| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/04/2009 | CN100459015C Forming method of stacking structure and manufacturing method of electron source and image display apparatus using such method |
| 02/04/2009 | CN100458771C Auxiliary wiring system and method |
| 02/04/2009 | CN100458457C Method, apparatus and system for detecting circuit board and equipment thereof |
| 02/04/2009 | CN100457348C Reflow furnace and hot-air blowing-type heater |
| 02/03/2009 | US7486921 Method of producing electronic circuit, and electronic circuit substrate |
| 02/03/2009 | US7485970 Semiconductor package substrate having contact pad protective layer formed thereon |
| 02/03/2009 | US7485951 Modularized die stacking system and method |
| 02/03/2009 | US7485848 Optical device and production method thereof |
| 02/03/2009 | US7485812 Single or multi-layer printed circuit board with improved via design |
| 02/03/2009 | US7485565 Nickel bonding cap over copper metalized bondpads |
| 02/03/2009 | US7485489 Electronics circuit manufacture |
| 02/03/2009 | US7485362 Nanoporous laminates |
| 02/03/2009 | US7485361 Inner circuit layer of epoxy resin, solvent-soluble aromatic polyamide resin polymer and a curing accelerator, plating of tin, nickel or an alloy of these metals is formed on the surface of the inner layer circuit facing the primer resin; which does not require roughening such as black oxide treatment |
| 02/03/2009 | US7485341 Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same |
| 02/03/2009 | US7485006 Memory module, socket and mounting method providing improved heat dissipating characteristics |
| 02/03/2009 | US7484293 Semiconductor package and manufacturing method therefor |
| 02/03/2009 | CA2472750C High density area array solder microjoining interconnect structure and fabrication method |
| 01/29/2009 | WO2009014126A1 Multilayer wiring board |
| 01/29/2009 | WO2009014017A1 Multilayer ceramic board and process for manufacturing the same |
| 01/29/2009 | WO2009013988A1 Print circuit board and electronic device using the same |
| 01/29/2009 | WO2009013953A1 Thermocompression-bonding device and method of mounting electric component |
| 01/29/2009 | WO2009012815A1 Method and apparatus for laser beam processing of an element with total transmission for light of at least 10-5 |
| 01/29/2009 | US20090029573 Contact Device |
| 01/29/2009 | US20090029037 Plating apparatus and method of plating |
| 01/29/2009 | US20090028497 Optoelectronic wiring board, optical communication device, and method of manufacturing the optical communication device |
| 01/29/2009 | US20090028494 Optical waveguide, package board having the same, and manufacturing method thereof |
| 01/29/2009 | US20090027865 Surface Mount Electrical Component |
| 01/29/2009 | US20090027864 Printed circuit board and manufacturing method thereof |
| 01/29/2009 | US20090027859 Surface mounted heat sink and electromagnetic shield |
| 01/29/2009 | US20090027448 Printhead with reciprocating coils |
| 01/29/2009 | US20090027144 Printed wiring board |
| 01/29/2009 | US20090025971 Electronic component-embedded board and method of manufacturing the same |
| 01/29/2009 | US20090025965 Assembly substrate and method of manufacturing the same |
| 01/29/2009 | US20090025962 Electronic Module Expansion Bridge |
| 01/29/2009 | US20090025961 Electronic component-embedded board and method of manufacturing the same |
| 01/29/2009 | US20090025788 Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module |
| 01/29/2009 | US20090025217 Producing method of wired circuit board |
| 01/29/2009 | US20090025216 Multi-layer printed wiring board including an alighment mark as an index for a position of via holes |
| 01/29/2009 | US20090025215 Multilayer wiring structure and method of manufacturing the same |
| 01/29/2009 | US20090025214 Apparatus for fixing flexible printed circuit module to sliding mechanism of portable electronic device |
| 01/29/2009 | US20090025213 Substantially Continuous Layer of Embedded Transient Protection For Printed Circuit Boards |
| 01/29/2009 | US20090025212 Wired circuit board and production method thereof |
| 01/29/2009 | US20090025211 Isolated conformal shielding |
| 01/29/2009 | US20090025210 Circuit board structure with concave conductive cylinders and method for fabricating the same |
| 01/29/2009 | US20090025204 Microstrip line dielectric overlay |
| 01/29/2009 | DE112006003629T5 Temporäre Befestigungsvorrichtung Temporary fastening device |
| 01/29/2009 | DE10258090B4 Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich Process for the preparation of rigid-flex circuits and printed circuit boards with at least one rigid portion and at least one flexible area |
| 01/29/2009 | DE102007035060A1 Connection for semiconductor component with carrier element, has holes arranged one above other in semiconductor component and carrier element, where hole of semiconductor component is conically formed |
| 01/29/2009 | DE102004043084B4 Einrichtung und Verfahren für die Montage oder Verdrahtung von Halbleiterchips Apparatus and method for the assembly or wiring of semiconductor chips |
| 01/28/2009 | EP2019577A1 Multilayer module with case |
| 01/28/2009 | EP2019576A2 Apparatus and method of mounting conductive ball |
| 01/28/2009 | EP2019575A2 Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method |
| 01/28/2009 | EP2019574A2 Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | EP2019573A2 Wired circuit board and producing method thereof |
| 01/28/2009 | EP2019572A2 Assembly substrate and method of manufacturing the same |
| 01/28/2009 | EP2019571A2 Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | EP2019422A2 Apparatus and method for arranging magnetic solder balls |
| 01/28/2009 | EP2019387A1 Pattern forming method |
| 01/28/2009 | EP1335831A4 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 01/28/2009 | CN201188723Y Inspection bench for character net edition of printed circuit board |
| 01/28/2009 | CN201188338Y Hollow coil structured by multiple layer mirrorimage wiring printed circuit board |
| 01/28/2009 | CN201186958Y Copper ball apparatus for adding copper anode |
| 01/28/2009 | CN101356866A Method and apparatus for mounting solder ball |
| 01/28/2009 | CN101356642A Printed-circuit board, and method for manufacturing the same |
| 01/28/2009 | CN101356475A Photocurable/thermocurable solder resist composition, and printed circuit board using the same |
| 01/28/2009 | CN101355858A Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | CN101355857A Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | CN101355856A Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
| 01/28/2009 | CN101355855A Method for directly silk-printing and shaping embedding resistance on a printed circuit board using stainless steel net |
| 01/28/2009 | CN101355854A Method for printing screen of circuit board |
| 01/28/2009 | CN101355853A Producing method of wired circuit board |
| 01/28/2009 | CN101355852A Printed circuit board manufacturing system and manufacturing method thereof |
| 01/28/2009 | CN101355850A Assembly substrate and method of manufacturing the same |
| 01/28/2009 | CN101355849A Wired circuit board and producing method thereof |
| 01/28/2009 | CN101355848A Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board |
| 01/28/2009 | CN101355847A Printed circuit board and manufacturing method thereof |
| 01/28/2009 | CN101355845A Substrate with conductive projection and technique thereof |
| 01/28/2009 | CN101353613A Printed circuit board cleaning agent |
| 01/28/2009 | CN101352963A Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board |
| 01/28/2009 | CN101352954A Mask for screen printing and screen printing method using the same |
| 01/28/2009 | CN101352858A Back drilling method of PCB plate |
| 01/28/2009 | CN101352763A FPC secondary drilling method |
| 01/28/2009 | CN100456915C Compact radio equipment and method of mounting the same |
| 01/28/2009 | CN100456909C Printed circuit board |
| 01/28/2009 | CN100456908C Hot pressing manufacturing method for printed circuit board |
| 01/28/2009 | CN100456907C Cleaning roller mechanism for flexible circuit board cleaning machine |
| 01/28/2009 | CN100456566C Electric connector with contact tine plate |
| 01/28/2009 | CN100456472C Power converter package with enhanced thermal management |
| 01/28/2009 | CN100456471C Electronic apparatus |
| 01/28/2009 | CN100456444C Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 01/28/2009 | CN100456026C Board inspection apparatus and method |
| 01/28/2009 | CN100456024C System and method for preventing mistakes in optical inspection |
| 01/28/2009 | CN100455623C Vulcanized fluorine rubber and cushioning material for heat press containing same |
| 01/28/2009 | CN100455438C Pattern forming method, method of manufacturing electronic apparatus, and method of manufacturing substrate |
| 01/28/2009 | CN100455394C Soldering method |
| 01/28/2009 | CN100455393C Removing useless solder and device for removing the same |
| 01/27/2009 | US7483275 Electronic unit, circuit design for the same, and production method |
| 01/27/2009 | US7482824 Polycrystalline contacting component and test tool having the contacting component |
| 01/27/2009 | US7482685 Ceramic circuit board, method for making the same, and power module |
| 01/27/2009 | US7482678 Surface-mounted microwave package and corresponding mounting with a multilayer circuit |