Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2008
10/21/2008US7439625 Circuit board
10/21/2008US7439614 Circuit device with dummy elements
10/21/2008US7439452 Multi-chip module packaging with thermal expansion coefficiencies
10/21/2008US7439451 Tape carrier
10/21/2008US7439450 Plating buss and a method of use thereof
10/21/2008US7439285 to enable printing of high performance thermosetting compound by ink-jet onto printed circuit boards, without scarifying the requirements from the cured layer; comprises solid latent curing agent characterized by a maximal particle size of less than 2 microns and an epoxy-based resin
10/21/2008US7438969 Filling material, multilayer wiring board, and process of producing multilayer wiring board
10/21/2008US7438950 Forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide is generated in a pattern shape; imparting electroless plating catalyst or a precursor thereof and electroless plating so as to form a metallic film in the pattern shape
10/21/2008US7438945 Reduces residual resin at the bottom of a via hole, and prevents broadening of the via hole when removing the residual resin; residual resin member can be removed in a shorter time than in the related art; printed circuit boards
10/21/2008US7438593 Component for a printed circuit board and method for fitting a printed circuit board with this component
10/21/2008US7437818 Component mounting method
10/21/2008US7437813 Probe repair methods
10/16/2008WO2008124424A1 Non-planar circuit board and a method for fabricating the same
10/16/2008WO2008124130A1 Method to form a pattern of functional material on a substrate using a mask material
10/16/2008WO2008123764A2 Pre-stamped matrix metal substrate with matrix electrical testing capability
10/16/2008WO2008123437A1 Conductive film and method for producing the same
10/16/2008WO2008123414A1 Connection structure for flip-chip semiconductor package, buildup layer material, sealing resin composition and circuit board
10/16/2008WO2008123248A1 Base-equipped insulating sheet, multi-layer printed circuit board, semiconductor device, and multi-layer printed circuit board manufacturing method
10/16/2008WO2008123087A1 Anisotropic conductive paste
10/16/2008WO2008123049A1 Method for film formation, resin composition for use in the method, structure having insulating film, process for producing the structure, and electronic component
10/16/2008WO2008123036A1 Metal-clad laminate, and method for production of metal-clad laminate
10/16/2008WO2008122427A2 Use of silane compositions for the production of mutilayer laminates
10/16/2008US20080256293 Carrier for manufacturing a memory device, method using the same, memory device using the same and manufacturing method of a memory device using the same
10/16/2008US20080254651 Spring interconnect structures
10/16/2008US20080254650 Light-emitting diode and method for producing it
10/16/2008US20080254649 Thermal management of leds on a printed circuit board and associated methods
10/16/2008US20080254648 System for Detachably Connecting a Large Number of Signal Lines of Two Components
10/16/2008US20080254611 Interconnection designs and materials having improved strength and fatigue life
10/16/2008US20080254313 Laminate containing electroconductive metal pattern on a polyphenylene ether ketone resin substrate
10/16/2008US20080254300 High heat resistance; low thermal expansion; noncracking ; fireproofing; blend of cyanate resin, epoxy resin, phenoxy resin with imidazole compound and filler; halogen-free
10/16/2008US20080253140 Light for vehicles
10/16/2008US20080253102 Electronic devices for surface mount
10/16/2008US20080253059 Land grid feedthrough low esl technology
10/16/2008US20080253054 Multi-Functional Energy Conditioner
10/16/2008US20080252694 Ink jet printhead with glass nozzle chambers
10/16/2008US20080252691 Inkjet nozzle chamber holding two fluids
10/16/2008US20080251947 Cof flexible printed wiring board and semiconductor device
10/16/2008US20080251946 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
10/16/2008US20080251942 Semiconductor Device and Manufacturing Method Thereof
10/16/2008US20080251893 Mounting clips for use with electromagnetic interference shielding and methods of using the same
10/16/2008US20080251496 Optoelectric composite substrate and method of manufacturing the same
10/16/2008US20080251385 Electrolytic treatment such as plating or etching; providing high resistance structure having electrical conductivity lower than that of electrolytic solution in solution filled between substrate in contact with an electrode; filling metal such as copper in fine interconnect patterns in semiconductor
10/16/2008US20080251287 Substrate and method for manufacturing the same
10/16/2008US20080251286 Method For Increasing a Routing Density For a Circuit Board and Such a Circuit Board
10/16/2008US20080251279 Wiring board and method of manufacturing the same
10/16/2008US20080251278 Recycling Printed Circuit Boards
10/16/2008US20080251199 Thermally and Electrically Conductive Interface
10/16/2008US20080250636 Component Mounting Method and Apparatus
10/16/2008US20080250635 Component placement machine
10/16/2008US20080250634 Multi-layer board manufacturing method thereof
10/16/2008US20080250633 Method for Building a Device Having Fluidic and Electrical Functions
10/16/2008DE202008010859U1 Vorrichtung zum Löten von Werkstücken Apparatus for soldering of workpieces
10/16/2008DE19702515B4 Nockenmechanismus für ein teleskopartig bewegbares Objektiv Cam mechanism for a telescopically movable lens
10/16/2008DE102007017531A1 Verfahren zur Herstellung eines Signal- und Potentialverteilungssystems für mechatronische Module A process for producing a signal and potential distribution system for mechatronic module
10/16/2008DE102007002769B4 Anschlussklemmleiste Terminal strip
10/16/2008DE102004013056B4 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
10/15/2008EP1981321A2 Circuitized substrate assembly with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same
10/15/2008EP1981320A1 Conductive paste, multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate
10/15/2008EP1981319A1 Process for producing metallized ceramic substrate, metallized ceramic substrate produced by the process, and package
10/15/2008EP1981317A2 Multilayer printed wiring board and manufacturing method thereof
10/15/2008EP1981046A1 Method for regulating capacitance value of built-in capacitor in multilayered ceramic substrate, and multilayered ceramic substrate and process for producing the same
10/15/2008EP1980886A2 Optical communication device, and optical communication device manufacturing method
10/15/2008EP1980143A1 Printed circuit board with additional functional elements, method of production and use
10/15/2008EP1979141A1 Method for representing release forces
10/15/2008EP1623057B1 Device for treating objects, in particular for plating printed circuit boards
10/15/2008EP1495153B1 Method for coating metal surfaces
10/15/2008EP1278631B1 Method of making reactive multilayer foil and resulting product
10/15/2008CN201135013Y Clamp component for PCB
10/15/2008CN201134981Y Tin cream printed platform of minimized single-chip flexible printed circuit board
10/15/2008CN201134980Y Liquefied clamp for circuit board
10/15/2008CN201134977Y Circuit board
10/15/2008CN101288351A Printed wiring board and method for manufacturing printed wiring board
10/15/2008CN101288350A Multilayered printed circuit board and method for manufacturing the same
10/15/2008CN101288349A Process for producing multilayer wiring board
10/15/2008CN101288168A 印刷线路板 Printed circuit boards
10/15/2008CN101288152A Bonding apparatus
10/15/2008CN101287361A Back-up table for chip mounter
10/15/2008CN101287340A Manufacture process for substrate of internally embedded element
10/15/2008CN101287339A Method for manufacturing circuit board with differential break structure
10/15/2008CN101287338A Manufacturing method of conductive blind hole on circuit substrate
10/15/2008CN101287337A Circuit board protecting method and used protection solution
10/15/2008CN101287336A Incline conveyer
10/15/2008CN101287335A Highly heat conductive circuit base board
10/15/2008CN101287334A Manufacturing method of highly heat conductive circuit base board
10/15/2008CN101287333A Common circuit for chips and wiring method for the common circuit
10/15/2008CN101287332A Circuit board and method of processing the same
10/15/2008CN101287328A Flexible circuit board, processing method of said flexible circuit board and electronic device
10/15/2008CN101286593A Supersonic soldering aluminum coil and its production method
10/15/2008CN101286588A Antenna module of global position system and manufacturing method therefor
10/15/2008CN101286490A Substrate surface processing structure and method for production thereof
10/15/2008CN101286457A Wiring board and method of manufacturing the same
10/15/2008CN101286456A Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
10/15/2008CN101286454A Printed circuit board and producing method of encapsulation base of integrated circuit
10/15/2008CN101286411A Coil unit, method of manufacturing the same, and electronic instrument
10/15/2008CN101284351A Printed circuit board contour processing method
10/15/2008CN100426942C Method for making circuit substrate
10/15/2008CN100426592C Component for a printed circuit board and method for fitting a printed circuit board with this component
10/15/2008CN100426590C Electronic part and surface treatment method of the same
10/15/2008CN100426492C Direct build-up layer on encapsulated die package
10/15/2008CN100426491C Package substrate
1 ... 328 329 330 331 332 333 334 335 336 337 338 339 340 341 342 343 344 345 346 347 348 ... 1185