| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/05/2009 | DE102007017486B4 Vorrichtung und Verfahren zum Bearbeiten von flächigen Substraten, wie zum Bedrucken von Leiterplatten oder dergleichen Apparatus and method for processing flat substrates, such as for printing on printed circuit boards or the like |
| 03/05/2009 | DE102006006561B4 Flip-Chip-Modul und Verfahren zum Austauschen eines Halbleiterchips eines Flip-Chip-Moduls Flip-chip module and method for replacing a semiconductor chip of a flip-chip module |
| 03/05/2009 | CA2638256A1 Manufacturing method for a card and card obtained by said method |
| 03/04/2009 | EP2031946A1 Wiring board with built-in component and method for manufacturing wiring board with built-in component |
| 03/04/2009 | EP2031945A2 Method for mounting electronic components and electromechanical components on a circuit board |
| 03/04/2009 | EP2031444A2 Microcontact printing stamps |
| 03/04/2009 | EP2031023A1 Thermosetting resin composition containing low-chlorine multifunctional aliphatic glycidyl ether compound, cured product of such composition and use thereof |
| 03/04/2009 | EP2030493A2 Submount for electronic components |
| 03/04/2009 | EP2030492A2 Method for producing a circuit part on a substrate |
| 03/04/2009 | EP2029308A1 Soldering apparatus |
| 03/04/2009 | CN201204758Y Contraposition improved structure for upper/lower films and electronic line board |
| 03/04/2009 | CN201204755Y Multi-layer board type printed circuit board capable of ensuring power tube to earth well |
| 03/04/2009 | CN201204746Y Moistureproof circuit board |
| 03/04/2009 | CN201204743Y Typesetting structure for printed circuit board |
| 03/04/2009 | CN201204742Y Typesetting structure for printed circuit board |
| 03/04/2009 | CN201201099Y Anti-oxidation impeller rotating shaft structure |
| 03/04/2009 | CN201201098Y Turbocharging type nitrogen filling apparatus of reflow machine |
| 03/04/2009 | CN201201097Y Central supporting device of reflow machine |
| 03/04/2009 | CN201201096Y Plate importing apparatus of reflow machine |
| 03/04/2009 | CN201201095Y Guide rail anti-deforming apparatus of wave soldering machine |
| 03/04/2009 | CN201201094Y Multiple proportionality flow equalizing plate of wave soldering tin stove |
| 03/04/2009 | CN201201093Y Stereo current regulator of wave soldering machine |
| 03/04/2009 | CN201201092Y Loopback pulse producer of wave soldering machine |
| 03/04/2009 | CN201201091Y Gradual flow equalizing plate of wave soldering tin stove |
| 03/04/2009 | CN201201090Y Vector flow-adjustable valve of wave soldering tin stove |
| 03/04/2009 | CN201201088Y Multiple proportionality jet current device |
| 03/04/2009 | CN201201087Y Infrared ray heat energy compensating mechanism of reflow machine |
| 03/04/2009 | CN101379894A Printed circuit board with additional functional elements, method of production and use |
| 03/04/2009 | CN101379893A Substrates for electronic circuitry type applications |
| 03/04/2009 | CN101379603A Contact-bonding device |
| 03/04/2009 | CN101379220A Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material |
| 03/04/2009 | CN101379219A Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces |
| 03/04/2009 | CN101378635A Method for producing circuit board with local electric thick gold |
| 03/04/2009 | CN101378634A Method of manufacturing multilayer printed circuit board |
| 03/04/2009 | CN101378633A Printed wiring board |
| 03/04/2009 | CN101378632A Production method for wiring and vias |
| 03/04/2009 | CN101378631A Etching processing method |
| 03/04/2009 | CN101378630A Printed circuit board and method of production of an electronic apparatus |
| 03/04/2009 | CN101378629A Method for processing resistance welding milling point |
| 03/04/2009 | CN101378628A Sticking method for local additional sticking material of various printed circuit boards |
| 03/04/2009 | CN101378627A Method for forming conductive line on an insulated heat-conducting metal substrate by vacuum splashing and plating |
| 03/04/2009 | CN101378626A Ceramic circuit board and manufacturing method thereof |
| 03/04/2009 | CN101378625A Preparation method for soft and hard composite boards |
| 03/04/2009 | CN101378624A Module structure integrating perimeter circuit and manufacturing method thereof |
| 03/04/2009 | CN101377624A Exposure device and exposure process |
| 03/04/2009 | CN101376469A Volume to volume HDI manufacturing method |
| 03/04/2009 | CN100466885C Multilayer circuit board forming method and multilayer circuit board |
| 03/04/2009 | CN100466884C Anisotropic conductive sheet and the manufacturing method thereof |
| 03/04/2009 | CN100466883C Circuit substrate and the production method thereof |
| 03/04/2009 | CN100466882C Device and method for transporting flat workpieces in conveyor belt processing lines |
| 03/04/2009 | CN100466881C Copper foil with resistive layer and circuit substrate materials with resistance layer |
| 03/04/2009 | CN100465341C A forming method of copper for chrome-plating of printed circuit boards |
| 03/04/2009 | CN100465336C A wiring substrate and a manufacturing method thereof and chemical copper plating solution therein |
| 03/04/2009 | CN100464973C A multi-layer substrate and a semi-conductor device using the multi-layer substrate |
| 03/04/2009 | CN100464967C A manufacturing method of flexible laminates |
| 03/04/2009 | CN100464966C A stretched film and a manufacturing method thereof |
| 03/04/2009 | CN100464930C A lead free solder alloy used for supplying solder bath |
| 03/03/2009 | US7499287 Printed wiring board with enhanced structural integrity |
| 03/03/2009 | US7498521 Method and apparatus for marking a printed circuit board |
| 03/03/2009 | US7498520 Semiconductor multilayer wiring board and method of forming the same |
| 03/03/2009 | US7498200 Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 03/03/2009 | US7498193 Package with barrier wall and method for manufacturing the same |
| 03/03/2009 | US7498076 Forming patterned electrodes on the releasable flat face of two spaced apart support plates; packing a dielectric material between the plates to embed the electrodes; and separating the support plates from the porous dielectric substrate; for manufacturing high-frequency circuit boards |
| 03/03/2009 | US7498074 Metal photoetching product and production method thereof |
| 03/03/2009 | US7497932 Electro-chemical deposition system |
| 03/03/2009 | US7497702 Board mounted electrical connector |
| 03/03/2009 | US7497695 Connection structure for printed wiring board |
| 03/03/2009 | US7497555 Inkjet nozzle assembly with pre-shaped actuator |
| 03/03/2009 | US7496997 Method for making a wound capacitor |
| 03/03/2009 | CA2262394C Method for making a transponder coil and transponder produced by said method |
| 02/26/2009 | WO2009025190A1 Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same |
| 02/26/2009 | WO2009025156A1 Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer |
| 02/26/2009 | WO2009025063A1 Release sheet |
| 02/26/2009 | WO2009025059A1 Printed board and method for producing the same |
| 02/26/2009 | WO2009024583A1 Method for assembling electrical components equipped with terminal pins on a printed circuit board |
| 02/26/2009 | WO2009024565A1 Module for an integrated control logic having a simplified design |
| 02/26/2009 | WO2009023988A1 Process and system for etching copper |
| 02/26/2009 | WO2009002513A3 Fpc-based relay connector |
| 02/26/2009 | WO2009002083A3 Manufacturing method of fpcb |
| 02/26/2009 | US20090053936 Filter Connector |
| 02/26/2009 | US20090053852 Manufacturing apparatus and method for an electronic apparatus |
| 02/26/2009 | US20090053459 Conductive connecting pin and package substrate |
| 02/26/2009 | US20090053400 Ink jet printable compositions for preparing electronic devices and patterns |
| 02/26/2009 | US20090052171 Heat-dispensing structure for the led's lamp |
| 02/26/2009 | US20090052150 Wiring board, method of manufacturing the same, and semiconductor device having wiring board |
| 02/26/2009 | US20090052142 Electronic device and method of forming same |
| 02/26/2009 | US20090052029 Functional films formed by highly oriented deposition of nanowires |
| 02/26/2009 | US20090051015 Semiconductor device and printed circuit board |
| 02/26/2009 | US20090050920 Ceramic wiring board and process for producing the same, and semiconductor device using the same |
| 02/26/2009 | US20090050359 Circuit board having electrically connecting structure and fabrication method thereof |
| 02/26/2009 | US20090050355 Thermoplastic Films For Insulated Metal Substrates And Methods Of Manufacture Thereof |
| 02/26/2009 | US20090049688 Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries |
| 02/26/2009 | US20090049687 Electronic Component Mounting Method and Electronic Component Mounting Device |
| 02/26/2009 | US20090049686 Method of manufacturing component-embedded printed circuit board |
| 02/26/2009 | US20090049684 Tool and method for pulling and cutting a Z-axis electrical interconnector |
| 02/26/2009 | US20090049683 Apparatus and method for manufacturing printed circuit board |
| 02/26/2009 | US20090049682 Electronic component mounting system and electronic component mounting method |
| 02/26/2009 | DE102007040214A1 Device for soldering electronic modules equipped with components useful in microelectronics circuit boards or printed circuit boards, comprises a preheating zone, in which the components and the modules are preheated, and a soldering zone |
| 02/26/2009 | DE102007040098A1 Trägerfolie Support film |
| 02/26/2009 | DE102007040065A1 Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung Articles with a nanoscopic coating of precious / semi-precious metal and process for their preparation |