| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/29/2008 | CN101296568A Method for soft and hard compound circuit board exerting electromagnetic shielding and system for implementing the same |
| 10/29/2008 | CN101296567A Connector device, method of manufacturing the same, and battery pack using the same |
| 10/29/2008 | CN101296565A Electronic component and assembling method thereof |
| 10/29/2008 | CN101296561A Flexible printing patchboard and sliding lid type mobile phone terminal using the same |
| 10/29/2008 | CN101295811A Production method of electronic label radio frequency antenna |
| 10/29/2008 | CN101295701A Package for semiconductor devices |
| 10/29/2008 | CN101295700A Package for semiconductor devices |
| 10/29/2008 | CN101295580A Capacitor devices and its manufacturing method |
| 10/29/2008 | CN101295142A Printed circuit board and manufacturing method thereof |
| 10/29/2008 | CN101294294A Processing method for printed circuit board before plating |
| 10/29/2008 | CN101293299A Injecting-generating device for soldering fluid |
| 10/29/2008 | CN101293296A Tinfoil generating apparatus |
| 10/29/2008 | CN101293295A Tinfoil generating apparatus |
| 10/29/2008 | CN100429965C Printing circuit board with plate edged long and short contacts and its processing method |
| 10/29/2008 | CN100429964C Flexible printed circuit board and method for connecting printed circuit board thereof |
| 10/29/2008 | CN100429768C Vice mounting board and semiconductor apparatus using device mounting board |
| 10/29/2008 | CN100429767C Device mounting board |
| 10/29/2008 | CN100429563C Film forming method,distributing pattern forming method,semiconductor device mfg method |
| 10/28/2008 | US7443693 Electromagnetic interference shielding for a printed circuit board |
| 10/28/2008 | US7443647 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 10/28/2008 | US7443035 Method of forming a penetration electrode and substrate having a penetration electrode |
| 10/28/2008 | US7443010 Matrix form semiconductor package substrate having an electrode of serpentine shape |
| 10/28/2008 | US7442408 Forming suspension comprising liquid vehicle and particulate conductive material such that suspension is ink-jettable; jetting from ink-jet pen a predetermined pattern of suspension onto substrate; heating to provide conductive path |
| 10/28/2008 | US7441330 Process for producing circuit board |
| 10/28/2008 | US7441329 Fabrication process circuit board with embedded passive component |
| 10/28/2008 | CA2326347C Composition and method for producing polythioethers having pendent methyl chains |
| 10/23/2008 | WO2008127825A1 Method and apparatus for adjusting a substrate support |
| 10/23/2008 | WO2008127824A1 Method and apparatus for calibrating print head pressure and applying an accurate print pressure during production |
| 10/23/2008 | WO2008127365A2 Printed electronic device and methods of determining the electrical value thereof |
| 10/23/2008 | WO2008126661A1 Multilayer ceramic substrate and process for producing the same |
| 10/23/2008 | WO2008126526A1 Photosensitive resin composition and layered product |
| 10/23/2008 | WO2008126455A1 Photosensitive resin composition, photosensitive film, method for forming pattern by using the photosensitive film, and printed board |
| 10/23/2008 | WO2008126425A1 Patterning method and method for fabricating electronic element |
| 10/23/2008 | WO2008125373A1 Method for producing a conductive track structure on a metal base plate |
| 10/23/2008 | WO2008125372A1 Method for the production of a signal and potential distribution system for mechatronic modules |
| 10/23/2008 | WO2008125370A1 Module for an electronic controller having a simplified design |
| 10/23/2008 | WO2008125010A1 A method of manufacturing the high heat conductive circuit substrate |
| 10/23/2008 | WO2008125009A1 A high heat conductive circuit substrate |
| 10/23/2008 | US20080261350 Solder interconnection array with optimal mechanical integrity |
| 10/23/2008 | US20080261349 Protective coating for planarization |
| 10/23/2008 | US20080261338 Method For Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer |
| 10/23/2008 | US20080261071 Depositing a metal layer of nickel and phosphorus onto a metal surface, depositing the tin-based coating over the first metal; establishing a diffusion couple |
| 10/23/2008 | US20080259580 Method for mounting leaded component to substrate |
| 10/23/2008 | US20080259575 Tape-Style Flexible Circuit Board, and Manufacturing Method and Manufacturing Apparatus for the Same |
| 10/23/2008 | US20080259572 Mounting a Heat Sink in Thermal Contact with an Electronic Component |
| 10/23/2008 | US20080259106 Method for manufacturing patterned layer on substrate |
| 10/23/2008 | US20080258283 Wiring board and semiconductor package using the same |
| 10/23/2008 | US20080257967 IC card module |
| 10/23/2008 | US20080257752 Device and Method for Electrolytically Treating Flat Work Pieces |
| 10/23/2008 | US20080257597 Printed circuit board manufacturing method and printed circuit board |
| 10/23/2008 | US20080257596 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board |
| 10/23/2008 | US20080257595 Packaging substrate and method for manufacturing the same |
| 10/23/2008 | US20080257593 Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes |
| 10/23/2008 | US20080257591 Printed wiring board and a method of production thereof |
| 10/23/2008 | US20080257589 Method for the production of expandable circuit carrier and expandable circuit carrier |
| 10/23/2008 | US20080257586 Flexible circuit structure with stretchability and method of manufacturing the same |
| 10/23/2008 | US20080257585 Electrical Power Substrate |
| 10/23/2008 | US20080257480 Method for Manufacturing Multilayer Printed Wiring Board and Multilayer Printed Wiring Board Obtained by the Same |
| 10/23/2008 | US20080256792 Terminal Insertion Apparatus |
| 10/23/2008 | DE112006003305T5 Mit Fluorharz laminiertes Substrat Laminated with fluorine resin substrate |
| 10/23/2008 | DE102007017532A1 Verfahren zur Herstellung einer Leiterbahnstruktur auf einer metallischen Bodenplatte A method of fabricating a wiring pattern on a metallic base plate |
| 10/23/2008 | DE102007017486A1 Vorrichtung und Verfahren zum Bearbeiten von flächigen Substraten, wie zum Bedrucken von Leiterplatten oder dergleichen Apparatus and method for processing flat substrates, such as for printing on printed circuit boards or the like |
| 10/23/2008 | DE102007016904A1 Optoelectronic device e.g. vertical cavity surface emitting laser, has optoelectronic component with contact conductor, and solder film connection formed between connection surface and contact conductor in sectional manner |
| 10/22/2008 | EP1983811A2 Electrical Contact |
| 10/22/2008 | EP1983810A2 Method for mounting leaded component to substrate |
| 10/22/2008 | EP1983808A1 Method for manufacturing tape carrier for contact type IC card |
| 10/22/2008 | EP1983591A1 Composite films suitable for use in opto-electronic and electronic devices |
| 10/22/2008 | EP1983564A1 Contact-bonding device |
| 10/22/2008 | EP1982967A2 Freestanding reactive multilayer foils |
| 10/22/2008 | EP1982834A1 Extending tool of shee-like material |
| 10/22/2008 | EP1487888B1 Polymerisable composition |
| 10/22/2008 | EP1446993B1 I-channel surface-mount connector with extended flanges and method for interconnecting circuit boards |
| 10/22/2008 | CN201138892Y Fixing mold for precision machining circuit board |
| 10/22/2008 | CN101292577A Method for soldering smd components, printed circuit board and reflow soldering furnace therefor |
| 10/22/2008 | CN101292576A A component adapted for being mounted on a substrate and a method of mounting a surface mounted device |
| 10/22/2008 | CN101292393A Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element |
| 10/22/2008 | CN101292006A Adhesive composition, circuit connecting material, connection structure of circuit connenctors, and semiconductor devices |
| 10/22/2008 | CN101291808A Laminate and process for producing the same |
| 10/22/2008 | CN101291565A Printed wiring board |
| 10/22/2008 | CN101291564A Manufacturing process of resistor plate, obtained resistor plate and application thereof |
| 10/22/2008 | CN101291563A Method for manufacturing COB circuit board by pole array |
| 10/22/2008 | CN101291562A Capacitor and its manufacture method |
| 10/22/2008 | CN101290898A Mask manufacturing method of base board using the mask |
| 10/22/2008 | CN101290890A Circuit board with internally embedded conductive wire and manufacturing method therefor |
| 10/22/2008 | CN101290889A Wiring board manufacturing method, semiconductor device manufacturing method and wiring board |
| 10/22/2008 | CN101290471A Photoresist combination and laminating body |
| 10/22/2008 | CN101290219A Centralized management system for solder check line, management device thereof and centralized management method |
| 10/22/2008 | CN101288863A Conveyer belt of substrate material |
| 10/22/2008 | CN100428875C 基底保持器 Substrate holder |
| 10/22/2008 | CN100428873C Multilayer printed circuit board and method for manufacturing the same |
| 10/22/2008 | CN100428872C Mechanism for producing end edge guide angle of golden finger on circuit board |
| 10/22/2008 | CN100428871C Method for forming plain conductor pattern by means of ink-jet |
| 10/22/2008 | CN100428870C Six-layer printed circuit board laminated structure |
| 10/22/2008 | CN100428617C Temperature detection method of semiconductor device and power conversion apparatus |
| 10/22/2008 | CN100428368C Electro-conductive composition, electro-conductive coating and method for producing the coating |
| 10/22/2008 | CN100428274C Method for production of a card with a double interface and microcircuit card obtained thus |
| 10/22/2008 | CN100428245C Process for designing high frequency circuits in multiple domains |
| 10/21/2008 | US7441219 Method for creating, modifying, and simulating electrical circuits over the internet |
| 10/21/2008 | US7440606 Defect detector and defect detection method |
| 10/21/2008 | US7440256 Laminated ceramic substrate and manufacturing method therefor |