| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/10/2008 | CN100442949C Circuit component mounting device |
| 12/10/2008 | CN100442564C Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
| 12/10/2008 | CN100442502C Semiconductor, electronic device and their producing method and electronic instrument |
| 12/10/2008 | CN100442481C Semiconductor device and its mfg. method |
| 12/10/2008 | CN100442467C A processing technique for moisture-proof insulation of preamplifier |
| 12/10/2008 | CN100442404C Electronic component and manufacturing method of electronic component |
| 12/10/2008 | CN100441317C Viscous material noncontact jetting system |
| 12/09/2008 | US7463831 Transponder assembly for use with parallel optics modules in fiber optic communications systems |
| 12/09/2008 | US7463491 Wiring board and a semiconductor device using the same |
| 12/09/2008 | US7463154 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| 12/09/2008 | US7463122 Compact via transmission line for printed circuit board and its designing method |
| 12/09/2008 | US7462802 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| 12/09/2008 | US7462801 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| 12/09/2008 | US7462653 Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof |
| 12/09/2008 | US7462301 Excellent dispersibility and capable of forming a paste which do not form suspended matters by phase separation and which is printed on a substrate to form film having a uniform thickness; for a conductive paste for use in electronic parts, such as internal electrodes of multilayer capacitors |
| 12/09/2008 | US7461449 Apparatus for reclamation of precious metals from circuit board scrap |
| 12/04/2008 | WO2008146908A1 Insulating resin composition |
| 12/04/2008 | WO2008146884A1 Method for plating wiring board, and wiring board |
| 12/04/2008 | WO2008146815A1 Heating furnace |
| 12/04/2008 | WO2008146793A1 Electric device, connecting method and adhesive film |
| 12/04/2008 | WO2008146688A1 Method for producing adhesive, method for connecting electronic component and bonded body |
| 12/04/2008 | WO2008146611A1 Ink-receiving base and method for forming conductive pattern by using the same |
| 12/04/2008 | WO2008146538A1 Composite multilayer wiring board |
| 12/04/2008 | WO2008146487A1 Circuit board and method for manufacturing the same |
| 12/04/2008 | WO2008146356A1 Automatic wiring device, automatic wiring method, automatic wiring program, and computer-readable recording medium containing the program |
| 12/04/2008 | WO2008146047A2 Improvements relating to direct write and additive manufacturing processes |
| 12/04/2008 | WO2008145930A2 Method for assembling a member of a holder by sintering a conducting powder mass |
| 12/04/2008 | WO2008145804A2 Interference shielded electronics module and method for providing the same |
| 12/04/2008 | WO2008145425A1 Control device of a motor vehicle |
| 12/04/2008 | WO2008145229A2 Method for the treatment of flat substrates, and use of said method |
| 12/04/2008 | WO2008097574A3 Method for designing a leadless chip carrier |
| 12/04/2008 | US20080299862 Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same |
| 12/04/2008 | US20080299787 Light emitting diode module for lighting |
| 12/04/2008 | US20080299709 Metal core foldover package structures |
| 12/04/2008 | US20080299394 Coated metal particles |
| 12/04/2008 | US20080298031 Shaped integrated passives |
| 12/04/2008 | US20080298027 Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same |
| 12/04/2008 | US20080298023 Electronic component-containing module and manufacturing method thereof |
| 12/04/2008 | US20080298017 Counterflow microchannel cooler for integrated circuits |
| 12/04/2008 | US20080297978 Method for adjusting capacitance value of built-in capacitor in multilayer ceramic substrate, and multilayer ceramic substrate and method for manufacturing the same |
| 12/04/2008 | US20080296752 Substrate with pin, manufacturing method thereof, and semiconductor product |
| 12/04/2008 | US20080296599 LED Package with Stepped Aperture |
| 12/04/2008 | US20080296254 Multilayer wiring board for an electronic device |
| 12/04/2008 | US20080296165 Plating apparatus |
| 12/04/2008 | US20080296056 Printed circuit board, production method therefor, electronic-component carrier board using printed circuit board, and production method therefor |
| 12/04/2008 | US20080296055 Printed circuit board and method of fabricating the same |
| 12/04/2008 | US20080296054 High performance chip carrier substrate |
| 12/04/2008 | US20080296053 Electronic component module and method of manufacturing the same |
| 12/04/2008 | US20080296052 Multilayer printed wiring board |
| 12/04/2008 | US20080296047 Printed wiring board assembly, method of mounting components on printed wiring board and electronic apparatus |
| 12/04/2008 | US20080295329 Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias |
| 12/04/2008 | US20080295327 Flexible circuit |
| 12/04/2008 | US20080295326 Manufacture of a Layer Including a Component |
| 12/04/2008 | US20080295325 Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias |
| 12/04/2008 | US20080295318 Method and Device for Continuously Producing Electronic Film Components and an Electronic Film Component |
| 12/04/2008 | DE10336517B4 Verbindungsstruktur zwischen Busschienen und Relaisanschlüssen Connecting structure between busbars and relay terminals |
| 12/04/2008 | DE102007025018A1 Method for production of fine structures, microstructures and complex micro-systems, involves representing layer over material, and topology of another layer which is under former layer is adapted by sharpening process |
| 12/04/2008 | DE102007025010A1 Stator for electrical machine, particularly universal motor, has cross section extension, longitudinal extension and jacket surface |
| 12/04/2008 | DE102007024290A1 Verfahren zur Herstellung eines Substrats A method for producing a substrate |
| 12/04/2008 | CA2688334A1 Interference shielded electronics module and method for providing the same |
| 12/03/2008 | EP1998603A1 Multilayer printed-circuit board, and its parts mounting method |
| 12/03/2008 | EP1998602A2 Electrical contacts |
| 12/03/2008 | EP1998217A2 Liquid crystal module |
| 12/03/2008 | EP1997843A1 Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film |
| 12/03/2008 | EP1997115A1 Ceramic component element and ceramic component and method for the same |
| 12/03/2008 | EP1537767B1 Shielding for emi-endangered electronic components and/or circuits of electronic devices |
| 12/03/2008 | EP1302094B1 Method for producing an electrical and/or mechanical connection between flexible thin-film substrates |
| 12/03/2008 | CN201160071Y Glue dropping product and glue dropping apparatus |
| 12/03/2008 | CN201159879Y Keyboard |
| 12/03/2008 | CN201159235Y Novel nut positioning structure |
| 12/03/2008 | CN101317501A Soldering method, semiconductor module manufacturing method and soldering apparatus |
| 12/03/2008 | CN101317500A Production method of substrate remaining member for wiring plate, production method of intermediate material for wiring board and wiring board |
| 12/03/2008 | CN101316503A Material member control system and method |
| 12/03/2008 | CN101316485A Electronic component module and method of manufacturing the same |
| 12/03/2008 | CN101316484A Electronic device and manufacturing method of electronic device |
| 12/03/2008 | CN101316483A Hole drilling calibration method for printed circuit board |
| 12/03/2008 | CN101316482A Printed circuit board, printed circuit board manufacturing method and electronic device |
| 12/03/2008 | CN101316481A Electronic assembly body and production method thereof |
| 12/03/2008 | CN101316479A Circuit board and production method thereof |
| 12/03/2008 | CN101316476A Printed circuit board |
| 12/03/2008 | CN101316475A Stereo graphic pattern structure of circuit board and technique thereof |
| 12/03/2008 | CN101316001A Method for producing radio frequency label antenna, and radio frequency label antenna and label |
| 12/03/2008 | CN101316000A Production method and structure of antenna apparatus |
| 12/03/2008 | CN101315925A Electronic component-containing module and manufacturing method thereof |
| 12/03/2008 | CN101315918A Semiconductor device and method of manufacturing the same |
| 12/03/2008 | CN101315917A Wiring board and its fabricating method |
| 12/03/2008 | CN101315899A Production method of label type integration circuit soft plate and structure thereof |
| 12/03/2008 | CN101314193A Processing apparatus |
| 12/03/2008 | CN100441079C Stripping striking flake for suppressing feeding material tilting piece |
| 12/03/2008 | CN100441078C Method for transporting circuit board to tin furnace transmission line and its automatic transfer-machine |
| 12/03/2008 | CN100441074C Multi-layer integrated circuit package |
| 12/03/2008 | CN100441073C Multi-layer circuit board and manufacturing method thereof |
| 12/03/2008 | CN100441072C Electronic device for supplying power source and noise filter which having high-efficient noise reducing |
| 12/03/2008 | CN100441071C High-density BGA printed circuit board wiring method |
| 12/03/2008 | CN100441070C Jetting device and method at a jetting device |
| 12/03/2008 | CN100441069C Electronic component package and packaging method |
| 12/03/2008 | CN100441068C Latching micro magnetic relay packages and methods of packaging |
| 12/03/2008 | CN100441067C An electromagnetic interference suppressive ground wiring method |
| 12/03/2008 | CN100440580C Thermal treatment, layout pattern forming method, photoelectric device and its manufacture |
| 12/03/2008 | CN100440500C Printed wiring board, method for manufacturing same, lead frame package and optical module |