| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/10/2009 | US7489914 Multi-band RF transceiver with passive reuse in organic substrates |
| 02/10/2009 | US7489524 Assembly including vertical and horizontal joined circuit panels |
| 02/10/2009 | US7489521 Multilayer printed wiring board |
| 02/10/2009 | US7489520 Printed circuit board and liquid crystal display device having the same |
| 02/10/2009 | US7489518 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 02/10/2009 | US7489493 Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material |
| 02/10/2009 | US7489382 Liquid crystal display module |
| 02/10/2009 | US7488899 Compliant contact pin assembly and card system |
| 02/10/2009 | US7488895 Method for manufacturing component built-in module, and component built-in module |
| 02/10/2009 | US7488894 Conductive film for transfer, method for forming transparent conductive film using same, and transparent conductive film |
| 02/10/2009 | US7488507 Capacitor with plasma deposited dielectric |
| 02/10/2009 | US7487587 Methods of producing a composite substrate |
| 02/10/2009 | US7487586 Process for producing semiconductor device |
| 02/10/2009 | US7487585 Method of manufacturing a metal-ceramic circuit board |
| 02/05/2009 | WO2009017928A2 Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board |
| 02/05/2009 | WO2009017870A1 Techniques for direct encasement of circuit board structures |
| 02/05/2009 | WO2009017200A1 Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material |
| 02/05/2009 | WO2009017051A1 Composite for multilayer circuit board |
| 02/05/2009 | WO2009017001A1 Circuit member connecting structure |
| 02/05/2009 | WO2009016952A1 Mold release film |
| 02/05/2009 | WO2009016862A1 Composite substrate, functional device utilizing the same, and process for producing them |
| 02/05/2009 | WO2009016698A1 Ceramic powder molding, ceramic burning product, and process for producing ceramic powder molding |
| 02/05/2009 | WO2009016445A1 Circuit board having two or more planar sections |
| 02/05/2009 | WO2008152629A3 Method for attaching smt stencil to a substrate |
| 02/05/2009 | US20090035957 Lead frame for circuit board |
| 02/05/2009 | US20090035542 Low temperature reactive composite joining |
| 02/05/2009 | US20090035455 Adhesive bleed prevention method and product produced from same |
| 02/05/2009 | US20090034222 Printed circuit board assembly and method of making a printed circuit board |
| 02/05/2009 | US20090034214 Circuit board and manufacturing method thereof |
| 02/05/2009 | US20090033443 Transmission line |
| 02/05/2009 | US20090032917 Lead frame package apparatus and method |
| 02/05/2009 | US20090032684 Optical device and production method thereof |
| 02/05/2009 | US20090032296 Method for manufacturing a contact arrangement between a microelectronic component and a carrier substrate as well as an assembly unit manufactured by this method |
| 02/05/2009 | US20090032289 Circuit board having two or more planar sections |
| 02/05/2009 | US20090032287 metal foil is fixed onto an insulating resin composition is used as an electric power supply layer; slight roughening treatment; reliability and circuit formability are high, and conductor loss is extremely low; amino functional silane curing agent; peel strength; corrosion resistance |
| 02/05/2009 | US20090032285 Multi-layer circuit substrate manufacturing method and multi-layer circuit substrate |
| 02/05/2009 | US20090031563 Rearrangement sheet, semiconductor device and method of manufacturing thereof |
| 02/05/2009 | US20090031562 Tape feeder for component mounter providing stable tape feeding and method for mounting a component on a circuit board with component mounter |
| 02/05/2009 | US20090031561 Method for manufacturing printed circuit board |
| 02/05/2009 | US20090031559 Electronic component mounting apparatus and method of mounting electronic components |
| 02/05/2009 | DE19817359B4 Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung Ceramic multi-layer circuit, and process for their preparation |
| 02/05/2009 | DE102008034159A1 Elektronikbauelement und Verfahren zu seiner Herstellung An electronics device and process for its preparation |
| 02/05/2009 | DE102007038116A1 Haltemittel, Vorrichtung und Verfahren zum Transport von Substraten, insbesondere Leiterplatten Holding means, device and method for transporting substrates, particularly printed circuit boards |
| 02/05/2009 | DE102007035794A1 Printed circuit board arrangement for use as e.g. connection element, for electronic modules of electrical circuit, has printed circuit board free from through-hole technology module, and other board provided with technology modules |
| 02/05/2009 | DE102007034949A1 Einheitlich normierte Leistungspackages Uniformly normalized power packages |
| 02/05/2009 | DE102007030924A1 Plastic molded metallic strip conductor manufacturing method for e.g. battery sensor of vehicle, involves producing conductor, applying flame-pyrolytic coating of amorphous silicate layer on conductor, and molding conductor with plastic |
| 02/05/2009 | DE102007024290B4 Verfahren zur Herstellung eines Substrats A method for producing a substrate |
| 02/05/2009 | DE102007005824B4 Verbindungselement für eine doppelseitige Leiterplatte Connecting element for a double-sided printed circuit board |
| 02/04/2009 | EP2020836A1 Circuit board connection structure and plasma display apparatus including the same |
| 02/04/2009 | EP2020835A2 A circuit board |
| 02/04/2009 | EP2020834A2 Printed product with electrically functional layer |
| 02/04/2009 | EP2020833A1 Manufacturing method for a semi-flexible printed circuit, board used for such a process, and related printed circuit and electrical device |
| 02/04/2009 | EP2020273A1 Object having through-hole formed therein and laser processing method |
| 02/04/2009 | CN201191962Y Micro heat exchange system used in reflux welding furnace heating zone |
| 02/04/2009 | CN201191942Y Simple apparatus facilitating circuit board operation |
| 02/04/2009 | CN201191941Y Load shifting apparatus for printed circuit board |
| 02/04/2009 | CN101361415A Three-dimensional circuit board and its manufacturing method |
| 02/04/2009 | CN101361414A Multilayer printed wiring board and method for manufacturing same |
| 02/04/2009 | CN101361413A Electronic components mounting adhesive and electronic components mounting structure |
| 02/04/2009 | CN101361412A Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic componen |
| 02/04/2009 | CN101361411A Chip member mounting construction, mounting method and electronic apparatus |
| 02/04/2009 | CN101361183A Integrated electronic device and cooling device for an integrated electronic device |
| 02/04/2009 | CN101361182A Interposer with built-in passive part |
| 02/04/2009 | CN101361141A Electroconductive ink |
| 02/04/2009 | CN101360399A Preparation apparatus and method for metallic layer circuit |
| 02/04/2009 | CN101360398A Circuit board construction of inner fovea type conductive column and preparation thereof |
| 02/04/2009 | CN101360397A Manufacturing method of hollowed-out PCB |
| 02/04/2009 | CN101360396A SMT network board adapter |
| 02/04/2009 | CN101360395A Circuit board leveling apparatus and method for leveling circuit board |
| 02/04/2009 | CN101360394A Printed wiring board structure and electronic apparatus |
| 02/04/2009 | CN101360393A Circuit board construction embedded with semi-conductor chip and preparation thereof |
| 02/04/2009 | CN101360388A Electricity connection terminal construction of circuit board and preparation thereof |
| 02/04/2009 | CN101360385A Printed circuit board and its manufacturing method |
| 02/04/2009 | CN101359654A Structure of semiconductor component-buried loading board and preparation thereof |
| 02/04/2009 | CN101359653A Memory module encapsulation construction and encapsulation method thereof |
| 02/04/2009 | CN101359639A Circuit board construction embedded with semi-conductor chip and preparation thereof |
| 02/04/2009 | CN101359601A Two-board-in-one processing method for substrate manufacture of printed circuit board or integrated circuit package |
| 02/04/2009 | CN101359188A Exposure apparatus of belt type workpiece and focusing regulation method thereof |
| 02/04/2009 | CN101359173A Method of manufacturing wiring circuit board |
| 02/04/2009 | CN101358050A Conductive pattern formation ink, conductive pattern and wiring substrate |
| 02/04/2009 | CN101357518A Adhesion layer on fluorinated polymers |
| 02/04/2009 | CN100459830C Intelligent double-sided wiring board making system |
| 02/04/2009 | CN100459829C Electronic device |
| 02/04/2009 | CN100459828C Printing circuit board |
| 02/04/2009 | CN100459827C Reflow soldering device |
| 02/04/2009 | CN100459826C Circuit board and process for producing the same |
| 02/04/2009 | CN100459825C Circuit board plug socket material equating method and equipment |
| 02/04/2009 | CN100459824C High-layer circuit board and its manufacturing method |
| 02/04/2009 | CN100459294C Connection device for flexible circuit |
| 02/04/2009 | CN100459191C Production method of circuit board for light emitting body, precursor of circuit board for light emitting body and circuit board for light emitting body |
| 02/04/2009 | CN100459114C Electric device for forming contact array on substrate |
| 02/04/2009 | CN100459110C Electronic part mounting substrate and semiconductor device |
| 02/04/2009 | CN100459085C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100459084C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100459083C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100459080C Installation method of electric components and device thereof |
| 02/04/2009 | CN100459079C Method of manufacturing wiring board |
| 02/04/2009 | CN100459078C Method for manufacturing substrate |
| 02/04/2009 | CN100459077C Method for manufacturing substrate |
| 02/04/2009 | CN100459068C Etchant, replenishment solution and method for producing copper wiring using the same |