Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2009
02/26/2009DE102007039612A1 Verfahren zum Bestücken von mit Anschlussstiften versehenen elektrischen Bauelementen auf einer Leiterplatte Method of fitting pins provided with electrical components on a circuit board
02/26/2009DE102007037636A1 Predetermined pattern e.g. circuit, manufacturing method for printed circuit board, involves forming insulating substrate of circuit board, and etching substrate by laser beam for formation of pattern in accordance with design of pattern
02/26/2009DE102006026446B4 Deckel für eine Stellvorrichtung mit einem Stanzgitter als Scharnier Cover for an adjusting device with a lead frame as a hinge
02/26/2009DE10126734B4 Umverdrahtungsverfahren und damit hergestelltes Bauelement Umverdrahtungsverfahren and thus component produced
02/25/2009EP2028915A1 Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device
02/25/2009EP2028691A2 Sacrificial structures for crack propagation confinement in a substrate comprising a plurality of ICs
02/25/2009EP2028688A1 Ceramic compact, ceramic part, method for porducing ceramic compact, and method for producing ceramicpart
02/25/2009EP2028664A1 Laminated ceramic electronic component
02/25/2009EP2027760A2 Interconnection arrangement and method for interconnecting a high-cuurent carrying cable with a metal thin-film
02/25/2009EP2027759A1 Device for soldering in the vapour phase
02/25/2009EP2026975A2 Liquid composition for deposition of organic active materials in the field of oled printing
02/25/2009CN201199754Y Thimble apparatus
02/25/2009CN201199753Y Defoaming apparatus
02/25/2009CN201198200Y Liner plate for laminating copper-clad plate
02/25/2009CN101375649A Method for electroconductive circuit formation
02/25/2009CN101375648A Boring method and boring device
02/25/2009CN101375645A Substrate structure and electronic device
02/25/2009CN101374630A Solder alloy, solder ball and solder joint using same
02/25/2009CN101374391A Multilayer wiring board
02/25/2009CN101374390A Aeroscopic plate for filling circuit board conducting resin and method for filling conducting resin
02/25/2009CN101374389A Method for preparing circuit board guide hole
02/25/2009CN101374388A Method for preparing fine line flexible circuit board with high peeling strength
02/25/2009CN101374387A Method for welding electronic element on circuit board
02/25/2009CN101374386A Method for preparing printed circuit board
02/25/2009CN101374385A Automatic panel-establishing method and apparatus
02/25/2009CN101374384A Method for cutting adhesive membrane of circuit board
02/25/2009CN101374382A Multi-layer circuit board with spatial transformation
02/25/2009CN101373746A Mounting structure of electronic component
02/25/2009CN101373718A Ball-establishing method for package substrate
02/25/2009CN101372755A Top clamp type side shielding apparatus for electroplating printed circuit board
02/25/2009CN100464618C Wiring substrate and manufacturing process of the same
02/25/2009CN100464617C Connection structure of electric conductive wirings and connection method
02/25/2009CN100463772C Closed loop backdrilling system
02/24/2009US7495928 Semiconductor device and printed circuit board
02/24/2009US7495866 Recording disk drive capable of suppressing vibration of flexible printed circuit board
02/24/2009US7495348 Process for producing copy protection for an electronic circuit
02/24/2009US7495344 Semiconductor apparatus
02/24/2009US7495334 Stacking system and method
02/24/2009US7495332 Multilayer printed wiring board
02/24/2009US7495318 Apparatus and method for improving AC coupling on circuit boards
02/24/2009US7495179 Components with posts and pads
02/24/2009US7495177 Printed wiring board, its manufacturing method, and circuit device
02/24/2009US7494923 Manufacturing method of wiring substrate and semiconductor device
02/24/2009US7494041 In-situ alloyed solders, articles made thereby, and processes of making same
02/24/2009US7493690 Method of attaching electronic components to printed circuit board and attachment structure thereof
02/19/2009WO2009023238A1 High-speed router with backplane using multi-diameter drilled thru-holes and vias
02/19/2009WO2009022724A1 Photosensitive resin composition and laminate thereof
02/19/2009WO2009022522A1 Wiring board and liquid crystal display device
02/19/2009WO2009022517A1 Wiring board and liquid crystal display device
02/19/2009WO2009022438A1 Electrode and method for manufacturing the same, lead wiring using the electrode and method for connecting the same, and related electronic components and electronic equipment
02/19/2009WO2009022437A1 Wiring and method for manufacturing the same and electronic components and related electronic equipment
02/19/2009WO2009022436A1 Conductive paste and method for manufacturing the same, wiring using the conductive paste and method for manufacturing the same
02/19/2009WO2009021786A1 Electric circuit configuration and method for producing an electric circuit configuration
02/19/2009WO2008156200A3 Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires
02/19/2009US20090047803 Method of producing a straddle mount connector and the resulting product thereof
02/19/2009US20090047421 Method for plating flexible printed circuit board
02/19/2009US20090046440 Methods and systems for filtering signals
02/19/2009US20090046436 Micro-electro-mechanical-system package and method for manufacturing the same
02/19/2009US20090046432 Packaging substrate structure with electronic components embedded therein and method for manufacturing the same
02/19/2009US20090046391 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit
02/19/2009US20090046127 Inkjet Printhead With High Nozzle Area Density
02/19/2009US20090044972 Circuit board, method of forming wiring pattern, and method of manufacturing circuit board
02/19/2009US20090044970 Methods for fabricating current-carrying structures using voltage switchable dielectric materials
02/19/2009US20090044968 Flexible printed circuit board
02/19/2009US20090044405 Interposer with Electrical Contact Button and Method
02/19/2009US20090044403 System and method for improving power distribution current measurement on printed circuit boards
02/19/2009DE112007000870T5 Verfahren zur Herstellung einer Siebdruckmaske mit Harz und Siebdruckmaske mit Harz A process for producing a screen printing mask with resin and screen printing mask with resin
02/19/2009DE102008035929A1 Mobiles Gerät sowie Verfahren zu dessen Herstellung Mobile device and process for its preparation
02/19/2009DE102007038277A1 Electronic data processing personal computer e.g. laptop, has central mother board injection-molded with glass-reinforced plates, and provided with protective film and welded integrated silver oxide conductor feed paths
02/19/2009DE102007036566A1 Federkontaktierung von elektrischen Kontaktflächen eines elektronischen Bauteils Spring contact of the electrical contact areas of an electronic component
02/18/2009EP2026642A1 Multilayer ceramic substrate, method for producing the same and electronic component
02/18/2009EP2025778A2 A Copper Plating Process
02/18/2009EP2025211A1 A process for preparing a heatsink system and heatsink system obtainable by said process
02/18/2009EP2025210A1 Circuit carrier
02/18/2009EP2024281A1 Potassium monopersulfate solutions
02/18/2009EP1448745B1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
02/18/2009CN201197223Y Fixture equipment for circuit board
02/18/2009CN201197222Y Electronic device with modeling circuit board
02/18/2009CN201196722Y Portable equipment, labeling type camera shooting module group
02/18/2009CN201195221Y Internal memory slot soldering fixture
02/18/2009CN101371624A Conductive paste, multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate
02/18/2009CN101371355A Interposer and electronic device using the same
02/18/2009CN101371352A Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
02/18/2009CN101371346A Pressure bonding device and mounting method
02/18/2009CN101371197A Photosensitive dry film resist, printed wiring board making use of the same, and process for producing printed wiring board
02/18/2009CN101370887A Adhesive tape
02/18/2009CN101370837A Active energy ray-curable resin composition and use thereof
02/18/2009CN101370659A Multilayer imageable element containing sulfonamido resin
02/18/2009CN101370628A Method for representing release forces
02/18/2009CN101370617A Drilling device
02/18/2009CN101370615A Water-dispersed flux composition, electronic circuit board with electronic component, and their production methods
02/18/2009CN101370375A Positioning device
02/18/2009CN101370361A Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
02/18/2009CN101370360A Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
02/18/2009CN101370359A Solder repairing device and method
02/18/2009CN101370358A Circuit board, method for forming wiring pattern and method for manufacturing circuit board
02/18/2009CN101370357A Guiding plate and extraction apparatus of circuit board, and production method of circuit board
02/18/2009CN101370356A Circuit board and its manufacturing method
02/18/2009CN101370355A Module, circuit board assembly, communication equipment and module assembly method
02/18/2009CN101370354A Capacitor-embedded printed circuit board and manufacturing method thereof