| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/14/2009 | CN101346033A Semiconductor packaging structure and method for discharging electronic component on substrate |
| 01/14/2009 | CN101345348A Dual-waveband plane inverse-F antenna with U shaped groove and folding line groove |
| 01/14/2009 | CN101345331A Electronic device and method for manufacturing same |
| 01/14/2009 | CN101345330A Radio frequency antenna and preparation thereof |
| 01/14/2009 | CN101345297A Button battery electrical connection structure and its manufacture process |
| 01/14/2009 | CN101345228A Substrate for mounting device, manufacturing method thereof, semiconductor module and portable equipment |
| 01/14/2009 | CN101345131A Finger insertion type capacitor |
| 01/14/2009 | CN101344724A Sensitive imaging composition, its preparation method and uses |
| 01/14/2009 | CN101344653A LCD and its encapsulation |
| 01/14/2009 | CN101343771A Electroplating apparatus |
| 01/14/2009 | CN101343345A Polyurethane resin, heat solidifying resin composition containing the same and its solidifying article |
| 01/14/2009 | CN101343343A Novolac resin, preparation method and photoresist composition containing the resin |
| 01/14/2009 | CN101342604A Hole drilling method with single-side brass plate as back drill cover plate |
| 01/14/2009 | CN100452950C Automatic assembly machine of jumper switch |
| 01/14/2009 | CN100452949C Surface treatment method for copper foil and method for producing copper-coating laminated board |
| 01/14/2009 | CN100452948C Welded area structure of printed circuit board for washing machine controller |
| 01/14/2009 | CN100452947C Bevel edge processing method for multi plate printed circuit board after printing and fluting, and its milling cutter |
| 01/14/2009 | CN100452946C Method and device for manufacturing conductive patterns in a printed circuit board |
| 01/14/2009 | CN100452943C Electronic device substrate, electronic device, method of manufacturing electronic device |
| 01/14/2009 | CN100452372C Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 01/14/2009 | CN100452346C Coating forming method, apparatus and device, method for mfg. device and electronic apparatus |
| 01/14/2009 | CN100452342C Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 01/14/2009 | CN100452276C Method for mfg. plasma display |
| 01/14/2009 | CN100452176C Method for providing electrical crossover in laminated structure |
| 01/14/2009 | CN100451178C Electricity conductive liquid capable of directly galvanizing the printed board |
| 01/14/2009 | CN100450648C Surface mount-type vibration motor and fixation structure for surface mount-type vibration motor |
| 01/13/2009 | US7477354 Projection exposure apparatus and method for producing a printed circuit board |
| 01/13/2009 | US7477194 Conductive pattern and method of making |
| 01/13/2009 | US7476977 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 01/13/2009 | US7476813 Multilayer flip-chip substrate interconnect layout |
| 01/13/2009 | US7476449 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| 01/13/2009 | US7476422 Copper circuit formed by kinetic spray |
| 01/13/2009 | US7476412 Method for the metalization of an insulator and/or a dielectric |
| 01/13/2009 | US7476277 Apparatus for improving stencil/screen print quality |
| 01/13/2009 | US7476113 Joint member and joint connector for wire harness |
| 01/13/2009 | US7476110 High density connector and method of manufacture |
| 01/13/2009 | US7476065 Printed board drilling method and printed board machining apparatus |
| 01/13/2009 | US7475965 Inkjet printer with low droplet to chamber volume ratio |
| 01/13/2009 | US7475474 Method of making tamper detection circuit for an electronic device |
| 01/13/2009 | CA2385562C Split inductor with fractional turn of each winding and pcb including same |
| 01/08/2009 | WO2009006134A1 A method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
| 01/08/2009 | WO2009006065A1 A method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
| 01/08/2009 | WO2009005696A1 Multilayer wiring element having pin interface |
| 01/08/2009 | WO2009005462A1 Low resistance through-wafer via |
| 01/08/2009 | WO2009004926A1 Photosensitive dry film resist material, printed wiring board made with the same, and process for producing printed wiring board |
| 01/08/2009 | WO2009004855A1 Wiring substrate manufacturing method |
| 01/08/2009 | WO2009004774A1 Metal-laminated polyimide substrate, and method for production thereof |
| 01/08/2009 | WO2009004103A1 Method of manufacture of electric or electronic components and electric or electronic component |
| 01/08/2009 | WO2009003791A1 Electronic module and method for producing an electronic module |
| 01/08/2009 | WO2009003652A1 Substrate comprising a highly conductive layer |
| 01/08/2009 | WO2009003567A1 Method for mounting an electrical component on a supporting element and electrical connection device |
| 01/08/2009 | WO2008008552A3 Build-up printed wiring board substrate having a core layer that is part of a circuit |
| 01/08/2009 | US20090011676 Component Bonding Method and Component Bonding Device |
| 01/08/2009 | US20090011591 Film substrate, fabrication method thereof, and image display substrate |
| 01/08/2009 | US20090011548 Hybrid integrated circuit device and manufacturing method thereof |
| 01/08/2009 | US20090011527 Producing a surface-mountable radiation emitting component |
| 01/08/2009 | US20090011271 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
| 01/08/2009 | US20090009270 Stripline Arrangement and a Method for Production Thereof |
| 01/08/2009 | US20090009193 Moisture-Sensitive Element with an Interdigital Capacitor and Fabrication thereof |
| 01/08/2009 | US20090008776 Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method |
| 01/08/2009 | US20090008255 Arrangement for Generating Liquid Flows and/or Particle Flows, Method for Producing and Operating Said Arrangement and Use of the Latter |
| 01/08/2009 | US20090008145 Embedded circuit structure and fabricating process of the same |
| 01/08/2009 | US20090008142 Porous Film and Multilayer Assembly Using the Same |
| 01/08/2009 | US20090008141 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |
| 01/08/2009 | US20090008139 Multilayer pwb and a method for producing the multilayer pwb |
| 01/08/2009 | US20090008137 Wired circuit board and producing method thererof |
| 01/08/2009 | US20090008136 Multilayered printed circuit board and fabricating method thereof |
| 01/08/2009 | US20090008133 Patterned Circuits and Method for Making Same |
| 01/08/2009 | US20090008128 Electronic apparatus |
| 01/08/2009 | US20090007426 Image forming apparatus and method of manufacturing electronic circuit using the same |
| 01/08/2009 | US20090007425 Method for Manufacturing Multilayer Wiring Board |
| 01/08/2009 | US20090007424 Electronic component mounting system and electronic component mounting method |
| 01/08/2009 | US20090007423 Methods of Providing Semiconductor Components within Sockets |
| 01/08/2009 | DE102007031062A1 Druckprodukt mit elektrisch funktionaler Schicht Print product with electrically functional layer |
| 01/08/2009 | DE102007031061A1 Druckprodukt mit elektrisch funktionaler Schicht Print product with electrically functional layer |
| 01/08/2009 | DE102007030793A1 Electronic component has connecting contact for electrical contacting and solder layer partly capped with another solder layer, where total solder quantity is multiple of solder quantity of former solder layer |
| 01/08/2009 | DE102007029422A1 Method for thermal contacting of power elements mounted on front side of circuit board, involves installing power element on mounting location on circuit board by forming hole in circuit board |
| 01/08/2009 | CA2692595A1 Low resistance through-wafer via |
| 01/07/2009 | EP2012572A1 Brushless motor for washing machine and washing machine having the brushless motor mounted therein |
| 01/07/2009 | EP2012571A2 Connection structure between printed circuit board and electronic component |
| 01/07/2009 | EP2012570A1 Jet solder tank |
| 01/07/2009 | EP2012569A1 Method for mounting solder ball and apparatus for mounting solder ball |
| 01/07/2009 | EP2012568A1 Method for forming metal pattern, metal pattern and printed wiring board |
| 01/07/2009 | EP2012566A2 Wired circuit board and producing method thereof |
| 01/07/2009 | EP2012565A2 Flexible printed circuit board and liquid crystal display device using the same |
| 01/07/2009 | EP2012513A2 Electrical subassembly and use thereof |
| 01/07/2009 | EP2011842A1 Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof |
| 01/07/2009 | EP2011665A2 Printed product with electrically functional layer |
| 01/07/2009 | EP2011599A1 Laser processing method and laser processing apparatus |
| 01/07/2009 | EP2010699A2 Electroplating device and method |
| 01/07/2009 | EP2010698A2 Process for electrolytically plating copper |
| 01/07/2009 | EP2010695A2 Recyclable etching solution |
| 01/07/2009 | EP2010352A1 Screen printing head, system and method |
| 01/07/2009 | EP1641591B1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 01/07/2009 | EP1618770A4 Electronic control module for a removable connector and methods of assembling same |
| 01/07/2009 | EP1514302B1 Device for producing an electronic component having external contact surfaces and use of the device for producing an electronic component |
| 01/07/2009 | EP1254592B1 Printed circuit board |
| 01/07/2009 | EP1063737B1 Method for manufacturing a film-type data carrier |
| 01/07/2009 | CN201178526Y Optical transmission apparatus |
| 01/07/2009 | CN201178525Y Circuit board dip soldering machine control apparatus having timed starting function |