| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 11/12/2008 | CN100432743C Optical scanner control method, optical scanner and laser machining apparatus |
| 11/12/2008 | CN100432726C Opto-electronic module comprising flexible electric connection cable and method of making the same |
| 11/12/2008 | CN100432622C Printing solder detecting device |
| 11/12/2008 | CN100432130C Epoxy resin compositions containing phosphorus and its uses |
| 11/12/2008 | CN100431487C Processing method of three-dimensional implantable microelectrode array |
| 11/11/2008 | US7450191 Method and apparatus for fabricating flat panel display |
| 11/11/2008 | US7449910 Test system for semiconductor components having conductive spring contacts |
| 11/11/2008 | US7449791 Printed circuit boards and method of producing the same |
| 11/11/2008 | US7449781 Printed wiring board |
| 11/11/2008 | US7449412 Interconnect circuitry, multichip module, and methods of manufacturing thereof |
| 11/11/2008 | US7449405 Method for producing bumps on an electrical component |
| 11/11/2008 | US7449396 Wafer dividing method |
| 11/11/2008 | US7449364 Device and method for including passive components in a chip scale package |
| 11/11/2008 | US7449286 Method of forming conductive tracks |
| 11/11/2008 | US7449089 Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 11/11/2008 | US7449067 Method and apparatus for filling vias |
| 11/11/2008 | US7448909 Preferential via exit structures with triad configuration for printed circuit boards |
| 11/11/2008 | US7448728 Nozzle assembly having a sprung electromagnetically operated plunger |
| 11/11/2008 | US7448132 Method of fabricating a high-layer-count backplane |
| 11/11/2008 | US7448126 Coupler resource module |
| 11/06/2008 | WO2008133612A1 Electrically conductive composition for via-holes |
| 11/06/2008 | WO2008133369A1 The manufacturing method of the thin film ceramic multi layer substrate |
| 11/06/2008 | WO2008133261A1 Bump structure and method for manufacturing the same |
| 11/06/2008 | WO2008133246A1 Epoxy resin composition, resin film, prepreg, and multilayer printed circuit board |
| 11/06/2008 | WO2008133213A1 Method for production of laminated dielectric material |
| 11/06/2008 | WO2008133186A1 Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure |
| 11/06/2008 | WO2008133010A1 Filter circuit element and electronic circuit device |
| 11/06/2008 | WO2008132960A1 Novel polyimide precursor composition and use thereof |
| 11/06/2008 | WO2008132913A1 Multilayered ceramic substrate, process for producing the multilayered ceramic substrate, and electronic component |
| 11/06/2008 | WO2008132843A1 Photosensitive resin composition, dry film, and processed work made with the same |
| 11/06/2008 | WO2008132842A1 Photosensitive resin composition, dry film, and processed product using the dry film |
| 11/06/2008 | WO2008132832A1 Conductive paste composition for via hole filling, printed board using the same, and method for manufacturing the printed board |
| 11/06/2008 | WO2008132814A1 Substrate with built-in component, electronic module using the same and electronic device |
| 11/06/2008 | WO2008132055A1 Chip resistor substrat |
| 11/06/2008 | US20080275181 Having siloxane functionality; continuous printing properties; low temperature dryability; printed circuit board protective films; dimensional stability, flexibility, adhesiveness; heat and chemical resistance |
| 11/06/2008 | US20080274654 Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity |
| 11/06/2008 | US20080273311 Enhanced Localized Distributive Capacitance for Circuit Boards |
| 11/06/2008 | US20080273157 Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
| 11/06/2008 | US20080273156 Display device and manufacturing method therefor |
| 11/06/2008 | US20080273058 Ink Ejection Nozzle Arrangement for an Inkjet Printer |
| 11/06/2008 | US20080272983 Method for Producing a Non-Developable Surface Printed Circuit and the Thus Obtained Printed Circuit |
| 11/06/2008 | US20080272879 Chip resistor and manufacturing method therefor |
| 11/06/2008 | US20080272737 Wireless chargeable energy cell |
| 11/06/2008 | US20080272388 Method for fabricating thin film pattern, device and fabricating method therefor, method for fabricating liquid crystal display, liquid crystal display, method for fabricating active matrix substrate, electro-optical apparatus, and electrical apparatus |
| 11/06/2008 | US20080272181 Method for making nanostructured soldered or brazed joints with reactive multilayer foils |
| 11/06/2008 | US20080271915 Method for making a circuit board and multi-layer substrate with plated through holes |
| 11/06/2008 | US20080271314 Enhanced-reliability printed circuit board for tight-pitch components |
| 11/06/2008 | US20080271313 Method, system, and apparatus for transfer of dies using a die plate |
| 11/06/2008 | US20080271300 Method of manufacturing orientation film and method of manufacturing liquid discharge head |
| 11/06/2008 | DE202008011595U1 Vorrichtung zur thermischen Behandlung von Werkstücken Device for thermal treatment of workpieces |
| 11/06/2008 | DE102008018252A1 Verfahren zur Wiederverwertung einer Mikrobohranordnung vom Eingriffstyp A process for recycling a Mikrobohranordnung interference type |
| 11/06/2008 | DE102007028723B3 Method for inspection of printed circuit board, involves testing reference image of proper printed circuit board and test image of printed circuit board, and reference printed circuit board and memory of image are digitally scanned |
| 11/06/2008 | DE102007020475A1 Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung A process for producing a circuit board having a cavity for the integration of components and printed circuit board and application |
| 11/06/2008 | DE102007019073A1 Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate Method and apparatus for applying media to flat substrates |
| 11/05/2008 | EP1988759A1 Connection portion of circuit board and connection structure of circuit board |
| 11/05/2008 | EP1988758A1 Printed wiring board and process for producing the same |
| 11/05/2008 | EP1988570A1 Mounting method |
| 11/05/2008 | EP1988191A1 Plating apparatus and method of plating |
| 11/05/2008 | EP1987708A1 Method for encapsulating electrical and/or electronic components in a housing |
| 11/05/2008 | EP1987707A2 Method for producing a layer on a moulding and use thereof |
| 11/05/2008 | EP1579204B1 Manufacture of electrochemical sensors by moveable flat screen printing |
| 11/05/2008 | EP1550176B1 Electronic circuitry provided with an integrated antenna |
| 11/05/2008 | EP1395633B1 Method for producing thin homogeneous layers with the help of screen printing technology |
| 11/05/2008 | EP1357597B1 Voltage converter module |
| 11/05/2008 | EP1073781B2 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances |
| 11/05/2008 | CN201146636Y Geometry flow staticizer for wave top tin-soldering stove |
| 11/05/2008 | CN201146635Y Rack for mounting heating pipe of receding welding machine |
| 11/05/2008 | CN201146634Y Minitype desk type receding welding machine |
| 11/05/2008 | CN201146633Y Knife model frame apparatus for flexible circuit board |
| 11/05/2008 | CN201146632Y Anti-temp-changing apparatus for preventing nitrogen gas from leaking outside |
| 11/05/2008 | CN201146630Y Electron carrier plate and pad-soldering structure |
| 11/05/2008 | CN201144090Y Permanent magnetic transmission conveying device |
| 11/05/2008 | CN101300912A Method for fabricating multilayer circuit plate, circuit plate, and method for fabricating the circuit plate |
| 11/05/2008 | CN101300911A Circuit module and method for manufacturing circuit module |
| 11/05/2008 | CN101300910A Method and device for laser cutting at an acute angle of carriers for electronic components |
| 11/05/2008 | CN101300909A A device for the high-speed drilling of boards for printed circuits and the like |
| 11/05/2008 | CN101300908A A device for the high-speed drilling of boards for printed circuits and the like |
| 11/05/2008 | CN101300375A Method for forming metal film and method for forming metal pattern |
| 11/05/2008 | CN101300284A Epoxy resin composition, method for forming conductive film, method for forming conductive pattern and method for manufacturing multilayered wiring board |
| 11/05/2008 | CN101300154A Electronic module and method for sealing an electronic module |
| 11/05/2008 | CN101300139A Multilayer imageable element with improved chemical resistance |
| 11/05/2008 | CN101300134A Laminate for printed wiring board, printed wiring board using same, method for manufacturing printed wiring board, electrical component, electronic component, and electrical device |
| 11/05/2008 | CN101299911A Method for making a multilayered circuitized substrate |
| 11/05/2008 | CN101299910A Apparatus and method for coating of a plastic substrate |
| 11/05/2008 | CN101299909A Method for preparing multi-sheet printed circuit board |
| 11/05/2008 | CN101299908A Method for manufacturing printed circuit board having embedded component |
| 11/05/2008 | CN101299906A Electronic component module and electronic device using the same |
| 11/05/2008 | CN101299905A Circuit board and manufacturing method thereof |
| 11/05/2008 | CN101299904A Electromagnetic bandgap structure and printed circuit board |
| 11/05/2008 | CN101299903A Electromagnetic bandgap structure and printed circuit board |
| 11/05/2008 | CN101299902A Circuit structure of circuit board and circuit technique thereof |
| 11/05/2008 | CN101299413A Process for manufacturing circuit board |
| 11/05/2008 | CN100431397C Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board |
| 11/05/2008 | CN100431396C Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby |
| 11/05/2008 | CN100431395C Method of making substrate for flexible circuit board |
| 11/05/2008 | CN100431394C Substrate with composite medium and multilayer substrate made by the same |
| 11/05/2008 | CN100431175C Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module |
| 11/05/2008 | CN100431144C Package substrate |
| 11/05/2008 | CN100431142C Semiconductor device and its manufacturing method |
| 11/05/2008 | CN100431122C Method for producing connection member |