Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2008
10/15/2008CN100426477C Method for manufacturing carrying-plate for packaging flat plastic-sealed ball grid array and its carrying plate
10/15/2008CN100426455C Pattern forming method and device and semiconductor device, electric circuit, display element module and luminous element
10/15/2008CN100426381C An improved electrical connection between a suspension flexure cable and a head stack flexure circuit
10/15/2008CN100426093C Liquid crystal display device
10/15/2008CN100426068C LCD device having external terminals
10/15/2008CN100425982C Semiconductor sensor having a front-side contact zone
10/15/2008CN100425782C Faade covering
10/15/2008CN100425428C Heat resistant buffer part for molding machine
10/14/2008US7437038 Z-axis alignment of an optoelectronic component using a spacer tool
10/14/2008US7437030 Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard
10/14/2008US7436467 Display device with grounding protrusion
10/14/2008US7436267 Microstrip line dielectric overlay
10/14/2008US7436002 Surface-mountable radiation-emitting component
10/14/2008US7435711 Being lead-free or high melting, with a mixture of benzyl alcohol, a glycol, and an amino alcohol such as diethanolamine, and then rinsing with ethanol; electronics
10/14/2008US7435535 Method for forming patterned insulating elements and methods for making electron source and image display device
10/14/2008US7435352 Method of forming solder resist pattern
10/14/2008US7435143 Fixture for optoelectronic components such as PLCC2-type and PLCC4-type light emitting diodes
10/14/2008US7434912 Ultrafine fluid jet apparatus
10/14/2008US7434512 Printing in a medium
10/14/2008US7434310 Process to reform a plastic packaged integrated circuit die
10/14/2008US7434309 Method and apparatus for supporting a circuit component having solder column interconnects using an external support
10/14/2008US7434308 Cooling of substrate using interposer channels
10/14/2008CA2354720C Hole filling method for a printed wiring board
10/09/2008WO2008122005A2 Fine pitch electrical interconnect assembly
10/09/2008WO2008120755A1 Circuit board incorporating functional element, method for manufacturing the circuit board, and electronic device
10/09/2008WO2008120564A1 Mounting structure of electronic component and method for mounting electronic component
10/09/2008WO2008120526A1 Reflow device
10/09/2008WO2008120491A1 Photocurable resin composition, dry film, cured product, and printed wiring board
10/09/2008WO2008120481A1 Multilayered circuit board and semiconductor device
10/09/2008WO2008120299A1 Manufacturing device and manufacturing method for electronic device
10/09/2008WO2008120147A1 Textile for connection of electronic devices and manufacturing method therefore
10/09/2008WO2007140495A3 Method for manufacturing a circuit carrier
10/09/2008WO2005015477A3 Circuit forming system and method
10/09/2008US20080248659 Electrical connector with complementary conductive elements
10/09/2008US20080248326 Includes metal plate, ceramic base plate joined to the metal plate, and a release agent; used in semiconductor device for controlling high current and high voltage of for example, an electric automobile or an electric rolling stock
10/09/2008US20080248266 Method of manufacturing laminated material for security tag
10/09/2008US20080247580 Hearing Aid Using Printed Circuit Board
10/09/2008US20080247145 Integrated circuit carrier arrangement with electrical connection islands
10/09/2008US20080247144 Integrated circuit carrier assembly
10/09/2008US20080247139 Electrical circuit assembly for high-power electronics
10/09/2008US20080247115 Variable device circuit and method for manufacturing the same
10/09/2008US20080246558 Miniature RF and Microwave Components and Methods for Fabricating Such Components
10/09/2008US20080245768 Solidifying the printed etch-resist ink carrier vehicle including one or more preferably two metal chelating compounds by cooling and then removing the exposed metal or alloy by chemical etching; the ink has a viscosity of not greater than 30 cPs (mPa*s) at the firing temperature
10/09/2008US20080245765 Electrical contacts
10/09/2008US20080245554 Fabrication method and structure of pcb assembly, and tool for assembly thereof
10/09/2008US20080245553 Interconnection, electronic device and method for manufacturing an electronic device
10/09/2008US20080245552 Printed wiring board with enhanced structural integrity
10/09/2008US20080245551 Circuit board structure for embedding semiconductor chip therein and method for fabricating the same
10/09/2008US20080245472 Aligning device, bonding apparatus, and aligning method
10/09/2008US20080244902 Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same
10/09/2008US20080244901 Manufacturing method of tape carrier for tab
10/09/2008US20080244900 Form better solder connection without insulation degradation; lead-free solder; electronic
10/09/2008US20080244899 Component-Mounting Apparatus and Component-Positioning Unit
10/09/2008DE10354694C5 Induktiver Sensor Inductive sensor
10/09/2008DE102007015819A1 Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe A process for preparing an electronic assembly and electronic assembly
10/09/2008DE102007015524A1 Verfahren zum Herstellen eines induktiven Bedämpfungselements und induktives Wirbelstrombetätigungselement A method of manufacturing an inductive attenuating and inductive eddy current actuator
10/08/2008EP1978797A2 Multilayer printed wiring board and method for producing the same
10/08/2008EP1978796A2 Multilayer printed wiring board and method for producing the same
10/08/2008EP1978795A1 Method of manufacturing printed wiring board
10/08/2008EP1978794A1 Method and apparatus for mounting solder ball
10/08/2008EP1978793A1 Component for a printed circuit
10/08/2008EP1978792A1 Substrate structure and electronic device
10/08/2008EP1978791A2 Antenna device for vehicles
10/08/2008EP1978601A1 Board-to-board connector
10/08/2008EP1978556A1 Printed-circuit board, and method for manufacturing the same
10/08/2008EP1978473A2 Manufacturing method for a wireless communication device and manufacturing apparatus
10/08/2008EP1978134A1 Metal plating compositions
10/08/2008EP1977633A2 Substrates for electronic circuitry type applications
10/08/2008EP1757176B1 Screen printing apparatus and screen printing method
10/08/2008EP1350287B1 Method and device for connecting conductors
10/08/2008CN201131084Y Receding aperture plate in cooling module of reflow welding stove
10/08/2008CN201131083Y Circuit board moistureproof anti-dust device having components
10/08/2008CN201130283Y Liquid-gas separation structure for moisture manufacture process equipment upper exhaustion
10/08/2008CN201130282Y Moisture manufacture process equipment fluid guidance mechanism
10/08/2008CN101283632A Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
10/08/2008CN101283631A Method for manufacturing printed wiring board
10/08/2008CN101283312A Digital exposure apparatus
10/08/2008CN101283116A Catalyst treatment method, electroless plating method, and method for formation of circuit by using the electroless plating method
10/08/2008CN101283061A Uv curable hybridcuring ink jet ink composition and solder mask using the same
10/08/2008CN101282841A Screen printing apparatus and screen printing method
10/08/2008CN101282636A Substrate operating system
10/08/2008CN101282622A Circuit board and method for manufacturing the same
10/08/2008CN101282621A Technique for processing PCB gold finger
10/08/2008CN101282620A Wiring board and method of manufacturing the same
10/08/2008CN101282619A Method for producing circuit board with double enter plates
10/08/2008CN101282618A Welding connection structure of terminal of electronic device and printed circuit board
10/08/2008CN101282617A Flexible printed circuit board of complete winding non-intermittence circuit as well as manufacturing technique
10/08/2008CN101282616A Method for preparing location hole of flexible circuit board
10/08/2008CN101282615A Recess formation method, recess formation device, and formation material for recess
10/08/2008CN101281881A Method for forming layer-across connecting structure
10/08/2008CN101281872A Wiring substrate and wiring substrate manufacturing method
10/08/2008CN101281368A Black solder resist compound and cured product thereof
10/08/2008CN101281367A Solder resist compound and cured product thereof
10/08/2008CN101280426A Method for manufacturing substrate and copper surface treatment agent therefor
10/08/2008CN101279533A Printing system, printing method and method for printing thin-film transistor and RLC circuit
10/08/2008CN100424866C Tape circuit substrate and semiconductor chip package using the same
10/08/2008CN100424844C Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same
10/08/2008CN100424226C Method for electroless metalisation of polymer substrate
10/08/2008CN100424110C Resin composition for printed wiring board, prepreg, and laminate obtained with the same
10/08/2008CN100423915C Raw porcelain plate opening die
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