| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/07/2009 | CN201178524Y Pressed coating type bearing tool construction |
| 01/07/2009 | CN201176333Y Conveying roller |
| 01/07/2009 | CN101341809A An electronic device, a housing part, and a method of manufacturing a housing part |
| 01/07/2009 | CN101341808A Method for manufacturing ceramic multilayer substrate |
| 01/07/2009 | CN101341807A Inductor and electric power source using same |
| 01/07/2009 | CN101341806A An apparatus and method for improving printed circuit board signal layer transitions |
| 01/07/2009 | CN101341805A Structure and method of fixing electronic parts to circuit board |
| 01/07/2009 | CN101341804A Connection structure of circuit board, connection part of circuit board and electronic apparatus |
| 01/07/2009 | CN101341633A Capacitor interconnection |
| 01/07/2009 | CN101341585A Method of bonding |
| 01/07/2009 | CN101341278A Plating apparatus and method of plating |
| 01/07/2009 | CN101340782A Multilayered circuit board having interlayer contraposition checking system and contraposition checking method thereof |
| 01/07/2009 | CN101340781A High frequency printed circuit board via |
| 01/07/2009 | CN101340780A Flexible circuit substrate having coiling portion and manufacturing method thereof |
| 01/07/2009 | CN101340779A Carrier and method for manufacturing printed circuit board |
| 01/07/2009 | CN101340778A Manufacturing method of hollowed-out PCB |
| 01/07/2009 | CN101340777A Flexible printed circuit board and liquid crystal display device using the same |
| 01/07/2009 | CN101340775A Flexible circuit board and manufacturing method thereof |
| 01/07/2009 | CN101340774A Flexible glue-free copper coated plate and preparation thereof |
| 01/07/2009 | CN101340773A Wired circuit board and producing method thererof |
| 01/07/2009 | CN101339936A Board having buried patterns and manufacturing method thereof |
| 01/07/2009 | CN101339935A Connection structure between printed circuit board and electronic component |
| 01/07/2009 | CN101339908A Electroplating method of electric contact mat and semi-conductor substrate having the electric contact mat |
| 01/07/2009 | CN101338436A Pretreatment process of half-tap hole gold immersion plate |
| 01/07/2009 | CN101338251A High-efficiency non-corrosion water-based soldering paste detergent |
| 01/07/2009 | CN101337308A 焊料 Solder |
| 01/07/2009 | CN100450338C Apparatus and method for insepecting cream solder printed on a substrate |
| 01/07/2009 | CN100450331C Circuit forming board and method of manufacturing circuit forming board |
| 01/07/2009 | CN100450330C Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device |
| 01/07/2009 | CN100450329C Device and method for film base plate processing and method for film base plate moving out |
| 01/07/2009 | CN100450328C Digital application of protective soldermask to printed circuit boards |
| 01/07/2009 | CN100450327C Board connecting component and three-dimensional connecting structure using thereof |
| 01/07/2009 | CN100449932C Power module and electric transportation apparatus incorporating the same |
| 01/07/2009 | CN100449830C Fuel cell electric equipment electronic board manufacturing method of electric board connector for fuel cell wiring member and mounting method of fuel cell |
| 01/07/2009 | CN100449752C Method for manufacturing circuit device |
| 01/07/2009 | CN100449747C Chip scale stacking system and method |
| 01/07/2009 | CN100449739C Electrical circuit apparatus and methods for assembling same |
| 01/07/2009 | CN100449697C Method of forming wiring pattern |
| 01/07/2009 | CN100449655C Surface-mounted thermistor and manufacturing method thereof |
| 01/07/2009 | CN100448668C Die for punching & laminating simultaneously |
| 01/07/2009 | CN100448594C Device and method for processing electric circuit substrates by laser |
| 01/06/2009 | US7474008 Semiconductor device with reduced electromigration |
| 01/06/2009 | US7473992 Multi-layer interconnection circuit module and manufacturing method thereof |
| 01/06/2009 | US7473851 Cross-connecting by permutations using configurable printed circuits |
| 01/06/2009 | US7473476 Prevents deterioration of a soldering portion and improved strength of thermal fatigue resistance, electronic circuit board |
| 01/06/2009 | US7473458 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof |
| 01/06/2009 | US7473344 Segmented counterelectrode for an electrolytic treatment system |
| 01/06/2009 | US7472477 Method for manufacturing a socket that compensates for differing coefficients of thermal expansion |
| 01/02/2009 | DE10309502B4 Verfahren zur Herstellung einer Lothügelstruktur und Lothügelstruktur A process for preparing a Lothügelstruktur and Lothügelstruktur |
| 01/02/2009 | DE10296619B4 Leistungsmodul Power module |
| 01/02/2009 | DE102007030414A1 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur A process for producing an electrically conductive structure |
| 01/02/2009 | DE102007029913A1 Elektrisches Steuergerät Electrical control device |
| 01/02/2009 | DE102007029441A1 Reflow-Lötanlage mit an externe Transportgeschwindigkeiten anpassbarem Temperaturprofil Reflow soldering system with adjustable speeds to external transport temperature profile |
| 01/02/2009 | DE102005006638B4 Haftfeste Leiterbahn auf Isolationsschicht Tenacious conductor on insulating layer |
| 01/02/2009 | DE10052517B4 Transpondermodul, Identifikationsträger und Verfahren zum Herstellen eines Transpondermoduls Transponder module, the identification carriers and methods of producing a transponder module |
| 01/01/2009 | US20090004846 Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
| 01/01/2009 | US20090002958 Method of Forming a Substrate Core Structure Using Microvia Laser Drilling and Conductive Layer Pre-Patterning And Substrate Core Structure Formed According to the Method |
| 01/01/2009 | US20090002953 Production of via hole in flexible circuit printable board |
| 01/01/2009 | US20090001550 Method of Forming a Multilayer Substrate Core Structure Using Sequential Microvia Laser Drilling And Substrate Core Structure Formed According to the Method |
| 01/01/2009 | US20090000816 Conformal shielding process using flush structures |
| 01/01/2009 | US20090000815 Conformal shielding employing segment buildup |
| 01/01/2009 | US20090000813 Packaging substrate structure and manufacturing method thereof |
| 01/01/2009 | US20090000812 Multilayer printed wiring board |
| 01/01/2009 | US20090000811 Chip resistor and method for fabricating the same |
| 01/01/2009 | US20090000808 Flexible Printed Circuit Board And Method Of Fabricating The Same |
| 01/01/2009 | US20090000807 Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same |
| 01/01/2009 | US20090000498 Printing device, production unit, and production method of electronic parts |
| 01/01/2009 | US20090000115 Surface mounting apparatus and method |
| 01/01/2009 | US20090000110 Mounting Method and Component Mounter |
| 12/31/2008 | WO2009002674A1 Apparatus and method for forming a thin film electronic device on a thermoformed polymeric substrate |
| 12/31/2008 | WO2009002355A1 Method for providing hermetic electrical feedthrough |
| 12/31/2008 | WO2009002083A2 Manufacturing method of fpcb |
| 12/31/2008 | WO2009001842A1 Multilayer ceramic electronic component and mounting structure thereof |
| 12/31/2008 | WO2009001768A1 Multi-layered substrate and its manufacturing method |
| 12/31/2008 | WO2009001671A1 Printed wiring board |
| 12/31/2008 | WO2009001665A1 Metal layer laminate with metal surface roughened layer and process for producing the same |
| 12/31/2008 | WO2009001621A1 Manufacturing method for part built-in substrate |
| 12/31/2008 | WO2009001605A1 Anisotropic elctroconductive material, connection structure, and process for producing the connection structure |
| 12/31/2008 | WO2009001517A1 Laser processing apparatus and laser processing method |
| 12/31/2008 | WO2009001379A1 Drying apparatus and method for silicon-based electronic circuits |
| 12/31/2008 | WO2009000682A1 Device for pressing against semiconductor chips |
| 12/31/2008 | WO2009000167A1 Integrated equipment of implant heads and weld heads and method of implanting and welding wires |
| 12/31/2008 | WO2008135142A3 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 12/31/2008 | WO2008123764A3 Pre-stamped matrix metal substrate with matrix electrical testing capability |
| 12/31/2008 | WO2008122427A3 Use of silane compositions for the production of mutilayer laminates |
| 12/31/2008 | WO2008117213A3 An assembly of at least two printed circuit boards and a method of assembling at least two printed circuit boards |
| 12/31/2008 | EP2009971A1 Solder layer, substrate for device junction utilizing the same, and process for manufacturing the substrate |
| 12/31/2008 | EP2009970A2 Method for manufacturing an electrically conductive structure |
| 12/31/2008 | EP2009969A2 Systems and methods for curing a deposited layer on a substrate |
| 12/31/2008 | EP2009967A2 Wiring board and bus bar segments to be used therefor |
| 12/31/2008 | EP2009497A1 Photosensitive element, method for formation of resist pattern, and method for production of print circuit board |
| 12/31/2008 | EP2008302A1 Apparatus and method to metalize supports for photovoltaic cells |
| 12/31/2008 | EP2008021A1 Illuminator |
| 12/31/2008 | EP2007575A1 Processes for producing articles containing titanium dioxide possessing low sinterability |
| 12/31/2008 | EP1817946B1 Method and device for producing structures from functional materials |
| 12/31/2008 | EP1620209A4 Kinetic spray application of coatings onto covered materials |
| 12/31/2008 | EP1551211B1 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 12/31/2008 | EP1171915B1 Electrical conductor system of a semiconductor device and manufacturing method thereof |
| 12/31/2008 | CN201174826Y Circuit board dip welder control device with circuit board capable of choosing multiple temperature display |
| 12/31/2008 | CN201174825Y General-purpose plug socket tools |