| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 11/26/2008 | CN101311256A Cleaning agent for printed circuit board |
| 11/26/2008 | CN101310977A Screen printing device and screen printing method |
| 11/26/2008 | CN100438727C Wiring structure of printed circuit board transmission line |
| 11/26/2008 | CN100438726C Surface mounter and method of mounting components using the same |
| 11/26/2008 | CN100438725C Printing clamp for printing circuit substrate |
| 11/26/2008 | CN100438724C Method for producing wiring base plate |
| 11/26/2008 | CN100438723C Manufacture of PCB with resistors embedded |
| 11/26/2008 | CN100438722C Method for mfg. printed circuitboard |
| 11/26/2008 | CN100438721C Electronic component module and electronic device using the same |
| 11/26/2008 | CN100438719C Hybrid integrated circuit device and method of manufacturing the same |
| 11/26/2008 | CN100438102C Metal base circuit substrate for an optical device and method manufacturing the aforementioned substrate |
| 11/26/2008 | CN100438089C Light semiconductor device and optical signal input and output device |
| 11/26/2008 | CN100438002C Wire-layingout plate and its making method, semiconductor device and its making method |
| 11/26/2008 | CN100437988C Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 11/26/2008 | CN100437987C Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package |
| 11/26/2008 | CN100437986C 复合电子部件 Composite electronic component |
| 11/26/2008 | CN100437956C Method for manufacturing semiconductor device |
| 11/26/2008 | CN100437904C Method of manufacturing substrate having resist film |
| 11/26/2008 | CN100437851C capacitor |
| 11/26/2008 | CN100437636C Method for making smart cards capable of operating with and without contact |
| 11/26/2008 | CN100437598C Integrated power supply system ananyzing system, integrated power supply system ananyzing method, and multilayer printed circuit board |
| 11/26/2008 | CN100437407C Abbe error correction system and method |
| 11/26/2008 | CN100437357C Exposure apparatus extendible corresponding to substrate for printed circuitboard |
| 11/26/2008 | CN100437223C Display device, repairing structure for display device circuit and its production |
| 11/26/2008 | CN100437218C Substrate treatment apparatus |
| 11/26/2008 | CN100437120C Testing electrode of single nanometer materials and production thereof |
| 11/26/2008 | CN100436653C Method for electrolytic copper plating |
| 11/26/2008 | CN100436645C Etching solution of copper or copper alloy and method for producing electronic substrate using the solution |
| 11/26/2008 | CN100436538C Resin molded article with reduced dielectric loss tangent and method of manufacturing thereof |
| 11/25/2008 | US7456504 Electronic component assemblies with electrically conductive bonds |
| 11/25/2008 | US7456372 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| 11/25/2008 | US7455915 Multilayered material of solder, copper, nickel, gold, and a soluble tape; integrated circuits |
| 11/25/2008 | US7455532 Electronic component pin connectors |
| 11/25/2008 | US7455209 Filling device and method for filling balls in the apertures of a ball-receiving element |
| 11/25/2008 | US7454866 Façade covering |
| 11/25/2008 | US7454833 High performance chip carrier substrate |
| 11/25/2008 | US7454832 Method of forming metal plate pattern and circuit board |
| 11/25/2008 | US7454831 Method for mounting an electronic element on a wiring board |
| 11/20/2008 | WO2008140094A1 Circuit-connecting material, and connection structure for circuit member |
| 11/20/2008 | WO2008140039A1 Printing device and printing method |
| 11/20/2008 | WO2008140017A1 Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board |
| 11/20/2008 | WO2008140016A1 Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board |
| 11/20/2008 | WO2008139701A1 Electronic component mounting body and electronic component with solder bump and method for manufacturing them |
| 11/20/2008 | WO2008139613A1 Wiring board and method of manufacturing the same |
| 11/20/2008 | WO2008139612A1 Wiring board and method of manufacturing the same |
| 11/20/2008 | WO2008138898A1 Circuit board with integrated press-fit pin |
| 11/20/2008 | WO2008138532A1 Flexible circuit board material and method for producing the same |
| 11/20/2008 | WO2006138381A3 Tack & fuse chip bonding |
| 11/20/2008 | US20080287022 Fabric and yarn structures for improving signal integrity in fabric-based electrical circuits |
| 11/20/2008 | US20080286538 Polyimide-Metal Laminated Body and Polyimide Circuit Board |
| 11/20/2008 | US20080284837 Methods and systems for therma-based laser processing a multi-material device |
| 11/20/2008 | US20080284555 Process for refurbishing an electrical device component comprising a laminate electrical insulation part and electrical device component comprising said part |
| 11/20/2008 | US20080283997 Electronic Device and Pressure Sensor |
| 11/20/2008 | US20080283973 Integrated circuit including a dielectric layer and method |
| 11/20/2008 | US20080283615 Dual interface inlays |
| 11/20/2008 | US20080283488 Method For Producing a Ceramic Printed-Circuit Board |
| 11/20/2008 | US20080283408 Aluminum Substrate for Printed Circuits, Manufacturing Method Thereof, Printed Circuit Board, and Manufacturing Method Thereof |
| 11/20/2008 | US20080283387 programmable; for transferring conductive pieces such as solder balls to electrode pads of a target substrate; includes a transfer substrate; individually addressable electrodes formed on the transfer substrate which selectively attract and hold solder balls during transfer |
| 11/20/2008 | US20080283282 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 11/20/2008 | US20080283277 Wiring board manufacturing method and wiring board |
| 11/20/2008 | US20080283275 thermal imaging and catalytic layers deposited on substrate, on exposure to laser beam, levels of radiation are converted to heat in thermal imaging layer to render exposed regions of catalytic layer inactive, substrate is exposed to reaction solution to initiate growth of metal film on unexposed regions |
| 11/20/2008 | US20080282802 Fabrication process and package design for use in a micro-machined seismometer or other device |
| 11/20/2008 | US20080282535 Method of fabricating an integrated circuit |
| 11/20/2008 | DE19980533B4 Abschirmung einer auf einem metallischen Substrat angebrachten elektronischen Karte mit gedruckter Schaltung A shield mounted on a metallic substrate electronic card includes a printed circuit |
| 11/20/2008 | DE10311821B4 Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck Method and apparatus for aligning substrate and stencil stencil printing |
| 11/20/2008 | DE102007021896A1 Flexibles Leiterplattenmaterial und Verfahren zum Herstellen desselben The same flexible printed circuit board material and method of making |
| 11/19/2008 | EP1993335A1 Stamping device with exchangeable stamp and variable stamping pattern |
| 11/19/2008 | EP1993333A2 Method for manufacturing tag integrated circuit flexible board and structure of the same |
| 11/19/2008 | EP1993124A1 Mounting method, board with electrical component, and electrical apparatus |
| 11/19/2008 | EP1992207A1 Multi-layer package structure and fabrication method thereof |
| 11/19/2008 | EP1767074B1 Method for applying a material onto a substrate using a droplet printing technique |
| 11/19/2008 | EP1425167B1 Method for producing a ceramic substrate and ceramic substrate |
| 11/19/2008 | EP1246730B2 Thermal transfer of microstructured layers |
| 11/19/2008 | EP1126752B1 Chip scale packaging on CTE matched printed wiring boards |
| 11/19/2008 | CN201153364Y Split plate clamp of point dust absorption type |
| 11/19/2008 | CN201153350Y Circuit board output terminal bevelling machine |
| 11/19/2008 | CN201153348Y Interconnect construction of circuit board |
| 11/19/2008 | CN101310575A Rigid and flexible circuit board and production method therefor |
| 11/19/2008 | CN101310574A Rigid and flexible circuit board and production method therefor |
| 11/19/2008 | CN101310573A Method for connecting printed circuit boards |
| 11/19/2008 | CN101310572A Soldering apparatus and soldering method |
| 11/19/2008 | CN101310571A Printed wiring board, method for manufacturing same and use of same |
| 11/19/2008 | CN101310384A A method of substrate manufacture that decreases the package resistance |
| 11/19/2008 | CN101310344A Conductive paste and wiring board using same |
| 11/19/2008 | CN101309993A Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method |
| 11/19/2008 | CN101309559A Multi-layer printed circuit board, design method thereof, and final product of mainboard |
| 11/19/2008 | CN101309558A Manufacturing method of multi-layer printed circuit board and the circuit board |
| 11/19/2008 | CN101309557A Presetting positioning fusion process for inner central layer of printed circuit board |
| 11/19/2008 | CN101309556A Production method of circuit board having long and short golden finger |
| 11/19/2008 | CN101309555A Semiautomatic PCB plate clamping tool |
| 11/19/2008 | CN101309554A Predetermined pattern manufacturing method |
| 11/19/2008 | CN101309553A Electronic circuit device and production method of the same |
| 11/19/2008 | CN101309552A Conducting construction of circuit board and manufacturing method therefor |
| 11/19/2008 | CN101308953A Special membrane and method for manufacturing radio-frequency label antenna |
| 11/19/2008 | CN101308799A Wiring board connection method and wiring board |
| 11/19/2008 | CN101307443A Chemical treatment method and chemical treatment apparatus |
| 11/19/2008 | CN101307174A Surface-mounting electronic component |
| 11/19/2008 | CN101306490A Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat |
| 11/19/2008 | CN101306484A Automatic welding device for flow line |
| 11/19/2008 | CN100435606C Method for making hard-soft composite circuit board |