| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/18/2009 | CN101370352A Printed circuit board and its production method, and a ball grid array bonding pad pattern |
| 02/18/2009 | CN101369691A Method of making an electrical connector |
| 02/18/2009 | CN101369547A Method for manufacturing semiconductor device |
| 02/18/2009 | CN101369542A Wiring board and manufacturing method therefor, and semiconductor device and manufacturing method therefor |
| 02/18/2009 | CN101369487A Controlled esr decoupling capacitor |
| 02/18/2009 | CN100463589C Method of fabricating PCB in parallel manner |
| 02/18/2009 | CN100463588C Fixing method used between components |
| 02/18/2009 | CN100463587C Method for forming bump on electrode pad with use of double-layered film |
| 02/18/2009 | CN100463586C Mounting structure, electro-optical device, electronic apparatus, and method of manufacturing electro-optical device |
| 02/18/2009 | CN100463584C Pore column dividing type intercommunicating pore structure and its manufacturing method |
| 02/18/2009 | CN100463169C Mixed integrated circuit device and its manufacturing method |
| 02/18/2009 | CN100463131C Assembling apparatus, assembling method and terminal cleaning apparatus |
| 02/18/2009 | CN100463084C Metal membrane and manufacture thereof, laminated ceramic electronic elements and manufacture thereof |
| 02/18/2009 | CN100462715C Print solder checker |
| 02/17/2009 | US7491897 Electronic equipment provided with wiring board into which press-fit terminals are press-fitted |
| 02/17/2009 | US7491895 Wiring substrate and method of fabricating the same |
| 02/17/2009 | US7491894 Hybrid integrated circuit device |
| 02/17/2009 | US7491893 Mounting substrate and mounting method of electronic part |
| 02/17/2009 | US7491427 Polyimidesiloxane solution composition |
| 02/17/2009 | US7491290 Comprising first curing agent, formed by silane coupling agent and electrically conductive particles mixed with epoxy resin to produce first adhesive material, second curing agent, formed of metal chelate or metal alcoholate and electrically conductive particles mixed with second epoxy resin |
| 02/17/2009 | US7491286 Spin or immersion coating; semiconductors, insulators, and superconductors; optics, magnetism |
| 02/17/2009 | US7491283 Production method of multilayer electronic device |
| 02/17/2009 | US7490403 Soldering method |
| 02/17/2009 | US7490402 Technique for laminating multiple substrates |
| 02/12/2009 | WO2009020124A1 Ic mounting substrate and method for manufacturing the same |
| 02/12/2009 | WO2009020005A1 Adhesive composition, film-like adhesive, and connection structure for circuit member |
| 02/12/2009 | WO2009019966A1 Three-dimensional measurement device and board inspecting machine |
| 02/12/2009 | WO2009019792A1 Circuit module, and electronic device using the module |
| 02/12/2009 | WO2009019311A1 Resin formulation based on bismaleimide for producing a film, production of a film using the resin formulation and use of the film |
| 02/12/2009 | WO2009018993A2 Device for electrical connection between a first support element and a second support element, method of electrical connection between a first support element and a second support element, and method of mounting an electrical component on a first support element |
| 02/12/2009 | WO2008150898A3 Electronic assemblies without solder and methods for their manufacture |
| 02/12/2009 | WO2008135142A4 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 02/12/2009 | US20090043413 Component mounting apparatus, service providing device and servicing method |
| 02/12/2009 | US20090042414 Land grid array fabrication using elastomer core and conducting metal shell or mesh |
| 02/12/2009 | US20090041990 Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board |
| 02/12/2009 | US20090041981 Packaging substrate having electrical connection structure and method for fabricating the same |
| 02/12/2009 | US20090041883 Apparatus for fabricating flat panel display |
| 02/12/2009 | US20090040735 Tamper Respondent System |
| 02/12/2009 | US20090039486 Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member |
| 02/12/2009 | US20090039415 Method of forming dielectric including dysprosium and scandium by atomic layer deposition and integrated circuit device including the dielectric layer |
| 02/12/2009 | US20090039286 System and method for attenuating the effect of ambient light on an optical sensor |
| 02/12/2009 | US20090038838 Circuit board and method for fabricating the same |
| 02/12/2009 | US20090038836 Wiring board and method of manufacturing wiring board |
| 02/12/2009 | US20090038835 Multilayer printed wiring board and method for manufacturing the same |
| 02/12/2009 | US20090038493 Printing in a medium |
| 02/12/2009 | DE202008015294U1 Substrat mit einem Loch mit einer Metallsilizidschicht Substrate with a hole with a metal silicide |
| 02/12/2009 | DE202008012352U1 Lötdüsenbefestigung Lötdüsenbefestigung |
| 02/12/2009 | DE112006003809T5 Zusammengesetztes Substrat und Verfahren zum Herstellen eines zusammengesetzten Substrats A composite substrate and method of manufacturing a composite substrate |
| 02/11/2009 | EP2023701A1 Method for manufacturing ceramic multilayer substrate |
| 02/11/2009 | EP2023700A2 Electric switch and method for producing an electric switch |
| 02/11/2009 | EP2023699A2 Heat radiation package and semiconductor device |
| 02/11/2009 | EP2023384A1 Electronic component, semiconductor package and electronic device |
| 02/11/2009 | EP2022832A2 Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles |
| 02/11/2009 | EP2022591A1 Method for creating a solderable metal surface and solder method |
| 02/11/2009 | EP2022590A1 Wave soldering tank |
| 02/11/2009 | EP2022147A1 Systems, devices, and methods for increasing current carrying capacity |
| 02/11/2009 | EP2022133A1 Module, filter, and antenna technology for millimeter waves multi-gigabits wireless systems |
| 02/11/2009 | EP1545826A4 Solder hierarchy for lead free solder joint |
| 02/11/2009 | EP0976848B1 Metal composition containing metal acetilide, blank having metallic coating formed therewith, and method for forming the metallic coating |
| 02/11/2009 | CN101366326A Method of connecting electrical components |
| 02/11/2009 | CN101366325A Electronic component mounting structure |
| 02/11/2009 | CN101365303A Blade construction |
| 02/11/2009 | CN101365302A Flexible film circuit board pasting method |
| 02/11/2009 | CN101365301A Pasting method of non-insulation sheet upon printed circuit board, as well as, printed circuit board and optical disk apparatus |
| 02/11/2009 | CN101365300A Manufacturing method of circuit board conductive wire |
| 02/11/2009 | CN101365299A Manufacturing method for memory card series circuit board having thickened golden finger and memory card |
| 02/11/2009 | CN101365298A Manufacturing method for semi-flexible printed circuit board |
| 02/11/2009 | CN101365297A Circuit board cutting method |
| 02/11/2009 | CN101365291A Printed circuit board, design method thereof and terminal product main board |
| 02/11/2009 | CN101364587A Circuit board construction for embedding capacitor element and preparation thereof |
| 02/11/2009 | CN101364583A Capacitor embedded semi-conductor package substrate construction and preparation thereof |
| 02/11/2009 | CN101364582A Loading board construction embedded with chip and preparation thereof |
| 02/11/2009 | CN101364581A Loading board construction embedded with chip and preparation thereof |
| 02/11/2009 | CN101364115A Nitrogen closed-loop control method and system |
| 02/11/2009 | CN101363128A Non-cyanogen type electrolytic gold plating bath for bump forming |
| 02/11/2009 | CN100461997C Electric element mounting/demounting device |
| 02/11/2009 | CN100461994C Thermal gain thin-type electronic mechanism |
| 02/11/2009 | CN100461989C Wiring transfer sheet material and producing method thereof, wiring substrate and producing method thereof |
| 02/11/2009 | CN100461988C Adjustable frame type apparatus |
| 02/11/2009 | CN100461987C Method for cutting printing circuit board |
| 02/11/2009 | CN100461986C Fast production method for printed board |
| 02/11/2009 | CN100461985C Wiring substrate, process for manufacturing the wiring substrate, and carrier sheet of printed circuit used in the manufacturing process |
| 02/11/2009 | CN100461983C Printed circuit board having weak magnetic field sensor and method of manufacturing the same |
| 02/11/2009 | CN100461981C Projected electrode based on polymer substrate, making method and use thereof |
| 02/11/2009 | CN100461554C Discrete electronic component and related assembling method |
| 02/11/2009 | CN100461533C Electrical connector |
| 02/11/2009 | CN100461402C Circuit device and method for manufacturing same |
| 02/11/2009 | CN100461384C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 02/11/2009 | CN100461383C 多层印刷线路板 Multilayer printed circuit boards |
| 02/11/2009 | CN100461358C Component mounting method and component mounting apparatus |
| 02/11/2009 | CN100461357C Through electrode and method for forming the same |
| 02/11/2009 | CN100461355C Flexible contact-connection device |
| 02/11/2009 | CN100461353C Method for manufacturing hybrid integrated circuit device |
| 02/11/2009 | CN100461335C Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate |
| 02/11/2009 | CN100461035C Surface-mounted antenna apparatus |
| 02/11/2009 | CN100461000C Method for forming metal pattern with low resistivity |
| 02/11/2009 | CN100460998C Adhesive label, adhesive label roll, photosensitive web unit, and apparatus and method for manufacturing photosensitive laminated body |
| 02/11/2009 | CN100460361C Multi-layer ceramic substrate and manufacturing method thereof |
| 02/11/2009 | CN100460248C Electronic device |
| 02/11/2009 | CN100460208C Printing device and production method of electronic parts |