| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/31/2008 | CN201174822Y Damp-proof structure of circuit board |
| 12/31/2008 | CN101336461A Method for regulating capacitance value of built-in capacitor in multilayered ceramic substrate, and multilayered ceramic substrate and process for producing the same |
| 12/31/2008 | CN101336052A Jack process of printed circuit board |
| 12/31/2008 | CN101336051A Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
| 12/31/2008 | CN101336050A The thick copper printed circuit board with enhanced adhesive strength and the manufacturing method of it |
| 12/31/2008 | CN101336049A Circuit board and welding method |
| 12/31/2008 | CN101336048A Method and apparatus for reinforced locating of flexible circuit board |
| 12/31/2008 | CN101336047A Method for printing circuit board and combination thereof |
| 12/31/2008 | CN101336046A Circuit board holding device |
| 12/31/2008 | CN101336045A Printed circuit board, electronic member mounting method and electronic device |
| 12/31/2008 | CN101336044A Printed circuit board, electronic member mounting method and electronic device |
| 12/31/2008 | CN101336041A Printed circuit board |
| 12/31/2008 | CN101336040A General solder pad construction |
| 12/31/2008 | CN101335412A Connection apparatus of universal serial bus, connecting module group and manufacturing method thereof |
| 12/31/2008 | CN101335376A Preparing method of electronic label antenna |
| 12/31/2008 | CN101335374A Connection method for bridge of electronic label antenna |
| 12/31/2008 | CN101335235A Method for dicing substrate |
| 12/31/2008 | CN101335127A Electrical assembly comprising PTC-resistor elements |
| 12/31/2008 | CN101334804A Direct inserting device packaging and its design method |
| 12/31/2008 | CN100447990C Circuit-component-containing module |
| 12/31/2008 | CN100447526C Three directional measuring device |
| 12/31/2008 | CN100446992C Laser thermal transfer device, manufacturing method for organic electroluminescent element, and organic electroluminescent element |
| 12/31/2008 | CN100446978C Structure of soft printed circuit board |
| 12/30/2008 | US7470995 Integrated circuit (IC) carrier assembly with suspension means |
| 12/30/2008 | US7470990 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
| 12/30/2008 | US7470987 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
| 12/30/2008 | US7470977 Modular board device, high frequency module, and method of manufacturing same |
| 12/30/2008 | US7470865 Multilayer printed wiring board and a process of producing same |
| 12/30/2008 | US7470342 Structure and method for laminating and fixing thin plate parts and method for fabricating ink-jet printer head |
| 12/30/2008 | US7470147 Spring biased socket system |
| 12/30/2008 | US7469941 Method of producing a wiring board |
| 12/30/2008 | US7469635 Method and apparatus for performing operations within a stencil printer |
| 12/25/2008 | US20080319493 Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation |
| 12/25/2008 | US20080319110 Latent curing agent |
| 12/25/2008 | US20080318450 Preferential via exit structures with triad configuration for printed circuit boards |
| 12/25/2008 | US20080317402 Optical/electrical composite wiring board and a manufacturing method thereof |
| 12/25/2008 | US20080316722 Wiring board and method for making the same |
| 12/25/2008 | US20080316716 Frame for a packaging method using flexible printed circuit boards and method thereof |
| 12/25/2008 | US20080316255 Flexible wiring member, liquid droplet jetting head, and method for connecting flexible wiring member and device |
| 12/25/2008 | US20080315428 Thin Film Transistor and Display Device, and Method for Manufacturing Thereof |
| 12/25/2008 | US20080315239 Thin double-sided package substrate and manufacture method thereof |
| 12/25/2008 | US20080314631 Novel via structure for improving signal integrity |
| 12/25/2008 | US20080314629 Multi-layer substrate and manufacturing method thereof |
| 12/25/2008 | US20080314627 Electronic component and method for manufacturing the same |
| 12/25/2008 | US20080314626 ELECTRODED SHEET (eSheet) PRODUCTS |
| 12/25/2008 | US20080314625 Printed Circuit Board and Method of Manufacturing the Same |
| 12/25/2008 | US20080314624 Component Adapted for Being Mounted on a Substrate and a Method of Mounting a Surface Mounted Device |
| 12/25/2008 | US20080314623 Printed Circuit Board and Method for Manufacturing the Same |
| 12/25/2008 | US20080314622 Method Of Fabricating Board Having High Density Core Layer And Structure Thereof |
| 12/25/2008 | US20080314621 Parallel chip embedded printed circuit board and manufacturing method thereof |
| 12/25/2008 | US20080314620 Skew Compensation by Changing Ground Parasitic For Traces |
| 12/25/2008 | US20080313896 Sensor with layered electrodes |
| 12/25/2008 | US20080313895 Manufacturing Method of Electronic Component |
| 12/25/2008 | US20080313894 Method for making an interconnect structure and low-temperature interconnect component recovery process |
| 12/25/2008 | US20080313893 Method and apparatus for manufacturing electronic circuit board |
| 12/25/2008 | US20080313890 Component mounter and component supply method |
| 12/24/2008 | WO2008157642A1 Automated direct emulsion process for making printed circuits and multilayer printed circuits |
| 12/24/2008 | WO2008157524A2 Methods for integration of thin-film capacitors into the build-up layers of a printed wiring board |
| 12/24/2008 | WO2008156658A1 Split wave compensation for open stubs |
| 12/24/2008 | WO2008156200A2 Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires |
| 12/24/2008 | WO2008156170A1 Soldering apparatus |
| 12/24/2008 | WO2008155967A1 Board with built-in component and its manufacturing method |
| 12/24/2008 | WO2008155957A1 Method for manufacturing substrate with built-in component and substrate with built-in component |
| 12/24/2008 | WO2008155939A1 Reflow device |
| 12/24/2008 | WO2008155817A1 Method of feeding lead-free stick solder to solder tank and solder tank |
| 12/24/2008 | WO2008155700A1 Solderless integrated package connector and heat sink for led |
| 12/24/2008 | WO2008155154A1 Electric component |
| 12/24/2008 | WO2008155040A1 Restraining a connecting material |
| 12/24/2008 | WO2008127970A3 Circuit materials, multilayer circuits, and methods of manufacture thereof |
| 12/24/2008 | EP2007179A2 Multilayer circuit board having cable portion and method for manufacturing same |
| 12/24/2008 | EP2007178A2 Electronic device with at least one electric connected element and method for producing a connected element |
| 12/24/2008 | EP2006909A2 Heat dissipating wiring board and method for manufacturing same |
| 12/24/2008 | EP2006895A1 Electronic component module |
| 12/24/2008 | EP2006866A2 Electronic component with mechanical and/or electrically conductive connecting means |
| 12/24/2008 | EP2005807A2 Method and process of manufacturing robust high temperature solder joints |
| 12/24/2008 | EP2005487A1 System and method for producing a solar cell array |
| 12/24/2008 | EP2004908A2 Method for applying a metal on a substrate |
| 12/24/2008 | EP2004907A2 Method for applying a metal on paper |
| 12/24/2008 | EP1647168A4 Overmolded mcm with increased surface mount component reliability |
| 12/24/2008 | DE10254910B4 Schaltkreisbildende Einheit und Verfahren zu deren Herstellung Circuit forming unit and process for their preparation |
| 12/24/2008 | DE102008024981A1 Siebdruckeinrichtung und Siebdruckverfahren Screener and screen printing method |
| 12/24/2008 | DE102007028811A1 Zwangsführung eines Verbindungsmaterials Forced operation of a bonding material |
| 12/24/2008 | DE102007028511A1 Elektronisches Gerät mit mindestens einem elektrischen Anschlusselement und Verfahren zur Herstellung eines Anschlusselements An electronic device having at least one electrical connection element and method for producing a connection element |
| 12/24/2008 | CN201171249Y 层压机 Laminating machine |
| 12/24/2008 | CN201171248Y Contraposition adjusting apparatus for two-sided exposure machine |
| 12/24/2008 | CN201171247Y Automatic pin device |
| 12/24/2008 | CN201170979Y Choke structure |
| 12/24/2008 | CN201170838Y Return mechanism for exposal base station of exposure machine |
| 12/24/2008 | CN201170837Y Contraposition device for single-side exposure machine |
| 12/24/2008 | CN201170299Y Transmission mechanism for circuit board etching machine |
| 12/24/2008 | CN101331814A Multilayer printed wiring plate, and method for fabricating the same |
| 12/24/2008 | CN101331813A Multilayer printed-circuit board, and its parts mounting method |
| 12/24/2008 | CN101331812A Method of manufacturing printed wiring board |
| 12/24/2008 | CN101331811A Composition for removing residue from wiring board and cleaning method |
| 12/24/2008 | CN101331247A Plating apparatus and plating method |
| 12/24/2008 | CN101330805A Method for preparing firm flexible printed board |
| 12/24/2008 | CN101330804A Printed circuit board and method of manufacturing the same |
| 12/24/2008 | CN101330803A Assistance processing method for printed circuit board |
| 12/24/2008 | CN101330802A Method for welding electronic component and mainboard electrical connection |
| 12/24/2008 | CN101330801A Method for forming pattern, method for manufacturing electro-optical device, and method for manufacturing electronic device |