| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/03/2008 | CN100440499C Semiconductor device and its manufacturing method |
| 12/03/2008 | CN100440496C Fluxless flip chip inter connection |
| 12/03/2008 | CN100440471C Method for manufacturing electronic device |
| 12/03/2008 | CN100440468C Method for manufacturing circuit device |
| 12/03/2008 | CN100440393C Electronic part |
| 12/03/2008 | CN100440391C Improved method for forming magnetic layers in printed circuit boards |
| 12/03/2008 | CN100440227C Printed circuit board design method, program thereof, recording medium containing the program, printed circuit board design device using them, and CAD system |
| 12/03/2008 | CN100439909C Method for preparing composite thick film sensor of high molecular resistance type |
| 12/03/2008 | CN100439570C Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 12/03/2008 | CN100439428C Polymer composite formed article, printed wiring board using the formed article and method for producing them |
| 12/02/2008 | US7459789 Bonding method of flexible film and display bonded thereby |
| 12/02/2008 | US7459773 Stackable ball grid array |
| 12/02/2008 | US7459201 Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board |
| 12/02/2008 | US7459200 Circuit board design |
| 12/02/2008 | US7458499 Apparatus and method for filling a ball grid array template |
| 12/02/2008 | US7458151 Method of forming external electrode |
| 12/02/2008 | US7458149 Printed circuit board and method of manufacturing the same |
| 12/02/2008 | US7458148 Joint connector and method assembling the same |
| 12/02/2008 | US7458147 Method for determining whether a component holder is defective |
| 12/02/2008 | US7458146 Method for manufacturing image display unit |
| 12/02/2008 | US7458145 Methods and arrangements for hardware casing media to store data |
| 12/02/2008 | CA2407281C Polymeric materials to metal surfaces adhesion process |
| 12/01/2008 | CA2632306A1 Method and apparatus to change solder pad size using a differential pad plating |
| 11/27/2008 | WO2008143565A1 A component for reducing mechanical stress on a pcb |
| 11/27/2008 | WO2008143359A1 Electronic circuit device |
| 11/27/2008 | WO2008143358A1 Electric device, connecting method and adhesive film |
| 11/27/2008 | WO2008143202A1 Composition for conductor layer formation, method for conductor layer formation, and process for producing circuit board |
| 11/27/2008 | WO2008143138A1 Wiring substrate, semiconductor package, and electronic device |
| 11/27/2008 | WO2008143128A1 Resin composition, and film-forming material comprising the same |
| 11/27/2008 | WO2008143099A1 Laminated wiring board and method for manufacturing the same |
| 11/27/2008 | WO2008142918A1 Module substrate and electronic device having the module substrate mounted thereon |
| 11/27/2008 | WO2008142895A1 Device for taking out granular body |
| 11/27/2008 | WO2008142206A1 Method for producing circuit boards comprising electronic, optical and functional features |
| 11/27/2008 | WO2008142064A1 Method for the production of metal-coated base laminates |
| 11/27/2008 | WO2008141481A1 A structure and manufacturing method of metal wiring on multilayered board |
| 11/27/2008 | WO2008122347A3 Sheet-shaped support comprising a printed conductor, and method for the production of said support |
| 11/27/2008 | WO2008113767A3 Method of manufacturing a printed circuit board |
| 11/27/2008 | WO2008103263A3 Platen for use with a thermal attach and detach system which holds components by vacuum suction |
| 11/27/2008 | WO2008098272A8 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board |
| 11/27/2008 | WO2008033428A3 Compliance partitioning in testing of integrated circuits |
| 11/27/2008 | US20080293239 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 11/27/2008 | US20080293168 Method and system of tape automated bonding |
| 11/27/2008 | US20080292852 Printed wiring board and method for producing the same |
| 11/27/2008 | US20080291650 Arrangement Having an Electric Motor and a Main Printed Circuit Board, and an Assembly Method |
| 11/27/2008 | US20080291649 Capacitor built-in substrate and method of manufacturing the same and electronic component device |
| 11/27/2008 | US20080291640 Electronic device with a base plate |
| 11/27/2008 | US20080291027 Thin Profile Battery Bonding Method, Method Of Conductively Interconnecting Electronic Components, Battery Powerable Apparatus, Radio Frequency Communication Device, And Electric Circuit |
| 11/27/2008 | US20080290342 Methods and apparatus for a flexible circuit interposer |
| 11/27/2008 | US20080289868 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |
| 11/27/2008 | US20080289867 Multi-strand substrate for ball-grid array assemblies and method |
| 11/27/2008 | US20080289866 Wiring Board and Wiring Board Manufacturing Method |
| 11/27/2008 | US20080289864 Printed wiring board and method for producing the same |
| 11/27/2008 | US20080289863 Surface finish structure of multi-layer substrate and manufacturing method thereof |
| 11/27/2008 | US20080289859 Flex-Rigid Wiring Board and Manufacturing Method Thereof |
| 11/27/2008 | US20080289858 Printed circuits and method for making same |
| 11/27/2008 | US20080289177 Circuit board, semiconductor package having the board, and methods of fabricating the circuit board and the semiconductor package |
| 11/27/2008 | US20080289176 Printed wiring board and method for producing the same |
| 11/27/2008 | US20080289175 Electronic component mounting system and electronic component mounting method |
| 11/27/2008 | US20080289174 Process for the Collective Fabrication of 3D Electronic Modules |
| 11/27/2008 | DE19907628B4 Vorrichtung zur Zugentlastung von Kabeln Device for strain relief of cables |
| 11/27/2008 | DE102007026082A1 Verfahren zur Behandlung von flachen Substraten sowie Verwendung des Verfahrens A process for the treatment of flat substrates, and using the method |
| 11/27/2008 | DE102007024189A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly |
| 11/27/2008 | DE102005005304B4 Steckkartenförmige Brennstoffzellenbatterie und deren Baugruppe Cards shaped fuel cell battery and battery assembly |
| 11/27/2008 | CA2688717A1 System and method for automation of hardware signal characterization and signal integrity verification |
| 11/27/2008 | CA2686000A1 Method for producing polymer-coated metal foils and use thereof |
| 11/27/2008 | CA2685517A1 Method for producing metal-coated base laminates |
| 11/26/2008 | EP1996003A2 Flexible Print Circuit And Liquid Crystal Display Device |
| 11/26/2008 | EP1996002A1 Bump forming method and bump forming apparatus |
| 11/26/2008 | EP1996001A2 Method for manufacturing a substrate |
| 11/26/2008 | EP1996000A2 Stand-off mounting apparatus for discrete electrical components |
| 11/26/2008 | EP1995999A2 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate |
| 11/26/2008 | EP1995775A2 Semiconductor device with stress reducing element |
| 11/26/2008 | EP1995724A1 Suspension board with circuit |
| 11/26/2008 | EP1995354A1 Surface treated elctrolytic copper foil and process for producing the same |
| 11/26/2008 | EP1995053A1 Porous film and layered product including porous film |
| 11/26/2008 | EP1995016A1 Water-dispersed flux composition, electronic circuit board with electronic component, and their production methods |
| 11/26/2008 | EP1994810A1 Thermally printable electrically conductive ribbon and method |
| 11/26/2008 | EP1941789A4 Flexible printed circuit and method for manufacturing the same |
| 11/26/2008 | EP1364566B1 Electronic component, component mounting equipment, and component mounting method |
| 11/26/2008 | EP1222725B8 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 11/26/2008 | EP1058697B1 Polymeric films having controlled viscosity response to temperature and shear |
| 11/26/2008 | CN201156863Y Clamp |
| 11/26/2008 | CN201156854Y Fastening foot construction and apparatus having the same construction |
| 11/26/2008 | CN101313638A Multi-layer flexible printed circuit board and method for manufacturing the same |
| 11/26/2008 | CN101313637A Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material |
| 11/26/2008 | CN101313636A Method of manufacturing circuit board having electronic part |
| 11/26/2008 | CN101313033A Curable resin composition and its uses |
| 11/26/2008 | CN101312641A Pin shaping apparatus for integrated circuit and pin shaping method |
| 11/26/2008 | CN101312620A Manufacturing process for metal circuit of multi-layer substrate and construction thereof |
| 11/26/2008 | CN101312619A Manufacturing method for multi-layer high-density interconnected printed circuit board |
| 11/26/2008 | CN101312618A Circuit board bearing and transferring construction of reflow furnace |
| 11/26/2008 | CN101312617A Insulating medium layer manufacturing method of high-density printed circuit board |
| 11/26/2008 | CN101312616A Circuit board etching method |
| 11/26/2008 | CN101312615A Printed circuit board and manufacturing method thereof |
| 11/26/2008 | CN101312614A Embedded resistor devices |
| 11/26/2008 | CN101312310A Maintenance structure of vibrating motor and the vibrating motor |
| 11/26/2008 | CN101312137A Electronic component mounting system and electronic component mounting method |
| 11/26/2008 | CN101312136A Solder ball printing device |
| 11/26/2008 | CN101312115A Thin film pattern layer preparation method |
| 11/26/2008 | CN101312086A Electric resistance layout manufacture method and its structure |