| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/21/2009 | CN100455161C Method for disigning of printed circuit board and printed circuit board thereof |
| 01/21/2009 | CN100455160C Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| 01/21/2009 | CN100455159C Wired circuit board |
| 01/21/2009 | CN100454602C Film comprising organic semiconductors |
| 01/21/2009 | CN100454537C Electronic apparatus and method for manufacturing the same |
| 01/21/2009 | CN100454533C EMI shielding for electronic component packaging |
| 01/21/2009 | CN100454525C Composite material, electrical circuit or electric module |
| 01/21/2009 | CN100454502C Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same |
| 01/21/2009 | CN100454501C Surface-coating method, production of microelectronic interconnections using said method and integrated circuits |
| 01/21/2009 | CN100454146C Exposure apparatus |
| 01/21/2009 | CN100454142C Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with same |
| 01/21/2009 | CN100454118C Tape circuit substrate with reduced size of base film |
| 01/21/2009 | CN100453701C Wet method pattern technology of chrome-nickel alloy thin film |
| 01/21/2009 | CN100453222C Device and method for eliminating drillings from circuit board |
| 01/20/2009 | US7480151 Wiring board and method of manufacturing the same |
| 01/20/2009 | US7479857 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias |
| 01/20/2009 | US7479849 Dielectric resonator device, oscillator and transmitter-receiver apparatus |
| 01/20/2009 | US7479792 Methods for making plated through holes usable as interconnection wire or probe attachments |
| 01/20/2009 | US7479697 Resilient carrier assembly for an integrated circuit |
| 01/20/2009 | US7479620 Heater and the method for producing the same using PCB |
| 01/20/2009 | US7479345 Circuit assembly for battery pack or the like, and method of making the same |
| 01/20/2009 | US7479305 Immersion plating of silver |
| 01/20/2009 | US7479014 Land grid array fabrication using elastomer core and conducting metal shell or mesh |
| 01/20/2009 | US7478474 Method of manufacturing shielded electronic circuit units |
| 01/20/2009 | US7478473 Method of manufacturing an IC card |
| 01/20/2009 | US7478472 Method of making circuitized substrate with signal wire shielding |
| 01/20/2009 | CA2357001C Production of photoresist coatings |
| 01/15/2009 | WO2009009639A2 Electronic assemblies without solder and methods for their manufacture |
| 01/15/2009 | WO2009009072A1 Compositions and methods for creating electronic circuitry |
| 01/15/2009 | WO2009009070A1 Compositions and methods for creating electronic circuitry |
| 01/15/2009 | WO2009008801A1 A method for etching copper and recovery of the spent etching solution |
| 01/15/2009 | WO2009008471A1 Copper foil with dielectric layer |
| 01/15/2009 | WO2009008307A1 Manufacturing method of wiring board |
| 01/15/2009 | WO2009008273A1 Process for producing printed wiring board and printed wiring board produced by the production process |
| 01/15/2009 | WO2009008217A1 Method for forming hole for interlayer connection conductor, method for manufacturing resin substrate and substrate with built-in components, resin substrate, and substrate with built-in components |
| 01/15/2009 | WO2009008212A1 Insulating film material, multilayer wiring board and process for producing the multilayer wiring board, and semiconductor apparatus and process for producing the semiconductor device |
| 01/15/2009 | WO2009008156A1 Wiring method, and wiring apparatus |
| 01/15/2009 | WO2009008066A1 Wiring substrate, and its manufacturing method |
| 01/15/2009 | WO2009008041A1 Material for insulating film, multilayered wiring board, method for manufacturing the multilayered wiring board, semiconductor device, and method for manufacturing the semiconductor device thereof |
| 01/15/2009 | WO2009007122A1 Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface |
| 01/15/2009 | WO2009006762A1 Multilayer substrate and fabricating method thereof |
| 01/15/2009 | WO2009006761A1 Multi-layer baseboard and manufacturing method thereof |
| 01/15/2009 | US20090017578 Application of RFID labels |
| 01/15/2009 | US20090017327 Fretting and whisker resistant coating system and method |
| 01/15/2009 | US20090017319 Metallised parts made from plastic material |
| 01/15/2009 | US20090017275 Heat-releasing printed circuit board and manufacturing method thereof |
| 01/15/2009 | US20090016039 Structure And Method For Attaching Shield Case To Circuit Board, Electronic Component Module And Portable Telephone |
| 01/15/2009 | US20090015354 Electromagnetic bandgap structure, printed circuit board comprising this and method thereof |
| 01/15/2009 | US20090014909 Printing device, production unit, and production method of electronic parts |
| 01/15/2009 | US20090014895 Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip |
| 01/15/2009 | US20090014872 Method for manufacturing a circuit board structure, and a circuit board structure |
| 01/15/2009 | US20090014821 Method for producing conductor structures and applications thereof |
| 01/15/2009 | US20090014502 Method and apparatus for placing conductive balls |
| 01/15/2009 | US20090014205 Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same |
| 01/15/2009 | US20090014120 Method for Gluing a Circuit Component to a Circuit Board |
| 01/15/2009 | US20090013527 Collapsable connection mold repair method utilizing femtosecond laser pulse lengths |
| 01/15/2009 | US20090013526 Inner substrate for manufacturing multilayer printed circuit boards and method for manufacturing multilayer printed circuit boards using the same |
| 01/15/2009 | US20090013525 Manufacturing method for printed circuit board |
| 01/15/2009 | DE112007000625T5 Pastenübertragungseinrichtung und Bestückungsvorrichtung für elektronische Bauteile Paste transmission device and mounting apparatus for electronic components |
| 01/15/2009 | DE102007032603A1 Electrical connecting contact for fixing on object i.e. printed circuit board, in photovoltaic panel, has base and longitudinal sides connected with each other over bending area in hinged manner, where contact is formed in hinged manner |
| 01/15/2009 | DE102007032510A1 Electrical device i.e. display unit, for vehicle i.e. motor vehicle, has electrical contact unit attached to contact surface of printed circuit board such that housing part lies within contact surface on electrical contact unit |
| 01/14/2009 | EP2015624A2 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| 01/14/2009 | EP2015623A1 Circuit wiring board incorporating heat resistant substrate |
| 01/14/2009 | EP2015622A1 Switchgear unit comprising a mounting structure |
| 01/14/2009 | EP2015621A1 Plate, patterning device employing the plate, and patterning method |
| 01/14/2009 | EP2015620A2 Heat-stamping structures |
| 01/14/2009 | EP2015404A2 Electronic component and method of forming the same |
| 01/14/2009 | EP2015360A2 Electronic component with side contacts |
| 01/14/2009 | EP2014798A1 Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface |
| 01/14/2009 | EP2014797A2 Coating composition for interconnection part of electrode and plasma display panel including the same |
| 01/14/2009 | EP2014406A2 Relocation device, contacting device, delivery system, relocation and contacting unit production facility and a transponder unit |
| 01/14/2009 | EP2013821A2 An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards |
| 01/14/2009 | EP1776739A4 Laser ablation resistant copper foil |
| 01/14/2009 | EP1610132B1 Fabricating interconnects using sacrificial substrates |
| 01/14/2009 | EP1581955B1 Electric conductors |
| 01/14/2009 | EP1576205B1 Plating of multi-layer structures |
| 01/14/2009 | EP1287540A4 Electroluminescent lamp devices and their manufacture |
| 01/14/2009 | EP1255797A4 Method for roughening copper surfaces for bonding to substrates |
| 01/14/2009 | CN201182040Y Anti-soldering general-purpose tool |
| 01/14/2009 | CN201182039Y Replacing structure of printed circuit board |
| 01/14/2009 | CN201182038Y Panel placing system |
| 01/14/2009 | CN201181899Y Stereo miniature type power supply |
| 01/14/2009 | CN101347058A Method of producing multilayer ceramic substrate |
| 01/14/2009 | CN101347057A Multilayer wiring board, and electronic module and electronic device provided with such multilayer wiring board |
| 01/14/2009 | CN101347056A Manufacturing method and manufacturing apparatus of printed wiring board |
| 01/14/2009 | CN101347055A Soldering mounting structure, production method and device for the same, electronic apparatus, and wiring board |
| 01/14/2009 | CN101347054A Glass substrate having circuit pattern and process for producing the same |
| 01/14/2009 | CN101347053A Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate, printed circuit board and system comprising the same |
| 01/14/2009 | CN101347052A Method and apparatus for connecting printed wiring boards |
| 01/14/2009 | CN101346666A Pattern-forming material, pattern-forming apparatus and pattern-forming method |
| 01/14/2009 | CN101346047A Multi-layer circuit board production method and inner layer substrates for producing the same |
| 01/14/2009 | CN101346046A Plastering apparatus and method for printed circuit board |
| 01/14/2009 | CN101346045A Circuit board cleaning device |
| 01/14/2009 | CN101346044A Line forming method adopting printing means |
| 01/14/2009 | CN101346043A Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof |
| 01/14/2009 | CN101346042A Rolled copper foil |
| 01/14/2009 | CN101346041A Configurable printed circuit board |
| 01/14/2009 | CN101346040A Circuit connection structure and printed circuit board |
| 01/14/2009 | CN101346038A Multi-layer substrate and manufacturing method thereof |
| 01/14/2009 | CN101346037A Multi-layer substrate and manufacturing method thereof |