| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/27/2009 | US7482541 Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus |
| 01/27/2009 | US7482201 Nanoparticle filled underfill |
| 01/27/2009 | US7482200 Process for fabricating chip package structure |
| 01/27/2009 | US7482198 Method for producing through-contacts and a semiconductor component with through-contacts |
| 01/27/2009 | US7482052 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure |
| 01/27/2009 | US7481352 Method for ablating points of contact (debumping) |
| 01/27/2009 | US7480990 Method of making conductor contacts having enhanced reliability |
| 01/27/2009 | US7480989 Method for manufacturing pressure detector |
| 01/27/2009 | US7480988 Method and apparatus for providing hermetic electrical feedthrough |
| 01/27/2009 | US7480986 Apparatus for feeding components from packaged component band |
| 01/27/2009 | US7480979 Production of antenna devices |
| 01/27/2009 | CA2380570C Positive acting photoresist composition and imageable element |
| 01/22/2009 | WO2009011696A1 A device and method for reparing a microelectromechanical system |
| 01/22/2009 | WO2009011392A1 In-containing lead-free solder for on-vehicle electronic circuit |
| 01/22/2009 | WO2009011341A1 Lead-free solder for vehicle, and in-vehicle electronic circuit |
| 01/22/2009 | WO2009011337A1 Resin composition and its use |
| 01/22/2009 | WO2009011304A1 Heat curable resin compositon |
| 01/22/2009 | WO2009011025A1 Wiring board and its manufacturing method |
| 01/22/2009 | WO2009011024A1 Wiring board and manufacturing method thereof |
| 01/22/2009 | WO2009011023A1 Wiring board and manufacturing method thereof |
| 01/22/2009 | WO2009010743A1 Improvements in and relating to manufacture of electrical circuits for electrical components |
| 01/22/2009 | WO2009010734A1 An electrical device and method of manufacturing thereof |
| 01/22/2009 | WO2009010705A1 An electrical unit |
| 01/22/2009 | WO2009010704A1 An electrical unit |
| 01/22/2009 | WO2009010703A1 An electrical unit |
| 01/22/2009 | WO2009010208A1 Method for producing thin, conductive structures on surfaces |
| 01/22/2009 | WO2008145804A9 Interference shielded electronics module and method for providing the same |
| 01/22/2009 | WO2008122262A3 Component support for closing systems |
| 01/22/2009 | US20090023398 Wireless Terminal, Wireless Module and Method of Manufacturing such a Terminal |
| 01/22/2009 | US20090021917 Method and apparatus for securing a microprocessor and heat sink using fewer mounting holes |
| 01/22/2009 | US20090021686 Method for gravure printing transparent electrodes, an dink composition therefor |
| 01/22/2009 | US20090020502 Biosensor and method of making |
| 01/22/2009 | US20090020326 Wiring board and method of manufacturing wiring board |
| 01/22/2009 | US20090020325 Weldable contact and method for the production thereof |
| 01/22/2009 | US20090020323 Circuit board structure and method for fabricating the same |
| 01/22/2009 | US20090020321 Metal-ceramic substrate |
| 01/22/2009 | US20090020320 Gold finger of circuit board and fabricating method thereof |
| 01/22/2009 | US20090020317 Wiring board and method of manufacturing wiring board |
| 01/22/2009 | US20090020316 Method of manufacturing chip on film and structure thereof |
| 01/22/2009 | US20090020315 Automated direct emulsion process for making printed circuits and multilayer printed circuits |
| 01/22/2009 | US20090020314 Direct emulsion process for making printed circuits |
| 01/22/2009 | US20090020313 Circuit logic embedded within ic protective layer |
| 01/22/2009 | US20090020215 Optical Coatings With Narrow Conductive Lines |
| 01/22/2009 | US20090019693 Printed wiring board and method of manufacturing the same |
| 01/22/2009 | US20090019692 Method of cutting signal wire preserved on circuit board and circuit layout thereof |
| 01/22/2009 | US20090019691 Micro-electromechanical sub-assembly having an on-chip transfer mechanism |
| 01/22/2009 | DE102007039022B3 Board i.e. printed circuit board, transporting device for press forces measuring arrangement, has transport segment with lever to fix board, where segment is rotatably supported around pivot axis running in conveying direction of conveyor |
| 01/22/2009 | DE102007033865A1 Plant for flood-soldering components onto circuit boards, has gas blowing nozzle arrangement based on rotating shaft with helical groove in housing, to remove excess solder |
| 01/22/2009 | DE102007033523A1 Conductive structures production involves generating channels on surface of substrate by mechanical effect, where ink is suspension of conductive particles and is applied on channels |
| 01/22/2009 | DE102007033465A1 Dehnschlitze zur thermomechanischen Entlastung einer elektrischen Kontaktierung Expansion slots for thermomechanical discharge an electrical contact |
| 01/21/2009 | EP2018092A1 Inductor and electric power source using same |
| 01/21/2009 | EP2018091A2 Component with soldering pin |
| 01/21/2009 | EP2017882A2 Conductive ball mounting method and apparatus |
| 01/21/2009 | EP2017307A1 Thermosetting resin composition and use thereof |
| 01/21/2009 | EP2017031A1 Solder paste |
| 01/21/2009 | EP2015884A1 Tool holder spindles |
| 01/21/2009 | EP1658650B1 Forming electrically conductive layers by ink printing |
| 01/21/2009 | EP1645013B1 Component for a printed circuit board |
| 01/21/2009 | EP1342284B1 Process for securing a microwave module to a support |
| 01/21/2009 | CN201185546Y Paster head apparatus for paster machine |
| 01/21/2009 | CN201185545Y Feeding mechanism for paster machine |
| 01/21/2009 | CN201185544Y Recycling mechanism for paster machine |
| 01/21/2009 | CN201185512Y Loading tool with elastic fixing structure |
| 01/21/2009 | CN201185511Y BGA encapsulation locating structure |
| 01/21/2009 | CN201185510Y Lens mechanism for full-automatic vision printer |
| 01/21/2009 | CN201185507Y 印制电路板 Printed circuit board |
| 01/21/2009 | CN101352111A Temporary fixing device |
| 01/21/2009 | CN101352110A Soldering method, semiconductor module manufacturing method and soldering apparatus |
| 01/21/2009 | CN101352109A Printed wiring board and process for producing the same |
| 01/21/2009 | CN101351874A Soldering method and semiconductor module manufacturing method |
| 01/21/2009 | CN101351295A Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same |
| 01/21/2009 | CN101351115A Method for monitoring drilling quality of printed circuit board drilling department |
| 01/21/2009 | CN101351093A Method for preparing microwave high-frequency multi-layer circuit board |
| 01/21/2009 | CN101351092A Inside imbedded type line board technique with conductive hole |
| 01/21/2009 | CN101351091A Line connection technique and structure thereof |
| 01/21/2009 | CN101351090A Ultra-roughening treating agent for cuprum surface |
| 01/21/2009 | CN101351089A ACF drawing peeling mechanism and method for ACF-providing apparatus |
| 01/21/2009 | CN101351088A Inside imbedded type line structure and technique thereof |
| 01/21/2009 | CN101351087A Inside imbedded type line structure and technique thereof |
| 01/21/2009 | CN101351086A Inside imbedded type line structural technique |
| 01/21/2009 | CN101351085A Gold finger for circuit board and preparation method thereof |
| 01/21/2009 | CN101351084A Circuit board and metal surface treatment technique thereof |
| 01/21/2009 | CN101351083A Line board and technique |
| 01/21/2009 | CN101351082A Method for manufacturing inner layer hole-to-line ultra-capability plate |
| 01/21/2009 | CN101351077A Wired circuit board |
| 01/21/2009 | CN101350447A Line-imbedding type UHF frequency band line-establishing antennae and UHF electronic label using the same |
| 01/21/2009 | CN101350446A Method for preparing flat antenna |
| 01/21/2009 | CN101350324A Packaging method and system of electric component |
| 01/21/2009 | CN101350323A Solder bump forming method |
| 01/21/2009 | CN101350315A Manufacturing method of metal-coated polyimide substrate |
| 01/21/2009 | CN101350314A Method of manufacturing pipe chip on film joint and structure thereof |
| 01/21/2009 | CN101349866A Positive type light sensitive imaging composition, preparation method and uses thereof |
| 01/21/2009 | CN101348634A Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof |
| 01/21/2009 | CN100455178C Electromagnetic wave noise suppressor, structural body with electromagnetic wave noise suppressing function, and process for producing them |
| 01/21/2009 | CN100455167C Printing-head electromagnet fixing method and device |
| 01/21/2009 | CN100455166C Positioning assembling device for contact pin tinning process and contact pin tinning method |
| 01/21/2009 | CN100455165C Method of realizing local crest welding and printed circuit board |
| 01/21/2009 | CN100455164C Milling and deburring method for PCB board |
| 01/21/2009 | CN100455163C Printed circuit board making method |
| 01/21/2009 | CN100455162C Method for making circuit board |