device repairing method |
| 11/13/2008 | WO2008136251A1 Component-incorporating module and its manufacturing method |
| 11/13/2008 | WO2008136096A1 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg and printed wiring board laminate |
| 11/13/2008 | WO2008135142A2 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 11/13/2008 | WO2008134954A1 Circuit board interconnection system, connector component, circuit board and circuit board processing method |
| 11/13/2008 | WO2008101884A3 Method for contacting electrical components |
| 11/13/2008 | US20080280159 Copper Foil and Method of Manufacturing the Same |
| 11/13/2008 | US20080280151 Integrated circuit; depositing a copper layer over the composite material by electrochemical deposition |
| 11/13/2008 | US20080280033 Simplification; wiring pattern for display device; controlling shapes |
| 11/13/2008 | US20080278920 Hybrid Integrated Circuit Device and Method for Manufacturing Same |
| 11/13/2008 | US20080278917 Heat dissipation module and method for fabricating the same |
| 11/13/2008 | US20080278187 Test pin, method of manufacturing same, and system containing same |
| 11/13/2008 | US20080277775 Ultra-thin near-hermetic package based on rainier |
| 11/13/2008 | US20080277157 Electromagnetic Wave Shielding Sheet and Process For Producing the Same |
| 11/13/2008 | US20080277155 Wiring substrate and method of manufacturing the same |
| 11/13/2008 | US20080277154 Process for making stubless printed circuit boards |
| 11/13/2008 | US20080277152 Printed Circuit Board and Its Designing Method, and Designing Method of Ic Package Terminal and Its Connecting Method |
| 11/13/2008 | US20080277150 Wiring board with built-in component and method for manufacturing the same |
| 11/13/2008 | US20080277149 Electronic device manufacturing method and supporter |
| 11/13/2008 | US20080277148 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board |
| 11/13/2008 | US20080277147 Wired circuit board and producing method thereof |
| 11/13/2008 | US20080277146 Radiant heat printed circuit board and method of fabricating the same |
| 11/13/2008 | US20080277144 Method for indicating quality of a circuit board |
| 11/13/2008 | US20080277143 metal foil is fixed onto an insulating resin composition is used as an electric power supply layer; slight roughening treatment; reliability and circuit formability are high, and conductor loss is extremely low; amino functional silane curing agent; peel strength; corrosion resistance |
| 11/13/2008 | US20080277141 Circuit board and method of fabricating the same |
| 11/13/2008 | US20080276456 Method for Producing a Number of Chip Cards |
| 11/13/2008 | US20080276455 method of making an electrochemical sensor |
| 11/13/2008 | US20080276454 Method of Manufacturing a Package Carrier For Enclosing at Least One Microelectronic Element and Method and Method of Manufacturing a Diagnostic Device |
| 11/13/2008 | DE202008011269U1 Inspektionskamerasystem Inspection Camera System |
| 11/13/2008 | DE112006003613T5 Verfahren und Vorrichtung für eine Leiterplatte unter Verwendung der lasergestützten Metallisierung und Strukturierung eines Substrats Method and apparatus for a circuit board by using the laser assisted metallization and patterning of a substrate |
| 11/13/2008 | DE112006003543T5 Eingebettete Wellenleiter-Leiterplatten-Struktur Embedded waveguide circuit board structure |
| 11/13/2008 | DE102006050023B4 Verfahren zur Bearbeitung von Material durch Schwerionenbestrahlung und nachfolgenden Ätzprozess A method for processing material by heavy ion irradiation and subsequent etching process |
| 11/12/2008 | EP1991040A2 Wired Circuit Board |
| 11/12/2008 | EP1991039A2 Device and connecting method |
| 11/12/2008 | EP1990833A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 11/12/2008 | EP1990792A1 Pattern-forming device and pattern-forming method |
| 11/12/2008 | EP1989932A2 System and method of using a compliant lead interposer |
| 11/12/2008 | EP1989931A2 Methods of forming a flexible circuit board |
| 11/12/2008 | EP1674488B1 Process for producing resin-coated metal powder, resin-coated metal powder and circuit forming toner |
| 11/12/2008 | CN201150151Y Apparatus for passing through thin plate of volcanic ash plate-grinding machine |
| 11/12/2008 | CN201147751Y Jig |
| 11/12/2008 | CN101305645A Method of manufacturing a package carrier for enclosing at least one microelectronic element and method of manufacturing a diagnostic device |
| 11/12/2008 | CN101304880A Screen printing apparatus and screen printing method |
| 11/12/2008 | CN101304879A 丝网印刷设备和丝网印刷方法 Screen printing equipment and screen printing method |
| 11/12/2008 | CN101304639A Method for producing printed circuit board |
| 11/12/2008 | CN101304638A Electroplating technique for thickening mask hole cuprum of printed circuit board |
| 11/12/2008 | CN101304637A Wiring forming method of printed circuit board |
| 11/12/2008 | CN101304636A Method for preparing flexibility printed circuit board using PET as base material |
| 11/12/2008 | CN101304634A Flexible laminated board and manufacturing method thereof |
| 11/12/2008 | CN101304633A Radiant heat printed circuit board and method of fabricating the same |
| 11/12/2008 | CN101304631A Soft and hard composite circuit board and manufacturing method thereof |
| 11/12/2008 | CN101304191A Vibration motor holding structure and vibration motor |
| 11/12/2008 | CN101304112A Ultra-wide band antenna and plug-and-play apparatus applying the same |
| 11/12/2008 | CN101304017A Sintered high performance semiconductor substrate and corresponding production method |
| 11/12/2008 | CN101303989A Solder bump forming method and apparatus |
| 11/12/2008 | CN101303981A Wiring panel with build-in components and manufacturing method thereof |
| 11/12/2008 | CN101303528A Photocuring resin composition, dry film, and print circuit board |
| 11/12/2008 | CN101303527A Photocuring resin composition, dry film, curing product and print circuit board |
| 11/12/2008 | CN101301808A Surface mounting technology print stencil net frame |
| 11/12/2008 | CN100433955C Wiring plate and circuit module |
| 11/12/2008 | CN100433954C Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
| 11/12/2008 | CN100433953C Method and device for checking and comparing consistency of circuit schematic diagram and PCB wiring diagram |
| 11/12/2008 | CN100433952C Cancel circuit for suppressing electromagnetic interference of high-speed circuit |
| 11/12/2008 | CN100433951C Inductor element containing circuit board and power amplifier module |
| 11/12/2008 | CN100433950C Film substrate, fabrication method thereof, and image display substrate |
| 11/12/2008 | CN100433949C Vented vias for via in pad technology assembly process yield improvements |
| 11/12/2008 | CN100433323C Electronic member |
| 11/12/2008 | CN100433316C Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly |
| 11/12/2008 | CN100433306C Device mounting board and semiconductor apparatus using the same |
| 11/12/2008 | CN100433305C Circuit-component carrying substrate |